CC
S
2300 Series Low Profile Card Edge Connector
.125[3.18] Contact Centers
Specifications
Insulator Material: Glass filled polyester, type PBT,
94 V-O, UL Rated.
Contact Material: Phosphor Bronze Alloy
Contact Plating: Gold and/or Tin over .000050” Nickel,
(See Contact Plating Options).
Current Rating:
3 amp at 30°C
Contact Resistance: Contact to Daughter Card:
10 m
Ω
Insulation Resistance: 5000 M
Ω
Dielectric Withstand Voltage: 1500 V AC
Daughter Board Insertion Force:
16 oz max. per contact pair
when tested with a .071” thick gage.
R
C
R
Recognized under the recognized component
Program of Underwriters Laboratories, Inc.
File Numbers: E146967 and E176234
Daughter Board Withdrawal Force:
1 oz min. per contact pair
when tested with a .054” thick gage.
PLEASE CONTACT ECS FOR DIMENSIONING
POLARIZING KEYS
P/N 23-PK2
.230 [5.84]
KEY IN BETWEEN CONTACTS
(ORDER SEPARATELY)
KEY REPLACES ONE PAIR OF CONTACTS
(ORDER SEPARATELY)
.175 [4.44]
.032 [.81]
.280 [7.11]
.200 [5.08]
.051 [1.30]
5.05 [12.83]
P/N 23-PK1
.103 [2.62]
CONSULT FACTORY FOR MOLDED IN KEY
WWW.ECSCONN.COM
.125[3.18] Contact Centers, Low Profile Card Edge
D
±.005[.13]
B
±.005[.13]
A
F
.125 [3.175] typ.
E
±.015[.38]
C
±.010[.25]
.265 [6.73]
.431 [10.95]
.245 [6.22]
Refer to Termination Type
Dimensions are in inch [mm]
TERMINATION TYPE
Eyelet Accepts 3-#26 AWG
.140 [3.56] Row Spacing
.125 [3.18]
.275 [6.98]
.225 [5.72]
.185 [4.70]
.007 [.18] thick
Overall plated only
.156 [3.96]
Letter B side
.140 [3.56]
.200 [5.08]
5
= Wide Dip Solder
.200 [5.08]
.185 [4.70]
.016 [.41] thick
1
= Eyelet
2
= Eyelet
3
= Right Angle
4
= Narrow Dip Solder
MOUNTING STYLE
0 .125 [3.18]
#4-40
0 .116 [2.95]
Clearance for
#4-40 screw
3
= Floating Bobbin
Ears Removed
.135 [3.43]
1
= Clearance Hole
2
= Threaded Insert
4
= No Mounting Ears
5
= Side Mounting
PART NUMBERING
23 XX
SERIES CODE
.125” [3.18] Contact Centers
XX
DX
XX
XXX
MODIFICATIONS
010
= Card Extender For .062”
[1.58] Thick PCB
NO. CONTACT PAIRS
01
-
60
TERMINATION TYPE
1
= Eyelet (.016 [.41] thick)
2
= Eyelet (.007 [.18] thick)
3
= Right Angle
4
= Narrow Dip Solder
5
= Wide Dip Solder
50µ” Nickel Underplate
PLATING
MATERIALS
Insulator / Contact
1
= Valox / Phosphor Bronze
2
= Valox / Beryllium Copper
3
= Ryton / Phosphor Bronze
CONTACT
10
= 10µ” Au
20
= 15µ” Au
30
= 30µ” Au
40
= 10µ” Au
50
= 15µ” Au
60
= 30µ” Au
MOUNTING STYLE
1
= Clearance Hole
2
= Threaded Insert
3
= Floating Bobbin
4
= No Mounting Ear
5
= Side Mounting
100µ” Sn
100µ” Sn
100µ” Sn
5µ” Au
5µ” Au
5µ” Au
TAIL
CONSULT FACTORY FOR CONNECTORS BUILT TO YOUR SPECIFICATION
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FPGA/CPLD
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