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AM29LV640DU12WHI

Description
Flash, 64MX16, 120ns, PBGA63, 11 X 12 MM, 0.80 MM PITCH, FBGA-63
Categorystorage    storage   
File Size764KB,52 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Download Datasheet Parametric View All

AM29LV640DU12WHI Overview

Flash, 64MX16, 120ns, PBGA63, 11 X 12 MM, 0.80 MM PITCH, FBGA-63

AM29LV640DU12WHI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSPANSION
Parts packaging codeBGA
package instruction11 X 12 MM, 0.80 MM PITCH, FBGA-63
Contacts63
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Maximum access time120 ns
startup blockBOTTOM/TOP
JESD-30 codeR-PBGA-B63
JESD-609 codee0
length12 mm
memory density1073741824 bit
Memory IC TypeFLASH
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals63
word count67108864 words
character code64000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
Programming voltage3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
typeNOR TYPE
width11 mm
Base Number Matches1
ADVANCE INFORMATION
Am29LV640DU/Am29LV641DU
64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only
Uniform Sector Flash Memory with VersatileI/O™ Control
DISTINCTIVE CHARACTERISTICS
s
Single power supply operation
— 2.7 to 3.6 volt read, erase, and program operations
s
VersatileI/O (V
IO
) control
— Output voltages generated and input voltages
tolerated on the device is determined by the voltage
on the V
IO
pin
s
High performance
— Access times as fast as 90 ns
s
Manufactured on 0.23 µm process technology
s
CFI (Common Flash Interface) compliant
— Provides device-specific information to the system,
allowing host software to easily reconfigure for
different Flash devices
s
SecSi (Secured Silicon) Sector region
— 128-word sector for permanent, secure identification
through an 8-word random Electronic Serial Number
— May be programmed and locked at the factory or by
the customer
— Accessible through a command sequence
s
Ultra low power consumption (typical values at 3.0 V,
5 MHz)
— 9 mA typical active read current
— 26 mA typical erase/program current
— 200 nA typical standby mode current
s
Flexible sector architecture
— One hundred twenty-eight 32 Kword sectors
s
Sector Protection
— A hardware method to lock a sector to prevent
program or erase operations within that sector
— Sectors can be locked in-system or via programming
equipment
— Temporary Sector Unprotect feature allows code
changes in previously locked sectors
s
Embedded Algorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Program algorithm automatically writes
and verifies data at specified addresses
s
Compatibility with JEDEC standards
— Pinout and software compatible with single-power
supply Flash
— Superior inadvertent write protection
s
Minimum 1 million erase cycle guarantee per sector
s
Package options
— 48-pin TSOP
— 56-pin SSOP
— 63-ball FBGA
s
Erase Suspend/Erase Resume
— Suspends an erase operation to read data from, or
program data to, a sector that is not being erased,
then resumes the erase operation
s
Data# Polling and toggle bits
— Provides a software method of detecting program or
erase operation completion
s
Unlock Bypass Program command
— Reduces overall programming time when issuing
multiple program command sequences
s
Ready/Busy# pin (RY/BY#) (FBGA package only)
— Provides a hardware method of detecting program or
erase cycle completion
s
Hardware reset pin (RESET#)
— Hardware method to reset the device for reading array
data
s
WP# pin (TSOP packages only)
— At V
IL
, protects the first or last 32 Kword sector,
regardless of sector protect/unprotect status
— At V
IH
, allows removal of sector protection
— An internal pull up to V
CC
is provided
s
ACC pin
— Accelerates programming time for higher throughput
during system production
s
Program and Erase Performance (V
HH
not applied to
the ACC input pin)
— Word program time: 11 µs typical
— Sector erase time: 0.7 s typical for each 32 Kword
sector
This document contains information on a product under development at Advanced Micro Devices. The information
is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed
product without notice.
Publication#
22366
Rev:
A
Amendment/+6
Issue Date:
September 28, 1999
Refer to AMD’s Website (www.amd.com) for the latest information.

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