DS1609-35 datasheet, PDF - EEWORLD Datasheet

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DS1609-35: DescriptionMulti-Port SRAM, 256X8, 35ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24; Categorystorage storage; File Size189KB，7 Pages; ManufacturerMaxim; Websitehttps://www.maximintegrated.com/en.html

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DS1609-35 Overview

Multi-Port SRAM, 256X8, 35ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24

DS1609-35 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Maxim
Parts packaging code	DIP
package instruction	0.600 INCH, PLASTIC, DIP-24
Contacts	24
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	35 ns
Other features	MUX ADDRESS DATA LATCH
I/O type	COMMON
JESD-30 code	R-PDIP-T24
JESD-609 code	e0
length	31.75 mm
memory density	2048 bit
Memory IC Type	MULTI-PORT SRAM
memory width	8
Number of functions	1
Number of ports	2, (MUXED)
Number of terminals	24
word count	256 words
character code	256
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256X8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum standby current	0.0003 A
Minimum standby current	4.5 V
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
Base Number Matches	1

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DS1609-35 Related Products

	DS1609-35	DS1609S-35	DS1609N-50	DS1609N-35	DS1609SN-35
Description	Multi-Port SRAM, 256X8, 35ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24	Multi-Port SRAM, 256X8, 35ns, CMOS, PDSO24	Multi-Port SRAM, 256X8, 50ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24	Multi-Port SRAM, 256X8, 35ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24	Multi-Port SRAM, 256X8, 35ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Maxim	Maxim	Maxim	Maxim	Maxim
Parts packaging code	DIP	SOIC	DIP	DIP	SOIC
package instruction	0.600 INCH, PLASTIC, DIP-24	0.300 INCH, PLASTIC, SOIC-24	0.600 INCH, PLASTIC, DIP-24	0.600 INCH, PLASTIC, DIP-24	0.300 INCH, PLASTIC, SOIC-24
Contacts	24	24	24	24	24
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	35 ns	35 ns	-	-	35 ns
Other features	MUX ADDRESS DATA LATCH	MUX ADDRESS DATA LATCH	-	-	MUX ADDRESS DATA LATCH
I/O type	COMMON	COMMON	-	-	COMMON
JESD-30 code	R-PDIP-T24	R-PDSO-G24	-	-	R-PDSO-G24
JESD-609 code	e0	e0	-	-	e0
length	31.75 mm	15.4 mm	-	-	15.4 mm
memory density	2048 bit	2048 bit	-	-	2048 bit
Memory IC Type	MULTI-PORT SRAM	MULTI-PORT SRAM	-	-	MULTI-PORT SRAM
memory width	8	8	-	-	8
Number of functions	1	1	-	-	1
Number of ports	2, (MUXED)	2, (MUXED)	-	-	2, (MUXED)
Number of terminals	24	24	-	-	24
word count	256 words	256 words	-	-	256 words
character code	256	256	-	-	256
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	-	-	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	-	-	85 °C
organize	256X8	256X8	-	-	256X8
Output characteristics	3-STATE	3-STATE	-	-	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY
encapsulated code	DIP	SOP	-	-	SOP
Encapsulate equivalent code	DIP24,.6	SOP24,.4	-	-	SOP24,.4
Package shape	RECTANGULAR	RECTANGULAR	-	-	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	-	-	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	-	-	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	240	-	-	240
power supply	5 V	5 V	-	-	5 V
Certification status	Not Qualified	Not Qualified	-	-	Not Qualified
Maximum seat height	5.08 mm	2.65 mm	-	-	2.65 mm
Maximum standby current	0.0003 A	0.0003 A	-	-	0.0003 A
Minimum standby current	4.5 V	4.5 V	-	-	4.5 V
Maximum slew rate	0.03 mA	0.03 mA	-	-	0.03 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	-	-	5.5 V
Minimum supply voltage (Vsup)	2.5 V	2.5 V	-	-	2.5 V
Nominal supply voltage (Vsup)	5 V	5 V	-	-	5 V
surface mount	NO	YES	-	-	YES
technology	CMOS	CMOS	-	-	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	-	-	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	-	-	GULL WING
Terminal pitch	2.54 mm	1.27 mm	-	-	1.27 mm
Terminal location	DUAL	DUAL	-	-	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	-	-	NOT SPECIFIED
width	15.24 mm	7.5 mm	-	-	7.5 mm
Base Number Matches	1	1	1	-	-

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