MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Triple Line Receiver
The MC10H116 is a functional/pinout duplication of the MC10116, with 100%
improvement in propagation delay and no increase in power– supply current.
•
Propagation Delay, 1.0 ns Typical
•
Power Dissipation 85 mW Typ/Pkg (same as MECL 10K)
•
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
•
Voltage Compensated
•
MECL 10K–Compatible
MAXIMUM RATINGS
Characteristic
Power Supply (VCC = 0)
Input Voltage (VCC = 0)
Output Current — Continuous
— Surge
Operating Temperature Range
Storage Temperature Range — Plastic
— Ceramic
Symbol
VEE
VI
Iout
TA
Tstg
Rating
–8.0 to 0
0 to VEE
50
100
0 to +75
–55 to +150
–55 to +165
Unit
Vdc
Vdc
mA
°C
°C
°C
MC10H116
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
D SUFFIX
PLASTIC SOIC
CASE 751B–05
FN SUFFIX
PLCC
CASE 775–02
LOGIC DIAGRAM
4
5
2
3
6
7
14
15
11
ELECTRICAL CHARACTERISTICS
(VEE = –5.2 V
±5%)
(2)
0°
Characteristic
Power Supply Current
Input Current High
Input Leakage Current
Reference Voltage
High Output Voltage
Low Output Voltage
High Input Voltage (1)
Low Input Voltage (1)
Common Mode
Range (3)
Input Sensitivity (4)
Symbol
IE
IinH
ICBO
VBB
VOH
VOL
VIH
VIL
VCMR
VPP
Min
—
—
—
–1.38
–1.02
–1.95
–1.17
–1.95
—
—
Max
23
150
1.5
–1.27
–0.84
–1.63
–0.84
–1.48
—
—
Min
—
—
—
–1.35
–0.98
–1.95
–1.13
–1.95
25°
Max
21
95
1.0
–1.25
–0.81
–1.63
–0.81
–1.48
Min
—
—
—
–1.31
–0.92
–1.95
–1.07
–1.95
—
—
75°
Max
23
95
1.0
–1.19
–0.735
–1.60
–0.735
–1.45
—
—
Unit
mA
µA
µA
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
mVPP
9
10
12
13
–2.85 to –0.8
150 typ
AC PARAMETERS
Propagation Delay
Rise Time
Fall Time
tpd
tr
tf
0.4
0.5
0.5
1.3
1.5
1.5
0.4
0.5
0.5
1.3
1.6
1.6
0.45
0.5
0.5
1.45
1.7
1.7
ns
ns
ns
NOTES:
1. When VBB is used as the reference voltage.
2. Each MECL 10H series circuit has been designed to meet the specifications shown in the test table, after thermal
equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse
air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts.
3. Differential input not to exceed 1.0 Vdc.
4. 150 mVp–p differential input required to obtain full logic swing on output.
VBB*
When input pin with
VCC1 = Pin 1
bubble goes positive
VCC2 = Pin 16
it’s respective output
VEE = Pin 8
pin with bubble goes
positive.
*VBB to be used to supply bias to the MC10H116 only
and bypassed (when used) with 0.01
µF
to 0.1
µF
capacitor to ground (0 V). VBB can source < 1.0 mA.
The MC10H116 is designed to be used in sensing
differential signals over long lines. The bias supply
(VBB) is made available to make the device useful as a
Schmitt trigger, or in other applications where a stable
reference voltage is necessary.
Active current sources provide these receivers with
excellent common–mode noise rejection. If any amplifi-
er in a package is not used, one input of that amplifier
must be connected to VBB to prevent unbalancing the
current–source bias network.
The MC10H116 does not have internal–input pull-
down resistors. This provides high impedance to the
amplifier input and facilitates differential connections.
Applications:
•
Low Level Receiver
•
Voltage Level
•
Schmitt Trigger
Interface
DIP PIN ASSIGNMENT
VCC1
AOUT
AOUT
AIN
AIN
BOUT
BOUT
VEE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VCC2
COUT
COUT
CIN
CIN
VBB
BIN
BIN
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
9/96
©
Motorola, Inc. 1996
2–219
REV 6
MC10H116
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
B
–N–
Y BRK
D
–L–
–M–
W
D
Z
0.007 (0.180)
M
T L–M
U
S
N
S
S
0.007 (0.180)
M
T L–M
N
S
20
1
X
V
VIEW D–D
G1
0.010 (0.250)
S
T L–M
S
N
S
A
Z
R
0.007 (0.180)
M
T L–M
0.007 (0.180)
M
T L–M
S
N
N
S
S
S
H
0.007 (0.180)
M
T L–M
S
N
S
C
E
0.004 (0.100)
G
G1
0.010 (0.250)
S
T L–M
J
–T–
SEATING
PLANE
K1
K
F
VIEW S
0.007 (0.180)
M
VIEW S
S
T L–M
S
N
S
N
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2
_
10
_
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2
_
10
_
7.88
8.38
1.02
–––
MOTOROLA
2–220
MECL Data
DL122 — Rev 6
MC10H116
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
9
–A–
16
–B–
1
8
C
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
DIM
A
B
C
D
E
F
G
H
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0
_
15
_
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0
_
15
_
0.51
1.01
–T–
SEATING
PLANE
N
E
F
D
G
16 PL
K
M
J
16 PL
0.25 (0.010)
M
M
T B
S
0.25 (0.010)
T A
S
–A–
16
9
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
B
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0
_
10
_
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0
_
10
_
0.51
1.01
F
S
C
L
–T–
H
G
D
16 PL
SEATING
PLANE
K
J
T A
M
M
0.25 (0.010)
M
MECL Data
DL122 — Rev 6
2–221
MOTOROLA
MC10H116
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0
_
7
_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0
_
7
_
0.229
0.244
0.010
0.019
16
9
–B–
1
8
P
8 PL
0.25 (0.010)
M
B
S
G
F
K
C
–T–
SEATING
PLANE
R
X 45
_
M
D
16 PL
M
J
0.25 (0.010)
T B
S
A
S
DIM
A
B
C
D
F
G
J
K
M
P
R
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
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◊
MOTOROLA
2–222
*MC10H116/D*
MC10H116/D
MECL Data
DL122 — Rev 6
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