Multi-Port SRAM, 256X8, 35ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Maxim |
| Parts packaging code | SOIC |
| package instruction | 0.300 INCH, PLASTIC, SOIC-24 |
| Contacts | 24 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 35 ns |
| Other features | MUX ADDRESS DATA LATCH |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-G24 |
| JESD-609 code | e0 |
| length | 15.4 mm |
| memory density | 2048 bit |
| Memory IC Type | MULTI-PORT SRAM |
| memory width | 8 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of ports | 2, (MUXED) |
| Number of terminals | 24 |
| word count | 256 words |
| character code | 256 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 256X8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP24,.4 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 2.65 mm |
| Maximum standby current | 0.0003 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.03 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.5 mm |
| DS1609SN-35 | DS1609S-35 | DS1609-35 | DS1609N-50 | DS1609N-35 | |
|---|---|---|---|---|---|
| Description | Multi-Port SRAM, 256X8, 35ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24 | Multi-Port SRAM, 256X8, 35ns, CMOS, PDSO24 | Multi-Port SRAM, 256X8, 35ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | Multi-Port SRAM, 256X8, 50ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | Multi-Port SRAM, 256X8, 35ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Maxim | Maxim | Maxim | Maxim | Maxim |
| Parts packaging code | SOIC | SOIC | DIP | DIP | DIP |
| package instruction | 0.300 INCH, PLASTIC, SOIC-24 | 0.300 INCH, PLASTIC, SOIC-24 | 0.600 INCH, PLASTIC, DIP-24 | 0.600 INCH, PLASTIC, DIP-24 | 0.600 INCH, PLASTIC, DIP-24 |
| Contacts | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 35 ns | 35 ns | 35 ns | - | - |
| Other features | MUX ADDRESS DATA LATCH | MUX ADDRESS DATA LATCH | MUX ADDRESS DATA LATCH | - | - |
| I/O type | COMMON | COMMON | COMMON | - | - |
| JESD-30 code | R-PDSO-G24 | R-PDSO-G24 | R-PDIP-T24 | - | - |
| JESD-609 code | e0 | e0 | e0 | - | - |
| length | 15.4 mm | 15.4 mm | 31.75 mm | - | - |
| memory density | 2048 bit | 2048 bit | 2048 bit | - | - |
| Memory IC Type | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | - | - |
| memory width | 8 | 8 | 8 | - | - |
| Number of functions | 1 | 1 | 1 | - | - |
| Number of ports | 2, (MUXED) | 2, (MUXED) | 2, (MUXED) | - | - |
| Number of terminals | 24 | 24 | 24 | - | - |
| word count | 256 words | 256 words | 256 words | - | - |
| character code | 256 | 256 | 256 | - | - |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | - |
| Maximum operating temperature | 85 °C | 70 °C | 70 °C | - | - |
| organize | 256X8 | 256X8 | 256X8 | - | - |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | - | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| encapsulated code | SOP | SOP | DIP | - | - |
| Encapsulate equivalent code | SOP24,.4 | SOP24,.4 | DIP24,.6 | - | - |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
| Package form | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | - | - |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | - | - |
| Peak Reflow Temperature (Celsius) | 240 | 240 | NOT SPECIFIED | - | - |
| power supply | 5 V | 5 V | 5 V | - | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | - |
| Maximum seat height | 2.65 mm | 2.65 mm | 5.08 mm | - | - |
| Maximum standby current | 0.0003 A | 0.0003 A | 0.0003 A | - | - |
| Minimum standby current | 4.5 V | 4.5 V | 4.5 V | - | - |
| Maximum slew rate | 0.03 mA | 0.03 mA | 0.03 mA | - | - |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | - |
| Minimum supply voltage (Vsup) | 2.5 V | 2.5 V | 2.5 V | - | - |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | - | - |
| surface mount | YES | YES | NO | - | - |
| technology | CMOS | CMOS | CMOS | - | - |
| Temperature level | INDUSTRIAL | COMMERCIAL | COMMERCIAL | - | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
| Terminal form | GULL WING | GULL WING | THROUGH-HOLE | - | - |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | - | - |
| Terminal location | DUAL | DUAL | DUAL | - | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| width | 7.5 mm | 7.5 mm | 15.24 mm | - | - |
| Base Number Matches | - | 1 | 1 | 1 | - |
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