ISD1110X datasheet, PDF - EEWORLD Datasheet

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ISD1110X: DescriptionSpeech Synthesizer With RCDG, 10s, CMOS, DIE-28; CategoryAnalog mixed-signal IC Consumption circuit; File Size289KB，32 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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ISD1110X Overview

Speech Synthesizer With RCDG, 10s, CMOS, DIE-28

ISD1110X Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Winbond Electronics Corporation
Parts packaging code	DIE
package instruction	DIE,
Contacts	28
Reach Compliance Code	unknown
application	CAR STEREO; HANDSET; TRANSFORMER
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-XUUC-N28
JESD-609 code	e0
Number of functions	1
Number of terminals	28
On-chip memory type	EEPROM
Maximum operating temperature	50 °C
Minimum operating temperature
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum read time	10 s
Maximum supply voltage (Vsup)	6.5 V
Minimum supply voltage (Vsup)	4.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal location	UPPER
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

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ISD1100 SERIES

SINGLE-CHIP,

VOICE RECORD / PLAYBACK DEVICES

10- AND 12-SECOND DURATION

-1-

Publication Release Date: April 25, 2006

Revision 1.2

ISD1100 SERIES

4. TABLE OF CONTENTS

1. GENERAL DESCRIPTION.................................................................................................................. 2

2. FEATURES ......................................................................................................................................... 2

3. BLOCK DIAGRAM............................................................................................................................... 3

4. TABLE OF CONTENTS ...................................................................................................................... 4

5. PIN CONFIGURATION ....................................................................................................................... 5

6. PIN DESCRIPTION ............................................................................................................................. 6

7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10

7.1. Detailed Description.................................................................................................................... 10

8. TIMING DIAGRAMS.......................................................................................................................... 12

9. ABSOLUTE MAXIMUM RATINGS

[1]

................................................................................................ 13

9.1 Operating Conditions ................................................................................................................... 14

10. ELECTRICAL CHARACTERISTICS ............................................................................................... 15

10.1. Parameters For Packaged Parts .............................................................................................. 15

10.1.1. Typical Parameter Variation with Voltage and Temperature ............................................. 18

10.2. Parameters For DIE.................................................................................................................. 19

10.2.1. Typical Parameter Variation with Voltage and Temperature ............................................. 22

11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 23

12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 26

12.1. 28-Lead 300mil Plastic Small Outline IC (SOIC) ...................................................................... 26

12.2. 28-Lead 600mil Plastic Dual Inline Package (PDIP) ................................................................ 27

12.3. Die Physical Layout

[1]

............................................................................................................... 28

13. ORDERING INFORMATION........................................................................................................... 30

14. VERSION HISTORY ....................................................................................................................... 31

-4-

ISD1110X Related Products

	ISD1110X	ISD1112SY	I1112PY	I1112P	I1112SY	I1112S	I1112X
Description	Speech Synthesizer With RCDG, 10s, CMOS, DIE-28	Speech Synthesizer With RCDG, 12s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28	Speech Synthesizer With RCDG, 12s, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28	Speech Synthesizer With RCDG, 12s, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	Speech Synthesizer With RCDG, 12s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28	Speech Synthesizer With RCDG, 12s, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28	Speech Synthesizer With RCDG, 12s, CMOS, DIE-25
Maker	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation
Parts packaging code	DIE	SOIC	DIP	DIP	SOIC	SOIC	DIE
package instruction	DIE,	SOP, SOP28,.4	DIP,	DIP,	SOP,	SOP,	DIE,
Contacts	28	28	28	28	28	28	25
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
application	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-XUUC-N28	R-PDSO-G28	R-PDIP-T28	R-PDIP-T28	R-PDSO-G28	R-PDSO-G28	R-XUUC-N25
Number of functions	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	25
On-chip memory type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
Maximum operating temperature	50 °C	70 °C	70 °C	70 °C	70 °C	70 °C	50 °C
Package body material	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED
encapsulated code	DIE	SOP	DIP	DIP	SOP	SOP	DIE
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	UNCASED CHIP
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum read time	10 s	12 s	12 s	12 s	12 s	12 s	12 s
Maximum supply voltage (Vsup)	6.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	6.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
surface mount	YES	YES	NO	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	NO LEAD
Terminal location	UPPER	DUAL	DUAL	DUAL	DUAL	DUAL	UPPER
length	-	17.93 mm	36.83 mm	36.83 mm	17.93 mm	17.93 mm	-
Maximum seat height	-	2.64 mm	4.83 mm	4.83 mm	2.64 mm	2.64 mm	-
Terminal pitch	-	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	-
width	-	7.52 mm	15.24 mm	15.24 mm	7.52 mm	7.52 mm	-

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