IS61C64AH-25N datasheet, PDF - EEWORLD Datasheet

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IS61C64AH-25N: DescriptionStandard SRAM, 8KX8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28; Categorystorage storage; File Size201KB，7 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS61C64AH-25N Overview

Standard SRAM, 8KX8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28

IS61C64AH-25N Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Integrated Silicon Solution ( ISSI )
Parts packaging code	DIP
package instruction	0.300 INCH, PLASTIC, DIP-28
Contacts	28
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	25 ns
Other features	AUTOMATIC POWER-DOWN
I/O type	COMMON
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	35.306 mm
memory density	65536 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	28
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.572 mm
Maximum standby current	0.006 A
Minimum standby current	4.5 V
Maximum slew rate	0.11 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

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IS61C64AH-25N Related Products

	IS61C64AH-25N	IS61C64AH-12J	IS61C64AH-12N	IS61C64AH-25J
Description	Standard SRAM, 8KX8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	Standard SRAM, 8KX8, 12ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	Standard SRAM, 8KX8, 12ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	Standard SRAM, 8KX8, 25ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Parts packaging code	DIP	SOJ	DIP	SOJ
package instruction	0.300 INCH, PLASTIC, DIP-28	0.300 INCH, PLASTIC, SOJ-28	0.300 INCH, PLASTIC, DIP-28	0.300 INCH, PLASTIC, SOJ-28
Contacts	28	28	28	28
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	25 ns	12 ns	12 ns	25 ns
Other features	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDIP-T28	R-PDSO-J28	R-PDIP-T28	R-PDSO-J28
JESD-609 code	e0	e0	e0	e0
length	35.306 mm	18.161 mm	35.306 mm	18.161 mm
memory density	65536 bit	65536 bit	65536 bit	65536 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of ports	1	1	1	1
Number of terminals	28	28	28	28
word count	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	8KX8	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOJ	DIP	SOJ
Encapsulate equivalent code	DIP28,.3	SOJ28,.34	DIP28,.3	SOJ28,.34
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.572 mm	3.556 mm	4.572 mm	3.556 mm
Maximum standby current	0.006 A	0.01 A	0.01 A	0.006 A
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	0.11 mA	0.175 mA	0.175 mA	0.11 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	J BEND	THROUGH-HOLE	J BEND
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.59 mm	7.62 mm	7.59 mm
Base Number Matches	1	1	1	-

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