5. When mounted on 50.8mm x 50.8mm GETEK PCB with 25.4mm x 25.4mm 2oz copper pads. For better thermal performance, larger copper pad for
heat-sink is needed.
6. Stresses greater than the Absolute Maximum Ratings specified above may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions exceeding those indicated in this specification is not
implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor
devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices.
Electrical Characteristics
Symbol
V
IN_OUT
V
MIN
Parameter
Supply Voltage
(V
IN_OUT
= 10V, T
A
= +25° T
J
< +125 ° Unless Otherwise Noted.)
C,
C,
Test Condition
(Note 7)
Increase V
IN_OUT
(Note 8)
AL5890-10
AL5890-15
Min
7
2.5
9.0
13.5
18.5
28.0
38.0
-
-
-
-
-
-
-
Typ
-
5
10
15
20
30
40
1.5
3
6
0.3
6
0.1
+130
Max
400
7
11.0
16.5
21.5
32.0
42.0
-
-
-
-
-
-
-
%
%
µs
µs
µs
µs
°
C
mA
Unit
V
V
Minimum Power Up Voltage
I
IN_OUT
LED Current (Note 9)
AL5890-20
AL5890-30
AL5890-40
I
LINE
T
coeff
t
ON
t
OFF
t
R
t
F
T
FOLD
Note:
Line Regulation
Temperature Coefficient
Turn On Delay Time
Turn Off Delay Time
Rising Time
Falling Time
Thermal Foldback Junction
Temperature
V
IN_OUT
= 20V to 60V, 20mA current option
(Note 10)
-
-
-
-
Junction Temperature
7. DC power supply slew rate set at 10V/msec to avoid any excessive inrush current.
8. Apply the power supply voltage linearly to the chip until the device starts to turn on (output LED current reaches 5% of the desired current options).
The minimum power up voltage may vary with different current options.
9. Based on ATE trimmed accuracy at +25°C.
10. This parameter only guaranteed by design, not tested in production.
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