IC ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, UUC20, DIE, Bus Driver/Transceiver
| Parameter Name | Attribute value |
| Maker | National Semiconductor(TI ) |
| package instruction | DIE, |
| Reach Compliance Code | unknown |
| series | ACT |
| JESD-30 code | R-XUUC-N20 |
| Logic integrated circuit type | BUS DRIVER |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of ports | 2 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | RECTANGULAR |
| Package form | UNCASED CHIP |
| propagation delay (tpd) | 11.5 ns |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Base Number Matches | 1 |
| 54ACTQ374MDA | 5962R9218901MRA | RF174-01RP1-01RP-2380 | 5962R9218901M2A | |
|---|---|---|---|---|
| Description | IC ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, UUC20, DIE, Bus Driver/Transceiver | IC ACT SERIES, OCTAL 1-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20, Bus Driver/Transceiver | Interconnection Device, LEAD FREE | IC ACT SERIES, OCTAL 1-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20, Bus Driver/Transceiver |
| package instruction | DIE, | DIP, DIP20,.3 | LEAD FREE | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown | unknown | compliant | unknown |
| series | ACT | ACT | - | ACT |
| JESD-30 code | R-XUUC-N20 | R-GDIP-T20 | - | S-CQCC-N20 |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | - | BUS DRIVER |
| Number of digits | 8 | 1 | - | 1 |
| Number of functions | 1 | 8 | - | 8 |
| Number of ports | 2 | 2 | - | 2 |
| Number of terminals | 20 | 20 | - | 20 |
| Maximum operating temperature | 125 °C | 125 °C | - | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | - | -55 °C |
| Output characteristics | 3-STATE | 3-STATE | - | 3-STATE |
| Output polarity | TRUE | TRUE | - | TRUE |
| Package body material | UNSPECIFIED | CERAMIC, GLASS-SEALED | - | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIE | DIP | - | QCCN |
| Package shape | RECTANGULAR | RECTANGULAR | - | SQUARE |
| Package form | UNCASED CHIP | IN-LINE | - | CHIP CARRIER |
| propagation delay (tpd) | 11.5 ns | 11.5 ns | - | 11.5 ns |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | - | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | - | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | - | 5 V |
| surface mount | YES | NO | - | YES |
| technology | CMOS | CMOS | - | CMOS |
| Temperature level | MILITARY | MILITARY | - | MILITARY |
| Terminal form | NO LEAD | THROUGH-HOLE | - | NO LEAD |
| Terminal location | UPPER | DUAL | - | QUAD |
| Base Number Matches | 1 | 1 | - | 1 |