54ACT109FMQB-RH datasheet, PDF

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54ACT109FMQB-RH: DescriptionIC,FLIP-FLOP,DUAL,J/K TYPE,CMOS, RAD HARD,FP,16PIN,CERAMIC; Categorylogic logic; File Size161KB，8 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54ACT109FMQB-RH Overview

IC,FLIP-FLOP,DUAL,J/K TYPE,CMOS, RAD HARD,FP,16PIN,CERAMIC

54ACT109FMQB-RH Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DFP, FL16,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDFP-F16
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	J-K FLIP-FLOP
MaximumI(ol)	0.024 A
Number of functions	2
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL16,.3
Package shape	RECTANGULAR
Package form	FLATPACK
method of packing	RAIL
power supply	5 V
Prop。Delay @ Nom-Sup	14 ns
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
total dose	100k Rad(Si) V
Trigger type	POSITIVE EDGE
Base Number Matches	1

54ACT109FMQB-RH Related Products

	54ACT109FMQB-RH	54ACT109LMQB-RH	54ACT109DMQB-RH
Description	IC,FLIP-FLOP,DUAL,J/K TYPE,CMOS, RAD HARD,FP,16PIN,CERAMIC	IC,FLIP-FLOP,DUAL,J/K TYPE,CMOS, RAD HARD,LLCC,20PIN,CERAMIC	IC,FLIP-FLOP,DUAL,J/K TYPE,CMOS, RAD HARD,DIP,16PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible
package instruction	DFP, FL16,.3	QCCN, LCC20,.35SQ	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown
JESD-30 code	R-XDFP-F16	S-XQCC-N20	R-XDIP-T16
JESD-609 code	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	50 pF
Logic integrated circuit type	J-K FLIP-FLOP	J-K FLIP-FLOP	J-K FLIP-FLOP
MaximumI(ol)	0.024 A	0.024 A	0.024 A
Number of functions	2	2	2
Number of terminals	16	20	16
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DFP	QCCN	DIP
Encapsulate equivalent code	FL16,.3	LCC20,.35SQ	DIP16,.3
Package shape	RECTANGULAR	SQUARE	RECTANGULAR
Package form	FLATPACK	CHIP CARRIER	IN-LINE
method of packing	RAIL	RAIL	RAIL
power supply	5 V	5 V	5 V
Prop。Delay @ Nom-Sup	14 ns	14 ns	14 ns
Certification status	Not Qualified	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	YES	YES	NO
technology	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	NO LEAD	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL
total dose	100k Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V
Trigger type	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE
Base Number Matches	1	1	1

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Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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