ISD1200 SERIES
SINGLE-CHIP,
VOICE RECORD/PLAYBACK DEVICES
10- AND 12-SECOND DURATION
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Publication Release Date: April 21, 2005
Revision 1.1
ISD1200 SERIES
1. GENERAL DESCRIPTION
Winbond’s ChipCorder
®
ISD1200 series provide high-quality, single-chip, Record/Playback solutions
to 10- and 12-second messaging applications. The CMOS devices include an on-chip oscillator,
microphone preamplifier, automatic gain control, antialiasing filter, smoothing filter, and speaker
amplifier. A minimum Record/Playback subsystem can be configured with a microphone, a speaker,
several passive components, two push buttons, and a power source. Recordings are stored into on-
chip nonvolatile memory cells, providing zero-power message storage. This unique, single-chip
solution is made possible through Winbond’s patented Multi-Level Storage (MLS) technology. Voice
and audio signals are stored directly into memory in their natural form, providing high-quality, solid-
state voice reproduction.
2. FEATURES
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Single +5 volt power supply
Single-chip with 10 and 12 seconds duration
Easy-to-use single-chip, voice record/playback solution
Push-button interface
o
Playback can be edge- or level activated
Fully addressable to handle multiple messages
Automatic power-down mode
o
o
Enters standby automatically following a record or playback cycle
Standby current 0.5 µA (typical)
Eliminates battery backup circuits
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Zero-power message storage
o
High-quality, natural voice/audio reproduction
On-chip oscillator
No programmer or development system needed
100,000 record cycles (typical)
100-year message retention (typical)
Available in die, PDIP, and SOIC
Temperature: Commercial - Packaged unit : 0°C to 70°C, Die : 0°C to 50°C
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ISD1200 SERIES
3. BLOCK DIAGRAM
Internal Clock
XCLK
Timing
Sampling Clock
ANA IN
Amp
5-Pole Active
Antialiasing Filter
Decoders
Analog Transceivers
64K Cell
Nonvolatile
Multilevel Storage
Array
SP +
Amp
SP -
ANA OUT
MIC
MIC REF
AGC
Pre-
Amp
Automatic
Gain Control
(AGC)
Power Conditioning
5-Pole Active
Smoothing Filter
Address Buffers
Device Control
V
CCA
V
SSA
V
SSD
V
CCD
A0
A1 A2 A3 A4 A5 A6 A7
REC
PLAYE PLAYL RECLED
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Publication Release Date: April 21, 2005
Revision 1.1
ISD1200 SERIES
4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 2
3. BLOCK DIAGRAM .............................................................................................................................. 3
4. TABLE OF CONTENTS ...................................................................................................................... 4
5. PIN CONFIGURATION ....................................................................................................................... 5
6. PIN DESCRIPTION ............................................................................................................................. 6
7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10
7.1. Detailed Description.................................................................................................................... 10
7.2. Operational Modes ..................................................................................................................... 11
7.2.1. Operational Modes Description............................................................................................ 12
8. TIMING DIAGRAMS.......................................................................................................................... 13
9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 14
9.1 Operating Conditions ................................................................................................................... 15
10. ELECTRICAL CHARACTERISTICS ............................................................................................... 16
10.1. Parameters For Packaged Parts .............................................................................................. 16
10.1.1. Typical Parameter Variation with Voltage and Temperature ............................................. 19
10.2. Parameters For DIE.................................................................................................................. 20
10.2.1. Typical Parameter Variation with Voltage and Temperature ............................................. 23
11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 24
12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 27
12.1. 28-Lead 300mil Plastic Small Outline IC (SOIC)...................................................................... 27
12.2. 28-Lead 600mil Plastic Dual Inline Package (PDIP) ................................................................ 28
12.3. Die Physical Layout
[1]
................................................................................................................ 29
13. ORDERING INFORMATION........................................................................................................... 31
14. VERSION HISTORY ....................................................................................................................... 32
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ISD1200 SERIES
5. PIN CONFIGURATION
A0
A1
A2
A3
A4
A5
NC
NC
A6
A7
NC
V
SSD
V
SSA
SP +
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CCD
REC
XCLK
RECLED
PLAYE
PLAYL
NC
ANA OUT
ANA IN
AGC
MIC REF
MIC
V
CCA
SP-
SOIC / PDIP
Note:
NC means must No connect
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Publication Release Date: April 21, 2005
Revision 1.1
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