IC F/FAST SERIES, DUAL 4-INPUT NAND GATE, CDFP14, CERAMIC, FP-14, Gate
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DFP, FL14,.3 |
| Reach Compliance Code | unknown |
| series | F/FAST |
| JESD-30 code | R-GDFP-F14 |
| JESD-609 code | e0 |
| length | 9.614 mm |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.048 A |
| Number of functions | 2 |
| Number of entries | 4 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL14,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Maximum supply current (ICC) | 17 mA |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Filter level | 38535Q/M;38534H;883B |
| Maximum seat height | 2.032 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 6.35 mm |
| Base Number Matches | 1 |
| 54F40FMQB | 54F40DMQB | 74F40DC | 54F40LMQB | 74F40PC | 74F40SC | 74F40QC | |
|---|---|---|---|---|---|---|---|
| Description | IC F/FAST SERIES, DUAL 4-INPUT NAND GATE, CDFP14, CERAMIC, FP-14, Gate | IC F/FAST SERIES, DUAL 4-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14, Gate | IC F/FAST SERIES, DUAL 4-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14, Gate | IC F/FAST SERIES, DUAL 4-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20, Gate | IC F/FAST SERIES, DUAL 4-INPUT NAND GATE, PDIP14, PLASTIC, DIP-14, Gate | IC F/FAST SERIES, DUAL 4-INPUT NAND GATE, PDSO14, SOIC-14, Gate | IC,LOGIC GATE,DUAL 4-INPUT NAND,F-TTL,LDCC,20PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | compli |
| JESD-30 code | R-GDFP-F14 | R-GDIP-T14 | R-GDIP-T14 | S-CQCC-N20 | R-PDIP-T14 | R-PDSO-G14 | S-PQCC-J20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| MaximumI(ol) | 0.048 A | 0.048 A | 0.064 A | 0.048 A | 0.064 A | 0.064 A | 0.064 A |
| Number of terminals | 14 | 14 | 14 | 20 | 14 | 14 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DFP | DIP | DIP | QCCN | DIP | SOP | QCCJ |
| Encapsulate equivalent code | FL14,.3 | DIP14,.3 | DIP14,.3 | LCC20,.35SQ | DIP14,.3 | SOP14,.25 | LDCC20,.4SQ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | FLATPACK | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | SMALL OUTLINE | CHIP CARRIER |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum supply current (ICC) | 17 mA | 17 mA | 17 mA | 17 mA | 17 mA | 17 mA | 17 mA |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO | NO | NO | NO |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | YES | NO | YES | YES |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | GULL WING | J BEND |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | QUAD |
| package instruction | DFP, FL14,.3 | DIP, DIP14,.3 | CERAMIC, DIP-14 | CERAMIC, LCC-20 | DIP, DIP14,.3 | SOP, SOP14,.25 | - |
| series | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | - |
| length | 9.614 mm | 19.43 mm | 19.43 mm | 8.89 mm | 19.18 mm | 8.65 mm | - |
| Number of functions | 2 | 2 | 2 | 2 | 2 | 2 | - |
| Number of entries | 4 | 4 | 4 | 4 | 4 | 4 | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| Maximum seat height | 2.032 mm | 5.08 mm | 5.08 mm | 1.905 mm | 5.08 mm | 1.75 mm | - |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| width | 6.35 mm | 7.62 mm | 7.62 mm | 8.89 mm | 7.62 mm | 3.9 mm | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - |
| Maker | - | - | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |