5962-8966101YX datasheet, PDF - EEWORLD Datasheet

5962-8966101YX: DescriptionFIFO, 64X9, 40ns, Asynchronous, CMOS, CDFP28, CERPACK-28; Categorystorage storage; File Size397KB，14 Pages; ManufacturerCypress Semiconductor

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5962-8966101YX Overview

FIFO, 64X9, 40ns, Asynchronous, CMOS, CDFP28, CERPACK-28

Parameter Name	Attribute value
Maker	Cypress Semiconductor
Parts packaging code	DFP
package instruction	DFP,
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	40 ns
period time	66.67 ns
JESD-30 code	R-GDFP-F28
JESD-609 code	e0
length	18.288 mm
memory density	576 bit
memory width	9
Number of functions	1
Number of terminals	28
word count	64 words
character code	64
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64X9
Exportable	NO
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DFP
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	2.286 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
width	9.144 mm
Base Number Matches	1

	5962-8966101YX	5962-8966102YX
Description	FIFO, 64X9, 40ns, Asynchronous, CMOS, CDFP28, CERPACK-28	FIFO, 64X9, 23ns, Asynchronous, CMOS, CDFP28
Maker	Cypress Semiconductor	Cypress Semiconductor
package instruction	DFP,	DFP,
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
Maximum access time	40 ns	23 ns
period time	66.67 ns	40 ns
JESD-30 code	R-GDFP-F28	R-GDFP-F28
length	18.288 mm	18.288 mm
memory density	576 bit	576 bit
memory width	9	9
Number of functions	1	1
Number of terminals	28	28
word count	64 words	64 words
character code	64	64
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C
organize	64X9	64X9
Exportable	NO	NO
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DFP	DFP
Package shape	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	FLATPACK
Parallel/Serial	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified
Maximum seat height	2.286 mm	2.286 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	MILITARY	MILITARY
Terminal form	FLAT	FLAT
Terminal pitch	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL
width	9.144 mm	9.144 mm
Base Number Matches	1	1

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