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DSPIC30F2010C-I/SO-000

Description
16-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PDSO28, 0.300 INCH, PLASTIC, MS-013, SOIC-28
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size6MB,204 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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DSPIC30F2010C-I/SO-000 Overview

16-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PDSO28, 0.300 INCH, PLASTIC, MS-013, SOIC-28

DSPIC30F2010C-I/SO-000 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrochip
Parts packaging codeSOIC
package instructionSOP, SOP28,.4
Contacts28
Reach Compliance Codecompliant
ECCN code3A991.A.2
Has ADCYES
Address bus width
barrel shifterYES
bit size16
boundary scanNO
maximum clock frequency40 MHz
DAC channelNO
DMA channelNO
External data bus width
FormatFLOATING POINT
Integrated cacheNO
Internal bus architectureMULTIPLE
JESD-30 codeR-PDSO-G28
JESD-609 codee3
length17.87 mm
low power modeYES
Humidity sensitivity level1
Number of external interrupt devices3
Number of I/O lines20
Number of terminals28
Number of timers3
On-chip data RAM width8
On-chip program ROM width24
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP28,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
RAM (bytes)512
RAM (number of words)512
rom(word)4096
ROM programmabilityFLASH
Filter levelTS 16949
Maximum seat height2.64 mm
speed40 MHz
Maximum slew rate300 mA
Maximum supply voltage5.5 V
Minimum supply voltage2.5 V
Nominal supply voltage3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width7.49 mm
uPs/uCs/peripheral integrated circuit typeDIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches1
dsPIC30F2010
Data Sheet
28-pin High Performance
Digital Signal Controllers
2004 Microchip Technology Inc.
Advance Information
DS70118A

DSPIC30F2010C-I/SO-000 Related Products

DSPIC30F2010C-I/SO-000 DSPIC30F2010C-I/SP-000 DSPIC30F2010B-I/SO-000 DSPIC30F2010A-I/SO-000 DSPIC30F2010-E/SP DSPIC30F2010-E/SO DSPIC30F2010B-I/SP-000 DSPIC30F2010A-I/SP-000
Description 16-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PDSO28, 0.300 INCH, PLASTIC, MS-013, SOIC-28 16-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PDIP28, 0.300 INCH, PLASTIC, MO-095, DIP-28 16-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PDSO28, 0.300 INCH, PLASTIC, MS-013, SOIC-28 16-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PDSO28, 0.300 INCH, PLASTIC, MS-013, SOIC-28 16-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PDIP28, 0.300 INCH, PLASTIC, MO-095, DIP-28 16-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PDSO28, 0.300 INCH, PLASTIC, MS-013, SOIC-28 16-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PDIP28, 0.300 INCH, PLASTIC, MO-095, DIP-28 16-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PDIP28, 0.300 INCH, PLASTIC, MO-095, DIP-28
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to
Parts packaging code SOIC DIP SOIC SOIC DIP SOIC DIP DIP
package instruction SOP, SOP28,.4 SDIP-28 SOIC-28 SOP, SOP28,.4 DIP, DIP28,.3 SOP, SOP28,.4 DIP, DIP28,.3 SDIP-28
Contacts 28 28 28 28 28 28 28 28
Reach Compliance Code compliant compli compliant compliant compliant compliant compliant compliant
ECCN code 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2
Has ADC YES YES YES YES YES YES YES YES
barrel shifter YES YES YES YES YES YES YES YES
bit size 16 16 16 16 16 16 16 16
boundary scan NO NO NO NO NO NO NO NO
maximum clock frequency 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
DAC channel NO NO NO NO NO NO NO NO
DMA channel NO NO NO NO NO NO NO NO
Format FLOATING POINT FLOATING POINT FLOATING POINT FLOATING-POINT FLOATING-POINT FLOATING-POINT FLOATING POINT FLOATING POINT
Integrated cache NO NO NO NO NO NO NO NO
Internal bus architecture MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE
JESD-30 code R-PDSO-G28 R-PDIP-T28 R-PDSO-G28 R-PDSO-G28 R-PDIP-T28 R-PDSO-G28 R-PDIP-T28 R-PDIP-T28
JESD-609 code e3 e3 e3 e3 e3 e3 e3 e3
length 17.87 mm 34.67 mm 17.87 mm 17.87 mm 34.67 mm 17.87 mm 34.67 mm 34.67 mm
low power mode YES YES YES YES YES YES YES YES
Number of external interrupt devices 3 3 3 3 3 3 3 3
Number of I/O lines 20 20 20 20 20 20 20 20
Number of terminals 28 28 28 28 28 28 28 28
Number of timers 3 3 3 3 3 3 3 3
On-chip data RAM width 8 8 8 8 8 8 8 8
On-chip program ROM width 24 24 24 24 24 24 24 24
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 125 °C 125 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
PWM channel YES YES YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP SOP SOP DIP SOP DIP DIP
Encapsulate equivalent code SOP28,.4 DIP28,.3 SOP28,.4 SOP28,.4 DIP28,.3 SOP28,.4 DIP28,.3 DIP28,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE IN-LINE IN-LINE
Peak Reflow Temperature (Celsius) 260 NOT SPECIFIED 260 260 NOT SPECIFIED 260 NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 512 512 512 512 512 512 512 512
RAM (number of words) 512 512 512 512 512 512 512 512
rom(word) 4096 4096 4096 4096 4096 4096 4096 4096
ROM programmability FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
Filter level TS 16949 TS 16949 TS 16949 TS 16949 TS 16949 TS 16949 TS 16949 TS 16949
Maximum seat height 2.64 mm 4.06 mm 2.64 mm 2.64 mm 4.06 mm 2.64 mm 4.06 mm 4.06 mm
speed 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
Maximum slew rate 300 mA 300 mA 300 mA 300 mA 300 mA 300 mA 300 mA 300 mA
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
Nominal supply voltage 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
surface mount YES NO YES YES NO YES NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL AUTOMOTIVE AUTOMOTIVE INDUSTRIAL INDUSTRIAL
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
Terminal form GULL WING THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 NOT SPECIFIED 40 40 NOT SPECIFIED 40 NOT SPECIFIED NOT SPECIFIED
width 7.49 mm 7.62 mm 7.49 mm 7.49 mm 7.62 mm 7.49 mm 7.62 mm 7.62 mm
uPs/uCs/peripheral integrated circuit type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Maker Microchip Microchip Microchip Microchip - - - Microchip
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