K1S161611B-FI700 datasheet, PDF

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K1S161611B-FI700: DescriptionPseudo Static RAM, 1MX16, 70ns, CMOS, PBGA48, 6 X 7 MM, 0.75 PITCH, FBGA-48; Categorystorage storage; File Size352KB，11 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K1S161611B-FI700 Overview

Pseudo Static RAM, 1MX16, 70ns, CMOS, PBGA48, 6 X 7 MM, 0.75 PITCH, FBGA-48

K1S161611B-FI700 Parametric

Parameter Name	Attribute value
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	6 X 7 MM, 0.75 PITCH, FBGA-48
Contacts	48
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	70 ns
JESD-30 code	R-PBGA-B48
length	7 mm
memory density	16777216 bit
Memory IC Type	PSEUDO STATIC RAM
memory width	16
Number of functions	1
Number of terminals	48
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	3.1 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	2.9 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
width	6 mm
Base Number Matches	1

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K1S161611B

Preliminary

UtRAM

16Mb (1M x 16 bit) UtRAM

INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND

IS SUBJECT TO CHANGE WITHOUT NOTICE.

NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS

OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN

SAMSUNG PRODUCTS OR TECHNOLOGY.

ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUAR-

ANTEE OR WARRANTY OF ANY KIND.

1. For updates or additional information about Samsung products, contact your nearest Samsung office.

2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar

applications where Product failure could result in loss of life or personal or physical harm, or any military or defense

application, or any governmental procurement to which special terms or provisions may apply.

* Samsung Electronics reserves the right to change products or specification without notice.

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Revision 0.1

February 2007

K1S161611B

Table of Contents

Preliminary

UtRAM

GENERAL DESCRIPTION...............................................................................................................................1

FEATURES ......................................................................................................................................................1

PRODUCT FAMILY..........................................................................................................................................1

POWER UP SEQUENCE.................................................................................................................................2

FUNCTIONAL DESCRIPTION .........................................................................................................................2

ABSOLUTE MAXIMUM RATINGS ...................................................................................................................3

RECOMMENDED DC OPERATING CONDITIONS.........................................................................................3

CAPACITANCE ................................................................................................................................................3

DC AND OPERATING CHARACTERISTICS...................................................................................................3

AC OPERATING CONDITIONS.......................................................................................................................4

AC CHARACTERISTICS..................................................................................................................................4

TIMING WAVEFORMS ....................................................................................................................................5

TIMING WAVEFORM OF READ CYCLE(1)...............................................................................................5

TIMING WAVEFORM OF READ CYCLE(2)...............................................................................................5

TIMING WAVEFORM OF WRITE CYCLE(1) ............................................................................................. 6

TIMING WAVEFORM OF WRITE CYCLE(2) ............................................................................................. 6

TIMING WAVEFORM OF WRITE CYCLE(3) ............................................................................................. 7

PACKAGE DIMENSION...................................................................................................................................8

48 BALL FINE PITCH BGA(0.75mm ball pitch).......................................................................................... 8

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Revision 0.1

February 2007

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