* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/
_
C from 65
_
to 125
_
C
Ceramic DIP: – 10 mW/
_
C from 100
_
to 125
_
C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
Vin = VCC or GND
6.0
±
0.1
±
1.0
±
1.0
µA
IOZ
Maximum Three–State Leakage Output in High–Impedance State
6.0
±
0.5
±
5.0
±
10
µA
Current
Vin = VIL or VIH
Vout = VCC or GND
ICC
Maximum Quiescent Supply
Vin = VCC or GND
6.0
8
80
160
µA
Current (per Package)
Iout = 0
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
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MAXIMUM RATINGS*
MOTOROLA
DC ELECTRICAL CHARACTERISTICS
(Voltages Referenced to GND)
RECOMMENDED OPERATING CONDITIONS
MC54/74HC367
Symbol
Vin, Vout
Symbol
Symbol
VCC
Vout
Tstg
ICC
Iout
VCC
Vin
PD
TL
VOH
tr, tf
Iin
VOL
TA
VIH
VIL
Iin
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP)
(Ceramic DIP)
Storage Temperature
Power Dissipation in Still Air, Plastic or Ceramic DIP†
DC Supply Current, VCC and GND Pins
DC Output Current, per Pin
DC Input Current, per Pin
DC Output Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Input Rise and Fall Time
(Figure 1)
Operating Temperature, All Package Types
DC Input Voltage, Output Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Maximum Input Leakage Current
Maximum Low–Level Output
Voltage
Minimum High–Level Output
Voltage
Maximum Low–Level Input
Voltage
Minimum High–Level Input
Voltage
Parameter
Parameter
Parameter
Vin = VIL
Vin = VIL
|Iout|
20
µA
Vin = VIH
Vin = VIH
|Iout|
20
µA
Vout = 0.1 V
|Iout|
20
µA
Vout = VCC – 0.1 V
|Iout|
20
µA
v
v
v
v
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
Test Conditions
– 0.5 to VCC + 0.5
– 1.5 to VCC + 1.5
|Iout|
|Iout|
|Iout|
|Iout|
– 65 to + 150
– 0.5 to + 7.0
2
– 55
Min
2.0
Value
v
6.0 mA
v
7.8 mA
v
6.0 mA
v
7.8 mA
0
0
0
0
±
75
±
35
±
20
260
300
750
+ 125
1000
500
400
VCC
Max
6.0
VCC
V
4.5
6.0
2.0
4.5
6.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
Unit
Unit
mW
mA
mA
mA
_
C
_
C
_
C
ns
V
V
V
V
V
– 55 to
25
_
C
1.5
3.15
4.2
0.26
0.26
3.98
5.48
0.1
0.1
0.1
1.9
4.4
5.9
0.3
0.9
1.2
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND (Vin or Vout) VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
Guaranteed Limit
v
85
_
C
v
125
_
C
High–Speed CMOS Logic Data
DL129 — Rev 6
1.5
3.15
4.2
0.33
0.33
3.84
5.34
0.1
0.1
0.1
1.9
4.4
5.9
0.3
0.9
1.2
v
1.5
3.15
4.2
0.40
0.40
3.70
5.20
1.9
4.4
5.9
0.3
0.9
1.2
0.1
0.1
0.1
v
Unit
V
V
V
V
MC54/74HC367
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
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Î
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Î
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Î
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Î
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Î
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Î
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Î Î Î Î Î
Î
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Î
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Î Î Î Î Î
Î
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Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î
Î Î
Î
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Î
Î Î
Î
AC ELECTRICAL CHARACTERISTICS
(CL = 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
Symbol
tPLH,
tPHL
tPLZ,
tPHZ
tPZL,
tPZH
Parameter
VCC
V
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
—
—
– 55 to
25
_
C
120
24
20
175
35
30
190
38
32
60
12
10
10
15
v
85
_
C
v
125
_
C
150
30
26
220
44
37
240
48
41
75
15
13
10
15
180
36
31
265
53
45
285
57
48
90
18
15
10
15
Unit
ns
Maximum Propagation Delay, Input A to Output Y
(Figures 1 and 3)
Maximum Propagation Delay, Output Enable to Output Y
(Figures 2 and 4)
Maximum Propagation Delay, Output Enable to Output Y
(Figures 2 and 4)
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
Maximum Input Capacitance
ns
ns
tTLH,
tTHL
Cin
ns
pF
pF
Cout
Maximum Three–State Output Capacitance
(Output in High–Impedance State)
NOTES:
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
CPD
Power Dissipation Capacitance (Per Buffer)*
40
pF
* Used to determine the no–load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
SWITCHING WAVEFORMS
VCC
tr
INPUT A
tPLH
OUTPUT Y
tTLH
90%
50%
10%
tTHL
90%
50%
10%
tPHL
tf
VCC
GND
OUTPUT Y
OUTPUT ENABLE
50%
GND
tPZL
50%
tPZH
OUTPUT Y
50%
tPHZ
10%
90%
tPLZ
HIGH
IMPEDANCE
VOL
VOH
HIGH
IMPEDANCE
Figure 1.
Figure 2.
TEST CIRCUITS
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
DEVICE
UNDER
TEST
TEST POINT
OUTPUT
1 kΩ
CONNECT TO VCC WHEN
TESTING tPLZ AND tPZL.
CONNECT TO GND WHEN
TESTING tPHZ AND tPZH.
CL*
CL*
* Includes all probe and jig capacitance
* Includes all probe and jig capacitance
Figure 3.
Figure 4.
High–Speed CMOS Logic Data
DL129 — Rev 6
3
MOTOROLA
MC54/74HC367
LOGIC DETAIL
TO OTHER
BUFFERS
ONE OF 6
BUFFERS
VCC
Y
A
OUTPUT ENABLE
MOTOROLA
4
High–Speed CMOS Logic Data
DL129 — Rev 6
MC54/74HC367
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC PACKAGE
CASE 620–10
ISSUE V
9
–A
–
16
1
8
–B
–
C
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIM F MAY NARROW TO 0.76 (0.030) WHERE
THE LEAD ENTERS THE CERAMIC BODY.
INCHES
MIN
MAX
0.750 0.785
0.240 0.295
—
0.200
0.015 0.020
0.050 BSC
0.055 0.065
0.100 BSC
0.008 0.015
0.125 0.170
0.300 BSC
15°
0°
0.020 0.040
MILLIMETERS
MIN
MAX
19.05 19.93
6.10
7.49
—
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
15°
0°
1.01
0.51
–T
SEATING
–
PLANE
N
E
F
G
D
16 PL
0.25 (0.010)
M
K
M
J
16 PL
0.25 (0.010)
M
T B
S
T A
S
DIM
A
B
C
D
E
F
G
J
K
L
M
N
–A
–
16
9
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ISSUE R
B
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
0.740 0.770 18.80 19.55
6.35
0.250 0.270
6.85
3.69
0.145 0.175
4.44
0.39
0.015 0.021
0.53
1.02
0.040 0.070
1.77
0.100 BSC
2.54 BSC
0.050 BSC
1.27 BSC
0.21
0.008 0.015
0.38
2.80
0.110 0.130
3.30
7.50
0.295 0.305
7.74
0°
0°
10°
10°
0.020 0.040
0.51
1.01
F
S
C
L
–T
–
H
G
D
16 PL
0.25 (0.010)
M
SEATING
PLANE
K
J
T A
M
M
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different
applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does
not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in
systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of
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unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
[i=s]This post was last edited by 1nnocet- on 2019-7-21 08:54[/i]《Basic Example 2 - PWM Control》
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With the rapid development of the national economy, lifting and hoisting operations are used more and more frequently and widely in various fields of economic construction. China has continuously expl...[Details]
Distributed Wireless Communication System (DWCS) uses distributed antennas, distributed processing control, joint signal processing and other technologies to improve the system's spectrum efficie...[Details]
For battery-powered portable devices, in addition to breaking through the limitations of processing power, the performance of portable system power supplies also needs to be continuously improved. ...[Details]
Microcontroller MCU
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