IS61C632A-10PQ datasheet, PDF - EEWORLD Datasheet

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IS61C632A-10PQ: DescriptionStandard SRAM, 32KX32, 10ns, CMOS, PQFP100, PLASTIC, QFP-100; Categorystorage storage; File Size395KB，16 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS61C632A-10PQ Overview

Standard SRAM, 32KX32, 10ns, CMOS, PQFP100, PLASTIC, QFP-100

IS61C632A-10PQ Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Integrated Silicon Solution ( ISSI )
Parts packaging code	QFP
package instruction	PLASTIC, QFP-100
Contacts	100
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Maximum access time	10 ns
I/O type	COMMON
JESD-30 code	R-PQFP-G100
JESD-609 code	e0
length	20 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	100
word count	32768 words
character code	32000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX32
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP100,.7X.9
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	3.22 mm
Maximum standby current	0.005 A
Maximum slew rate	0.155 mA
Maximum supply voltage (Vsup)	3.63 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm
Base Number Matches	1

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IS61C632A-10PQ Related Products

	IS61C632A-10PQ	IS61C632A-12TQ	IS61C632A-12PQ	IS61C632A-10TQ
Description	Standard SRAM, 32KX32, 10ns, CMOS, PQFP100, PLASTIC, QFP-100	Standard SRAM, 32KX32, 12ns, CMOS, PQFP100, TQFP-100	Standard SRAM, 32KX32, 12ns, CMOS, PQFP100, PLASTIC, QFP-100	Standard SRAM, 32KX32, 10ns, CMOS, PQFP100, TQFP-100
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Parts packaging code	QFP	QFP	QFP	QFP
package instruction	PLASTIC, QFP-100	TQFP-100	PLASTIC, QFP-100	TQFP-100
Contacts	100	100	100	100
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN code	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B
Maximum access time	10 ns	12 ns	12 ns	10 ns
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
JESD-609 code	e0	e0	e0	e0
length	20 mm	20 mm	20 mm	20 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	32	32	32	32
Number of functions	1	1	1	1
Number of ports	1	1	1	1
Number of terminals	100	100	100	100
word count	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	32KX32	32KX32	32KX32	32KX32
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	LQFP	QFP	LQFP
Encapsulate equivalent code	QFP100,.7X.9	QFP100,.63X.87	QFP100,.7X.9	QFP100,.63X.87
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	FLATPACK, LOW PROFILE	FLATPACK	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.22 mm	1.6 mm	3.22 mm	1.6 mm
Maximum standby current	0.005 A	0.005 A	0.005 A	0.005 A
Maximum slew rate	0.155 mA	0.14 mA	0.14 mA	0.15 mA
Maximum supply voltage (Vsup)	3.63 V	3.63 V	3.63 V	3.63 V
Minimum supply voltage (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	14 mm	14 mm	14 mm
Base Number Matches	1	1	1	1

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