MBM29PL64LM10TN datasheet, PDF

Datasheet> All Categories > storage> storage> MBM29PL64LM10TN

MBM29PL64LM10TN: DescriptionFlash Memory 64 M (8M X 8/4M X 16) BIT; Categorystorage storage; File Size359KB，69 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

Download Datasheet Parametric Compare View All

MBM29PL64LM10TN Overview

Flash Memory 64 M (8M X 8/4M X 16) BIT

MBM29PL64LM10TN Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SPANSION
Parts packaging code	TSOP1
package instruction	PLASTIC, TSOP1-48
Contacts	48
Reach Compliance Code	compli
ECCN code	3A991.B.1.A
Maximum access time	100 ns
Spare memory width	8
JESD-30 code	R-PDSO-G48
JESD-609 code	e0
length	18.4 mm
memory density	67108864 bi
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	48
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-20 °C
organize	4MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
type	NOR TYPE
width	12 mm

Preview

Download Datasheet

View All

SPANSION Flash Memory

Data Sheet

September 2003

This document specifies SPANSION memory products that are now offered by both Advanced Micro Devices and

Fujitsu. Although the document is marked with the name of the company that originally developed the specification,

these products will be offered to customers of both AMD and Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a SPANSION

revisions will occur when appropriate, and changes will be noted in a revision summary.

product. Future routine

Continuity of Ordering Part Numbers

AMD and Fujitsu continue to support existing part numbers beginning with "Am" and "MBM". To order these

products, please use only the Ordering Part Numbers listed in this document.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about SPANSION

solutions.

memory

MBM29PL64LM

90/10

(Continued)

The standard MBM29PL64LM offers access times of 90 ns, allowing operation of high-speed microprocessors

without wait states. To eliminate bus contention the devices have separate chip enable (CE), write enable (WE),

and output enable (OE) controls.

The MBM29PL64LM supports command set compatible with JEDEC single-power-supply EEPROMS standard.

Commands are written into the command register. The register contents serve as input to an internal state-

machine which controls the erase and programming circuitry. Write cycles also internally latch addresses and

data needed for the programming and erase operations. Reading data out of the devices is similar to reading

from 5.0 V and 12.0 V Flash or EPROM devices.

The MBM29PL64LM is programmed by executing the program command sequence. This will invoke the Em-

bedded Program Algorithm

which is an internal algorithm that automatically times the program pulse widths

and verifies proper cell margin. Erase is accomplished by executing the erase command sequence. This will

invoke the Embedded Erase Algorithm

which is an internal algorithm that automatically preprograms the array

if it is not already programmed before executing the erase operation. During erase, the device automatically

times the erase pulse widths and verifies proper cell margin.

The device also features a sector erase architecture. The sector mode allows each sector to be erased and

reprogrammed without affecting other sectors. All sectors are erased when shipped from the factory.

The device features single 3.0 V power supply operation for both read and write functions. Internally generated

and regulated voltages are provided for the program and erase operations. A low V

detector automatically

inhibits write operations on the loss of power. The end of program or erase is detected by Data Polling of DQ

by the Toggle Bit feature on DQ

. Once the end of a program or erase cycle has been completed, the devices

internally return to the read mode.

Fujitsu Flash technology combines years of Flash memory manufacturing experience to produce the highest

levels of quality, reliability, and cost effectiveness. The devices electrically erase all bits within a sector simulta-

neously via hot-hole assisted erase. The words are programmed one word at a time using the EPROM program-

ming mechanism of hot electron injection.

MBM29PL64LM10TN Related Products

	MBM29PL64LM10TN	MBM29PL64LM	MBM29PL64LM10	MBM29PL64LM90TN	MBM29PL64LM90PCN	MBM29PL64LM90PBT	MBM29PL64LM10PCN	MBM29PL64LM10PBT	MBM29PL64LM90
Description	Flash Memory 64 M (8M X 8/4M X 16) BIT	Flash Memory 64 M (8M X 8/4M X 16) BIT	Flash Memory 64 M (8M X 8/4M X 16) BIT	Flash Memory 64 M (8M X 8/4M X 16) BIT	Flash Memory 64 M (8M X 8/4M X 16) BIT	Flash Memory 64 M (8M X 8/4M X 16) BIT	Flash Memory 64 M (8M X 8/4M X 16) BIT	Flash Memory 64 M (8M X 8/4M X 16) BIT	Flash Memory 64 M (8M X 8/4M X 16) BIT
Is it Rohs certified?	incompatible	-	-	incompatible	incompatible	incompatible	incompatible	incompatible	-
Parts packaging code	TSOP1	-	-	TSOP1	TSOP1	BGA	TSOP1	BGA	-
package instruction	PLASTIC, TSOP1-48	-	-	PLASTIC, TSOP1-48	PLASTIC, TSOP1-56	PLASTIC, FBGA-80	PLASTIC, TSOP1-56	TFBGA, BGA80,8X12,32	-
Contacts	48	-	-	48	56	80	56	80	-
Reach Compliance Code	compli	-	-	compli	compli	compli	compli	compli	-
ECCN code	3A991.B.1.A	-	-	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	-
Maximum access time	100 ns	-	-	90 ns	90 ns	90 ns	100 ns	100 ns	-
Spare memory width	8	-	-	8	8	8	8	8	-
JESD-30 code	R-PDSO-G48	-	-	R-PDSO-G48	R-PDSO-G56	R-PBGA-B80	R-PDSO-G56	R-PBGA-B80	-
JESD-609 code	e0	-	-	e0	e0	e0	e0	e0	-
length	18.4 mm	-	-	18.4 mm	18.4 mm	11 mm	18.4 mm	11 mm	-
memory density	67108864 bi	-	-	67108864 bi	67108864 bi	67108864 bi	67108864 bi	67108864 bi	-
Memory IC Type	FLASH	-	-	FLASH	FLASH	FLASH	FLASH	FLASH	-
memory width	16	-	-	16	16	16	16	16	-
Number of functions	1	-	-	1	1	1	1	1	-
Number of terminals	48	-	-	48	56	80	56	80	-
word count	4194304 words	-	-	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	-
character code	4000000	-	-	4000000	4000000	4000000	4000000	4000000	-
Operating mode	ASYNCHRONOUS	-	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-
Maximum operating temperature	85 °C	-	-	70 °C	70 °C	70 °C	85 °C	85 °C	-
Minimum operating temperature	-20 °C	-	-	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-
organize	4MX16	-	-	4MX16	4MX16	4MX16	4MX16	4MX16	-
Package body material	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	TSOP1	-	-	TSOP1	TSOP1	TFBGA	TSOP1	TFBGA	-
Package shape	RECTANGULAR	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	SMALL OUTLINE, THIN PROFILE	-	-	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH	-
Parallel/Serial	PARALLEL	-	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-
Peak Reflow Temperature (Celsius)	240	-	-	240	240	240	240	240	-
Programming voltage	3 V	-	-	3 V	3 V	3 V	3 V	3 V	-
Certification status	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Maximum seat height	1.2 mm	-	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	-
Maximum supply voltage (Vsup)	3.6 V	-	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	-
Minimum supply voltage (Vsup)	3 V	-	-	3 V	3 V	3 V	3 V	3 V	-
Nominal supply voltage (Vsup)	3.3 V	-	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	-
surface mount	YES	-	-	YES	YES	YES	YES	YES	-
technology	CMOS	-	-	CMOS	CMOS	CMOS	CMOS	CMOS	-
Temperature level	OTHER	-	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	OTHER	OTHER	-
Terminal surface	TIN LEAD	-	-	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	-
Terminal form	GULL WING	-	-	GULL WING	GULL WING	BALL	GULL WING	BALL	-
Terminal pitch	0.5 mm	-	-	0.5 mm	0.5 mm	0.8 mm	0.5 mm	0.8 mm	-
Terminal location	DUAL	-	-	DUAL	DUAL	BOTTOM	DUAL	BOTTOM	-
Maximum time at peak reflow temperature	30	-	-	30	30	30	30	30	-
type	NOR TYPE	-	-	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	-
width	12 mm	-	-	12 mm	14 mm	7 mm	14 mm	7 mm	-
Base Number Matches	-	-	-	1	1	1	1	1	-

Recommended Resources

Remote temperature sensing circuit diagram

How to connect EXB850 external circuit

Hefei Sunshine M series motor special frequency conversion output EPS

Triangle, Yuanling, gold CFXB type single lamp rice cooker circuit diagram

Optically isolated data acquisition system

Will a short circuit between 3.3V and GND in a microcontroller system burn the microcontroller?: If the 3.3V of the microcontroller chip is short-circuited to the ground, will the microcontroller burn out?After disconnecting the line connecting the power supply to the microcontroller, the other 3...; Aguilera Power technology

Want to learn microcontroller: I know a little bit about computers and electrical appliance repair. I want to learn microcontrollers, but I don't have any language skills. Can I learn by myself? Also, I saw on the website that I ne...; saturday Embedded System

Sun releases new ISA solution for consumer packaging manufacturers: At the RFID World exhibition held in Dallas in 2005, Sun Microsystems (NASDAQ; SUNW) released the latest RFID industry solution (ISA) developed for the manufacturing industry. It combines Sun's FID ex...; tmily RF/Wirelessly

Design of smart dormitory system based on Gizwits: Abstract: In order to meet the needs of college students for smart dormitories, a smart dormitory management system based on Gizwits Cloud is designed. The system is mainly composed of Arduino core bo...; z3512641347 Integrated technical exchanges

Inline instructions for TMS320C66x study notes: /********************************************************************************/ /* C6X.H v7.4.12 */ /********************************************************************************/ #include "vect...; fish001 DSP and ARM Processors

How to increase the power of this circuit diagram?: This is the circuit diagram of the wireless microphone...; boofeng2002 Analog electronics

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components