74FCT843ADCX datasheet, PDF - EEWORLD Datasheet

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74FCT843ADCX: DescriptionIC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,DIP,24PIN,CERAMIC; Categorylogic; File Size56KB，1 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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74FCT843ADCX Overview

IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,DIP,24PIN,CERAMIC

74FCT843ADCX Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP24,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
Logic integrated circuit type	D LATCH
MaximumI(ol)	0.048 A
Number of digits	9
Number of functions	1
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
method of packing	TAPE AND REEL
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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Description	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,DIP,24PIN,CERAMIC	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,LLCC,28PIN,CERAMIC	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,FP,24PIN,CERAMIC	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,DIP,24PIN,CERAMIC	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,FP,24PIN,CERAMIC	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,DIP,24PIN,CERAMIC	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,LLCC,28PIN,CERAMIC	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,DIP,24PIN,CERAMIC	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,DIP,24PIN,CERAMIC	IC,LATCH,SINGLE,9-BIT,FCT/PCT-CMOS,FP,24PIN,CERAMIC
package instruction	DIP, DIP24,.3	QCCN, LCC28,.45SQ	DFP, FL24,.4	DIP, DIP24,.3	DFP, FL24,.4	DIP, DIP24,.3	QCCN, LCC28,.45SQ	DIP, DIP24,.3	DIP, DIP24,.3	DFP, FL24,.4
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T24	S-XQCC-N28	R-XDFP-F24	R-XDIP-T24	R-XDFP-F24	R-XDIP-T24	S-XQCC-N28	R-XDIP-T24	R-XDIP-T24	R-XDFP-F24
Logic integrated circuit type	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH
MaximumI(ol)	0.048 A	0.032 A	0.032 A	0.032 A	0.032 A	0.032 A	0.032 A	0.048 A	0.048 A	0.048 A
Number of digits	9	9	9	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	24	28	24	24	24	24	28	24	24	24
Maximum operating temperature	70 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-	-	-
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	QCCN	DFP	DIP	DFP	DIP	QCCN	DIP	DIP	DFP
Encapsulate equivalent code	DIP24,.3	LCC28,.45SQ	FL24,.4	DIP24,.3	FL24,.4	DIP24,.3	LCC28,.45SQ	DIP24,.3	DIP24,.3	FL24,.4
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	FLATPACK	IN-LINE	FLATPACK	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	FLATPACK
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO	YES	NO	YES	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	NO LEAD	FLAT	THROUGH-HOLE	FLAT	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	FLAT
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1	1	1	-

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