IC,FLIP-FLOP,DUAL,J/K TYPE,CMOS, RAD HARD,DIP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | J-K FLIP-FLOP |
| MaximumI(ol) | 0.024 A |
| Number of functions | 2 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| method of packing | RAIL |
| power supply | 5 V |
| Prop。Delay @ Nom-Sup | 14 ns |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| total dose | 100k Rad(Si) V |
| Trigger type | POSITIVE EDGE |
| Base Number Matches | 1 |
| 54ACT109DMQB-RH | 54ACT109LMQB-RH | 54ACT109FMQB-RH | |
|---|---|---|---|
| Description | IC,FLIP-FLOP,DUAL,J/K TYPE,CMOS, RAD HARD,DIP,16PIN,CERAMIC | IC,FLIP-FLOP,DUAL,J/K TYPE,CMOS, RAD HARD,LLCC,20PIN,CERAMIC | IC,FLIP-FLOP,DUAL,J/K TYPE,CMOS, RAD HARD,FP,16PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP16,.3 | QCCN, LCC20,.35SQ | DFP, FL16,.3 |
| Reach Compliance Code | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T16 | S-XQCC-N20 | R-XDFP-F16 |
| JESD-609 code | e0 | e0 | e0 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP |
| MaximumI(ol) | 0.024 A | 0.024 A | 0.024 A |
| Number of functions | 2 | 2 | 2 |
| Number of terminals | 16 | 20 | 16 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | QCCN | DFP |
| Encapsulate equivalent code | DIP16,.3 | LCC20,.35SQ | FL16,.3 |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | FLATPACK |
| method of packing | RAIL | RAIL | RAIL |
| power supply | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 14 ns | 14 ns | 14 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | NO LEAD | FLAT |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL |
| total dose | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V |
| Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Base Number Matches | 1 | 1 | 1 |
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