5962-8855208TX datasheet, PDF - EEWORLD Datasheet

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5962-8855208TX: DescriptionStandard SRAM, 32KX8, 55ns, CMOS, CDFP28, CERAMIC, FP-28; Categorystorage storage; File Size143KB，26 Pages; ManufacturerEDI [Electronic devices inc.]

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5962-8855208TX Overview

Standard SRAM, 32KX8, 55ns, CMOS, CDFP28, CERAMIC, FP-28

5962-8855208TX Parametric

Parameter Name	Attribute value
Maker	EDI [Electronic devices inc.]
package instruction	DFP,
Reach Compliance Code	unknown
Maximum access time	55 ns
JESD-30 code	R-CDFP-F28
memory density	262144 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	32KX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal location	DUAL
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Redrawn with changes made under NOR No. 5962-R116-92 Revision

B and NOR No. 5962-R004-93 Revision C. Added vendor CAGE

numbers 65896 and OK6N4 to the drawing as sources of supply.

Added device types 10UX, 10YX, 11UX, 11YX, and 12UX, 12YX.

Removed vendor CAGE number OBYV4 from drawing as approved

source of supply. Removed vendor CAGE number 61772 as

approved source of supply for devices 01ZX, 02ZX, 03ZX, 05XX,

05YX, 05ZX, 05UX, 06ZX, 07XX, 07YX, 07ZX, 07UX, 08XX, 08YX,

08ZX, 08UX, 09XX, 09YX, 09ZX, and 09UX. Added vendor CAGE

61772 as a source of supply for devices 01MX, 01NX, 02MX, 02NX,

03MX, 03NX, 04NX, 04MX, 06MX, and 06NX. Remove vendor CAGE

34649 as a source of supply for devices 02XX, 02YX, 04XX, and

04YX. Editorial changes throughout.

Drawing updated to reflect current requirements. Editorial changes

throughout. - gap

Added device to cover 12 ns access time. Updated boilerplate,

editorial changes throughout.

ksr

Boilerplate update and part of five year review. tcr

DATE (YR-MO-DA)

94 – 01 – 04

APPROVED

M. A. Frye

00 – 10 – 12

02 – 08 – 16

07 – 11 – 01

Raymond Monnin

Robert M. Heber

THE FRONT PAGE OF THIS DRAWING HAS BEEN REPLACED

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Kenneth Rice

CHECKED BY

Ray Monnin

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS

AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

APPROVED BY

Michael A. Frye

DRAWING APPROVAL DATE

88-06-03

REVISION LEVEL

MICROCIRCUIT, MEMORY, DIGITAL,

CMOS, 32K X 8 STATIC RANDOM

ACCESS MEMORY (SRAM) LOW

POWER, MONOLITHIC SILICON

SIZE

SHEET

1 OF

5962-E026-08

CAGE CODE

67268

5962-88552

DSCC FORM 2233

APR 97

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN

class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing

(QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535

may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval

in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make

modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These

modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535

is required to identify when the QML flow option is used.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-PRF-38535, appendix A and herein.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Truth tables. The truth tables shall be as specified on figure 2.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as

specified in table I and shall apply over the full case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed

in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN

number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.

3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to

MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in

accordance with MIL-PRF-38535 to identify when the QML flow option is used.

3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an

approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to

listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,

appendix A and the requirements herein.

3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with

each lot of microcircuits delivered to this drawing.

3.8 Notification of change. Notification of change to DSCC-VA shall be for any change that affects this drawing.

3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's

facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the

reviewer.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-88552

SHEET

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