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345730-9

Description
SOCKET, DIP40, IC SOCKET
CategoryThe connector    socket   
File Size115KB,1 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Download Datasheet Parametric View All

345730-9 Overview

SOCKET, DIP40, IC SOCKET

345730-9 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTE Connectivity
Reach Compliance Codeunknown
ECCN codeEAR99
Contact to complete cooperationGOLD (30)
Contact completed and terminatedGOLD (10) OVER NICKEL
Contact materialNOT SPECIFIED
Device slot typeIC SOCKET
Type of equipment usedDIP40
Shell materialPLASTIC
JESD-609 codee4
Manufacturer's serial number345730
Number of contacts40
Base Number Matches1
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345730-9 Product Details
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DIP Sockets
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345730-9
T E I nternal N umber: 3 4 5 7 3 0 - 9
Product Highlights:
l
DIP Socket
l
Number of Positions = 40
l
Row-to-Row Spacing = 15.24 mm
l
Through Hole C ontact Termination Type
l
Mount Style = Vertical
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Documentation & Additional Information
Product Drawings:
l
None Available
Catalog Pages/Data Sheets:
l
None Available
Product Specifications:
l
None Available
Application Specifications:
l
None Available
Instruction Sheets:
l
None Available
CAD Files:
l
None Available
Additional Information:
l
Product Line Information
Related Products:
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Tooling
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
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Product Type
= DIP Socket
l
Number of Positions
= 40
l
Profile = Standard
l
Frame Style
= Open
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Leg Style
= Straight
Electrical Characteristics:
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Insulation Resistance (M?) = 10,000
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C ontact Resistance (m?) = 30
Termination Related Features:
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Termination Post Length (mm [in])
= 2.84 [0.112]
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Solder Tail C ontact Plating = Gold (10) over Nickel
Body Related Features:
l
Row-to-Row Spacing (mm [in])
= 15.24 [0.600]
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Mount Style
= Vertical
l
C enterline (mm [in])
= 2.54 [0.100]
Contact Related Features:
l
C ontact Termination Type
= Through Hole
l
C ontact Base Material
= Beryllium C opper
l
C ontact Mating Area Plating Material
= Gold (30)
l
C ontact Style
= Screw Machine
l
Mating C ontact Type
= Inner Spring
Configuration Related Features:
l
Height Above PC Board (mm [in])
= 2.80 [0.110]
Industry Standards:
l
RoHS/ELV C ompliance
= Not ELV/RoHS compliant
l
Lead Free Solder Processes
= Wave solder capable to 240?C
Conditions for Usage:
l
Temperature Range (?C ) = 105
Packaging Related Features:
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Packaging Method
= Tube
Other:
l
Brand = AMP
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