54FCT843BFMQR datasheet, PDF - EEWORLD Datasheet

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54FCT843BFMQR: DescriptionIC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,FP,24PIN,CERAMIC; Categorylogic logic; File Size56KB，1 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54FCT843BFMQR Overview

IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,FP,24PIN,CERAMIC

54FCT843BFMQR Parametric

Parameter Name	Attribute value
package instruction	DFP, FL24,.4
Reach Compliance Code	unknown
JESD-30 code	R-XDFP-F24
Logic integrated circuit type	D LATCH
MaximumI(ol)	0.032 A
Number of digits	9
Number of functions	1
Number of terminals	24
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL24,.4
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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Description	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,FP,24PIN,CERAMIC	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,LLCC,28PIN,CERAMIC	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,FP,24PIN,CERAMIC	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,DIP,24PIN,CERAMIC	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,DIP,24PIN,CERAMIC	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,LLCC,28PIN,CERAMIC	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,DIP,24PIN,CERAMIC	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,DIP,24PIN,CERAMIC	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,DIP,24PIN,CERAMIC	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,FP,24PIN,CERAMIC
package instruction	DFP, FL24,.4	QCCN, LCC28,.45SQ	DFP, FL24,.4	DIP, DIP24,.3	DIP, DIP24,.3	QCCN, LCC28,.45SQ	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DFP, FL24,.4
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDFP-F24	S-XQCC-N28	R-XDFP-F24	R-XDIP-T24	R-XDIP-T24	S-XQCC-N28	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDFP-F24
Logic integrated circuit type	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH
MaximumI(ol)	0.032 A	0.032 A	0.032 A	0.032 A	0.032 A	0.032 A	0.048 A	0.048 A	0.048 A	0.048 A
Number of digits	9	9	9	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	24	28	24	24	24	28	24	24	24	24
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	70 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-	-	-	-
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DFP	QCCN	DFP	DIP	DIP	QCCN	DIP	DIP	DIP	DFP
Encapsulate equivalent code	FL24,.4	LCC28,.45SQ	FL24,.4	DIP24,.3	DIP24,.3	LCC28,.45SQ	DIP24,.3	DIP24,.3	DIP24,.3	FL24,.4
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	CHIP CARRIER	FLATPACK	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	FLATPACK
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	NO	NO	YES	NO	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	FLAT	NO LEAD	FLAT	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1	1	1	-

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