EEWORLDEEWORLDEEWORLD

Part Number

Search

AT52BR6408AT

Description
64-Mbit Flash, 8-Mbit SRAM (x16 I/O)
File Size247KB,37 Pages
ManufacturerAtmel (Microchip)
Download Datasheet Compare View All

AT52BR6408AT Overview

64-Mbit Flash, 8-Mbit SRAM (x16 I/O)

Stack Module Features
64-Mbit Flash + 8-Mbit SRAM
Power Supply of 2.7V to 3.1V
Data I/O x16
66-ball CBGA Package
64-Mbit Flash Features
64-megabit (4M x 16) Flash Memory
2.7V - 3.1V Read/Write
High Performance
– Asynchronous Access Time – 70, 85 ns
Sector Erase Architecture
– Eight 4K Word Sectors with Individual Write Lockout
– 32K Word Main Sectors with Individual Write Lockout
Typical Sector Erase Time: 32K Word Sectors – 500 ms; 4K Word Sectors – 100 ms
64M, Four Plane Organization, Permitting Concurrent Read in Any of Three Planes not
Being Programmed/Erased
– Memory Plane A: 16M of Memory Including Eight 4K Word Sectors
– Memory Plane B: 16M of Memory Consisting of 32K Word Sectors
– Memory Plane C: 16M of Memory Consisting of 32K Word Sectors
– Memory Plane D: 16M of Memory Consisting of 32K Word Sectors
Suspend/Resume Feature for Erase and Program
– Supports Reading and Programming Data from Any Sector by Suspending Erase
of a Different Sector
– Supports Reading Any Word by Suspending Programming of Any Other Word
Low-power Operation
– 30 mA Active
– 10 µA Standby
1.8V I/O Option Reduces Overall System Power
Data Polling and Toggle Bit for End of Program Detection
VPP Pin for Write Protection and Accelerated Program/Erase Operations
RESET Input for Device Initialization
Top or Bottom Boot Block Configuration Available
128-bit Protection Register
Common Flash Interface (CFI)
64-Mbit Flash,
8-Mbit SRAM
(x16 I/O)
AT52BR6408A
AT52BR6408AT
Preliminary
8-Mbit SRAM Features
8-Mbit (512K x 16)
2.7V to 3.1V V
CC
Operation
70 ns Access Time
Low-power
– 2 mA Typical (Active)
– 1 µA Typical (Standby)
Industrial Temperature Range
Stack Module Description
The AT52BR6408A(T) consists of a 64-Mbit Flash stacked with an 8-Mbit SRAM in a
single CBGA package.
Stack Module Memory Contents
Device
AT52BR6408A(T)
Memory Combination
64M Flash + 8M SRAM
Flash Read Access
Asynchronous, Page Mode
Rev. 3425A–STKD–1/04
1

AT52BR6408AT Related Products

AT52BR6408AT AT52BR6408A-70CI AT52BR6408A-85CI HGL36125AA AT52BR6408AT-70CI
Description 64-Mbit Flash, 8-Mbit SRAM (x16 I/O) 64-Mbit Flash, 8-Mbit SRAM (x16 I/O) 64-Mbit Flash, 8-Mbit SRAM (x16 I/O) Circuit breaker, PowerPact H, thermal magnetic, 125A, 3 pole, 600V, 18kA, auxiliary switch 64-Mbit Flash, 8-Mbit SRAM (x16 I/O)
Is it Rohs certified? - incompatible incompatible - incompatible
Parts packaging code - BGA BGA - BGA
package instruction - TFBGA, TFBGA, - TFBGA,
Contacts - 66 66 - 66
Reach Compliance Code - compli compli - compli
Other features - SRAM IS ORGANIZED AS 512K X 16 SRAM IS ORGANIZED AS 512K X 16 - SRAM IS ORGANIZED AS 512K X 16
JESD-30 code - R-PBGA-B66 R-PBGA-B66 - R-PBGA-B66
JESD-609 code - e0 e0 - e0
length - 11 mm 11 mm - 11 mm
memory density - 67108864 bi 67108864 bi - 67108864 bi
Memory IC Type - MEMORY CIRCUIT MEMORY CIRCUIT - MEMORY CIRCUIT
memory width - 16 16 - 16
Number of functions - 1 1 - 1
Number of terminals - 66 66 - 66
word count - 4194304 words 4194304 words - 4194304 words
character code - 4000000 4000000 - 4000000
Operating mode - ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS
Maximum operating temperature - 85 °C 85 °C - 85 °C
Minimum operating temperature - -40 °C -40 °C - -40 °C
organize - 4MX16 4MX16 - 4MX16
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code - TFBGA TFBGA - TFBGA
Package shape - RECTANGULAR RECTANGULAR - RECTANGULAR
Package form - GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH - GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) - 240 240 - 240
Certification status - Not Qualified Not Qualified - Not Qualified
Maximum seat height - 1.2 mm 1.2 mm - 1.2 mm
Maximum supply voltage (Vsup) - 3.1 V 3.1 V - 3.1 V
Minimum supply voltage (Vsup) - 2.7 V 2.7 V - 2.7 V
Nominal supply voltage (Vsup) - 3 V 3 V - 3 V
surface mount - YES YES - YES
technology - CMOS CMOS - CMOS
Temperature level - INDUSTRIAL INDUSTRIAL - INDUSTRIAL
Terminal surface - TIN LEAD TIN LEAD - TIN LEAD
Terminal form - BALL BALL - BALL
Terminal pitch - 0.8 mm 0.8 mm - 0.8 mm
Terminal location - BOTTOM BOTTOM - BOTTOM
Maximum time at peak reflow temperature - 30 30 - 30
width - 8 mm 8 mm - 8 mm
Base Number Matches - 1 1 - 1

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2897  1592  2202  568  2766  59  33  45  12  56 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号