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390195-6 Product Details
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390195-6
T E I nternal N umber: 3 9 0 1 9 5 - 6
Product Highlights:
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DIMM 2P
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Gold Flash over Palladium Nickel or Gold (30) over
Nickel C ontact Mating Area Plating Material
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Number of Positions = 168
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DRAM Type = Non-Buffered
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DRAM Voltage = 3.3 V
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Obsolete
C ontact Product Information C enter
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Documentation & Additional Information
Product Drawings:
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None Available
Catalog Pages/Data Sheets:
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None Available
Product Specifications:
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None Available
Application Specifications:
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None Available
Instruction Sheets:
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None Available
CAD Files:
(C
AD Format & C ompression Information)
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2D Drawing
(DXF, Version D)
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3D Model
(IGES, Version D)
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3D Model
(STEP, Version D)
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Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
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Product Type = DIMM 2P
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Number of Positions
= 168
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DRAM Type
= Non-Buffered
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PC B Mount Style = Through Hole
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Module Orientation
= 25°
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PC B Retention Feature = Yes
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Profile = Low
Mechanical Attachment:
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C enter Retention Hole Diameter (mm [in])
= 2.40 [0.094]
Electrical Characteristics:
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DRAM Voltage
= 3.3 V
Termination Related Features:
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Termination Post Length (mm [in])
= 2.60 [0.102]
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Solder Tail C ontact Plating = Tin-Lead over Nickel
Body Related Features:
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Row-to-Row Spacing (mm [in])
= 1.60 [0.063]
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C enterline (mm [in])
= 1.27 [0.050]
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Number of Rows
= Dual
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Ejector Type = Standard
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Ejector Location
= Both Ends
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C enter Post = With
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Number of Keys
= 2
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PC B Retention Method = Boardlock(s)
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Mount Type = Printed C ircuit Board
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Module Key Type = Key1= Offset Right / Key2= C enter
Contact Related Features:
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C ontact Mating Area Plating Material = Gold Flash over Palladium
Nickel or Gold (30) over Nickel
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C ontact Base Material = Phosphor Bronze
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Retention Post(s) Location
= C enter
Housing Related Features:
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Housing Material = High Temperature Thermoplastic
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Housing C olor = Black
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Housing Flammability Rating = UL 94V-0
Configuration Related Features:
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Insertion Style
= Direct Insert
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C enter Key (mm [in]) = C enter
Industry Standards:
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RoHS/ELV C ompliance
= Not ELV/RoHS compliant
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Lead Free Solder Processes
= Wave solder capable to 240?C
Packaging Related Features:
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Packaging Method = Tray
Other:
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Brand = AMP
Additional Information:
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Product Line Information
Related Products:
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Tooling
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