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AT52BR6408AT-70CI

Description
64-Mbit Flash, 8-Mbit SRAM (x16 I/O)
Categorystorage    storage   
File Size247KB,37 Pages
ManufacturerAtmel (Microchip)
Download Datasheet Parametric Compare View All

AT52BR6408AT-70CI Overview

64-Mbit Flash, 8-Mbit SRAM (x16 I/O)

AT52BR6408AT-70CI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeBGA
package instructionTFBGA,
Contacts66
Reach Compliance Codecompli
Other featuresSRAM IS ORGANIZED AS 512K X 16
JESD-30 codeR-PBGA-B66
JESD-609 codee0
length11 mm
memory density67108864 bi
Memory IC TypeMEMORY CIRCUIT
memory width16
Number of functions1
Number of terminals66
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize4MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)240
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.1 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width8 mm
Base Number Matches1
Stack Module Features
64-Mbit Flash + 8-Mbit SRAM
Power Supply of 2.7V to 3.1V
Data I/O x16
66-ball CBGA Package
64-Mbit Flash Features
64-megabit (4M x 16) Flash Memory
2.7V - 3.1V Read/Write
High Performance
– Asynchronous Access Time – 70, 85 ns
Sector Erase Architecture
– Eight 4K Word Sectors with Individual Write Lockout
– 32K Word Main Sectors with Individual Write Lockout
Typical Sector Erase Time: 32K Word Sectors – 500 ms; 4K Word Sectors – 100 ms
64M, Four Plane Organization, Permitting Concurrent Read in Any of Three Planes not
Being Programmed/Erased
– Memory Plane A: 16M of Memory Including Eight 4K Word Sectors
– Memory Plane B: 16M of Memory Consisting of 32K Word Sectors
– Memory Plane C: 16M of Memory Consisting of 32K Word Sectors
– Memory Plane D: 16M of Memory Consisting of 32K Word Sectors
Suspend/Resume Feature for Erase and Program
– Supports Reading and Programming Data from Any Sector by Suspending Erase
of a Different Sector
– Supports Reading Any Word by Suspending Programming of Any Other Word
Low-power Operation
– 30 mA Active
– 10 µA Standby
1.8V I/O Option Reduces Overall System Power
Data Polling and Toggle Bit for End of Program Detection
VPP Pin for Write Protection and Accelerated Program/Erase Operations
RESET Input for Device Initialization
Top or Bottom Boot Block Configuration Available
128-bit Protection Register
Common Flash Interface (CFI)
64-Mbit Flash,
8-Mbit SRAM
(x16 I/O)
AT52BR6408A
AT52BR6408AT
Preliminary
8-Mbit SRAM Features
8-Mbit (512K x 16)
2.7V to 3.1V V
CC
Operation
70 ns Access Time
Low-power
– 2 mA Typical (Active)
– 1 µA Typical (Standby)
Industrial Temperature Range
Stack Module Description
The AT52BR6408A(T) consists of a 64-Mbit Flash stacked with an 8-Mbit SRAM in a
single CBGA package.
Stack Module Memory Contents
Device
AT52BR6408A(T)
Memory Combination
64M Flash + 8M SRAM
Flash Read Access
Asynchronous, Page Mode
Rev. 3425A–STKD–1/04
1

AT52BR6408AT-70CI Related Products

AT52BR6408AT-70CI AT52BR6408A-70CI AT52BR6408A-85CI AT52BR6408AT HGL36125AA
Description 64-Mbit Flash, 8-Mbit SRAM (x16 I/O) 64-Mbit Flash, 8-Mbit SRAM (x16 I/O) 64-Mbit Flash, 8-Mbit SRAM (x16 I/O) 64-Mbit Flash, 8-Mbit SRAM (x16 I/O) Circuit breaker, PowerPact H, thermal magnetic, 125A, 3 pole, 600V, 18kA, auxiliary switch
Is it Rohs certified? incompatible incompatible incompatible - -
Parts packaging code BGA BGA BGA - -
package instruction TFBGA, TFBGA, TFBGA, - -
Contacts 66 66 66 - -
Reach Compliance Code compli compli compli - -
Other features SRAM IS ORGANIZED AS 512K X 16 SRAM IS ORGANIZED AS 512K X 16 SRAM IS ORGANIZED AS 512K X 16 - -
JESD-30 code R-PBGA-B66 R-PBGA-B66 R-PBGA-B66 - -
JESD-609 code e0 e0 e0 - -
length 11 mm 11 mm 11 mm - -
memory density 67108864 bi 67108864 bi 67108864 bi - -
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT - -
memory width 16 16 16 - -
Number of functions 1 1 1 - -
Number of terminals 66 66 66 - -
word count 4194304 words 4194304 words 4194304 words - -
character code 4000000 4000000 4000000 - -
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS - -
Maximum operating temperature 85 °C 85 °C 85 °C - -
Minimum operating temperature -40 °C -40 °C -40 °C - -
organize 4MX16 4MX16 4MX16 - -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - -
encapsulated code TFBGA TFBGA TFBGA - -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR - -
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH - -
Peak Reflow Temperature (Celsius) 240 240 240 - -
Certification status Not Qualified Not Qualified Not Qualified - -
Maximum seat height 1.2 mm 1.2 mm 1.2 mm - -
Maximum supply voltage (Vsup) 3.1 V 3.1 V 3.1 V - -
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V - -
Nominal supply voltage (Vsup) 3 V 3 V 3 V - -
surface mount YES YES YES - -
technology CMOS CMOS CMOS - -
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL - -
Terminal surface TIN LEAD TIN LEAD TIN LEAD - -
Terminal form BALL BALL BALL - -
Terminal pitch 0.8 mm 0.8 mm 0.8 mm - -
Terminal location BOTTOM BOTTOM BOTTOM - -
Maximum time at peak reflow temperature 30 30 30 - -
width 8 mm 8 mm 8 mm - -
Base Number Matches 1 1 1 - -

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