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DPS256X32V3-85M

Description
SRAM Module, 256KX32, 85ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
Categorystorage    storage   
File Size695KB,8 Pages
ManufacturerB&B Electronics Manufacturing Company
Download Datasheet Parametric View All

DPS256X32V3-85M Overview

SRAM Module, 256KX32, 85ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66

DPS256X32V3-85M Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerB&B Electronics Manufacturing Company
Parts packaging codePGA
package instructionPGA, PGA66,11X11
Contacts66
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time85 ns
Other featuresUSER CONFIGURABLE AS 1M X 8
Spare memory width16
I/O typeCOMMON
JESD-30 codeS-CPGA-P66
JESD-609 codee0
memory density8388608 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of ports1
Number of terminals66
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize256KX32
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Encapsulate equivalent codePGA66,11X11
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum seat height10.16 mm
Maximum standby current0.0028 A
Minimum standby current2 V
Maximum slew rate0.325 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Base Number Matches1
8 Megabit CMOS SRAM
DPS256X32V3
DESCRIPTION:
The DPS256X32V3 ‘’VERSA-STACK’’ module is a
revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers
(SLCC) mounted on a co-fired ceramic substrate. It offers 8
Megabits of SRAM in a package envelope of 1.09 x 1.09 x 0.40
inches.
The DPS256X32V3 contains eight individual 128K x 8
SRAMs, packaged in their own hermetically sealed SLCCs
making the module suitable for commercial, industrial and
military applications.
By using SLCCs, the ‘’Versa-Stack’’ family of modules offers a
higher board density of memory than available with
conventional through-hole, surface mount, module, or most
hybrid techniques.
FEATURES:
Organizations Available:
256K x 32, 512K x 16,
or 1024K x 8
Access Times:
70*, 85, 100, 120, 150ns
Fully Static Operation -
No clock or refresh required
Single +5V Power Supply,
±10%
Tolerance
TTL Compatible
Common Data Inputs
and Outputs
Low Data Retention Voltage:
2.0V min.
66-Pin PGA
‘’VERSA-STACK’’ Package
*
Commercial only.
FUNCTIONAL BLOCK DIAGRAM
PIN-OUT DIAGRAM
PIN NAMES
A0 - A16
I/O0 - I/O31
CE0 - CE7
SEL0, SEL1
WE0, WE1
OE
V
DD
V
SS
Address Inputs
Data Input/Output
Low Chip Enables
High Chip Enables
Write Enables
Output Enable
Power (+5V)
Ground
30A044-00
REV. E
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
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