AM29DL640D90EI datasheet, PDF - EEWORLD Datasheet

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AM29DL640D90EI: DescriptionFlash, 4MX16, 90ns, PDSO48, MO-142DD, TSOP-48; Categorystorage storage; File Size1MB，54 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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AM29DL640D90EI Overview

Flash, 4MX16, 90ns, PDSO48, MO-142DD, TSOP-48

AM29DL640D90EI Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	TSOP1
package instruction	MO-142DD, TSOP-48
Contacts	48
Reach Compliance Code	not_compliant
ECCN code	3A991.B.1.A
Maximum access time	90 ns
Spare memory width	8
startup block	BOTTOM/TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PDSO-G48
JESD-609 code	e0
length	18.4 mm
memory density	67108864 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	16,126
Number of terminals	48
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	4MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP48,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	8K,64K
Maximum standby current	0.000005 A
Maximum slew rate	0.045 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
switch bit	YES
type	NOR TYPE
width	12 mm
Base Number Matches	1

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Am29DL640D

Data Sheet

This product has been retired and is not available for designs.

For new and current designs involving TSOP packages, S29JL064H supersedes Am29DL640D and is the factory-

recommended migration path. Please refer to the S29JL064H datasheet for specifications and ordering informa-

tion.

For new and current designs involving Fine-pitch BGA (FBGA) packages, S29PL064J supersedes Am29DL640D

and is the factory-recommended migration path. Please refer to the S29PL064J Datasheet for specifications and

ordering information.

Availability of this document is retained for reference and historical purposes only.

July 2003

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that

originally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appropri-

ate, and changes will be noted in a revision summary.

Continuity of Ordering Part Numbers

AMD and Fujitsu continue to support existing part numbers beginning with "Am" and "MBM". To

order these products, please use only the Ordering Part Numbers listed in this document.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion mem-

ory solutions.

Publication Number

23695

Revision

Amendment

Issue Date

December 13, 2005

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 6

Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 9

Table 1. Am29DL640D Device Bus Operations ................................9

Write Operation Status . . . . . . . . . . . . . . . . . . . . 29

DQ7: Data# Polling ................................................................. 29

Figure 6. Data# Polling Algorithm .................................................. 29

RY/BY#: Ready/Busy# ......................................... 30

DQ6: Toggle Bit I .................................................................... 30

Figure 7. Toggle Bit Algorithm........................................................ 30

Word/Byte Configuration ........................................ 9

Requirements for Reading Array Data ..................................... 9

Writing Commands/Command Sequences ............................ 10

Accelerated Program Operation ............................................. 10

Autoselect Functions .............................................................. 10

Simultaneous Read/Write Operations with Zero Latency ....... 10

Standby Mode ...................................................... 10

Automatic Sleep Mode ........................................................... 11

RESET#: Hardware Reset Pin ............................................... 11

Output Disable Mode .............................................................. 11

Table 2. Am29DL640D Sector Architecture ....................................11

Table 3. Bank Address ....................................................................14

Secured Silicon Sector Addresses............................. 14

DQ2: Toggle Bit II ................................................................... 31

Reading Toggle Bits DQ6/DQ2 ............................................... 31

DQ5: Exceeded Timing Limits ................................................ 31

DQ3: Sector Erase Timer ....................................................... 31

Table 13. Write Operation Status ................................................... 32

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 33

Figure 8. Maximum Negative Overshoot Waveform ...................... 33

Figure 9. Maximum Positive Overshoot Waveform........................ 33

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 33

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 34

Figure 10. I

CC1

Current vs. Time (Showing Active and

Automatic Sleep Currents) ............................................................. 35

Figure 11. Typical I

CC1

vs. Frequency ............................................ 35

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Figure 12. Test Setup.................................................................... 36

Autoselect Mode ................................................... 14

Table 5. Am29DL640D Autoselect Codes, (High Voltage Method) 15

KEY TO SWITCHING WAVEFORMS . . . . . . . . . . 36

Figure 13. Input Waveforms and Measurement Levels ................. 36

Sector/Sector Block Protection and Unprotection 16

Table 6. Am29DL640D Boot Sector/Sector Block Addresses for Pro-

tection/Unprotection ........................................................................16

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37

Read-Only Operations ........................................................... 37

Figure 14. Read Operation Timings ............................................... 37

Write Protect (WP#) ................................................................ 17

Table 7. WP#/ACC Modes ..............................................................17

Hardware Reset (RESET#) .................................................... 38

Figure 15. Reset Timings ............................................................... 38

Temporary Sector Unprotect .................................................. 17

Figure 1. Temporary Sector Unprotect Operation........................... 17

Figure 2. In-System Sector Protect/Unprotect Algorithms .............. 18

Word/Byte Configuration (BYTE#) .......................................... 39

Figure 16. BYTE# Timings for Read Operations............................ 39

Figure 17. BYTE# Timings for Write Operations............................ 39

Secured Silicon Sector

Flash Memory Region ............................................................ 19

Figure 3. Secured Silicon Sector Protect Verify .............................. 20

Erase and Program Operations .............................................. 40

Figure 18. Program Operation Timings..........................................

Figure 19. Accelerated Program Timing Diagram..........................

Figure 20. Chip/Sector Erase Operation Timings ..........................

Figure 21. Back-to-back Read/Write Cycle Timings ......................

Figure 22. Data# Polling Timings (During Embedded Algorithms).

Figure 23. Toggle Bit Timings (During Embedded Algorithms)......

Figure 24. DQ2 vs. DQ6.................................................................

Hardware Data Protection ...................................................... 20

Low VCC Write Inhibit ............................................................ 20

Write Pulse “Glitch” Protection ............................................... 20

Logical Inhibit .......................................................................... 20

Power-Up Write Inhibit ............................................................ 20

Common Flash Memory Interface (CFI) . . . . . . . 20

Table 8. CFI Query Identification String ......................

System Interface String...............................................

Table 10. Device Geometry Definition ........................

Table 11. Primary Vendor-Specific Extended Query ..

Temporary Sector Unprotect .................................................. 45

Figure 25. Temporary Sector Unprotect Timing Diagram .............. 45

Figure 26. Sector/Sector Block Protect and

Unprotect Timing Diagram ............................................................. 46

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 24

Reading Array Data ................................................................ 24

Reset Command ..................................................................... 24

Autoselect Command Sequence ............................................ 24

Enter/Exit Secured Silicon Sector

Command Sequence .............................................................. 24

Byte/Word Program Command Sequence ............................. 25

Unlock Bypass Command Sequence ..................................... 25

Figure 4. Program Operation .......................................................... 26

Alternate CE# Controlled Erase and Program Operations ..... 47

Figure 27. Alternate CE# Controlled Write (Erase/Program)

Operation Timings.......................................................................... 48

Chip Erase Command Sequence ........................................... 26

Sector Erase Command Sequence ........................................ 26

Erase Suspend/Erase Resume Commands ........................... 27

Figure 5. Erase Operation............................................................... 27

Table 12. Am29DL640D Command Definitions .......... 28

Erase And Programming Performance . . . . . . . 49

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 49

TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 49

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 50

FBE063—63-Ball Fine-Pitch Ball Grid Array (FBGA)

12 x 11 mm package .............................................................. 50

TS 048—48-Pin Standard TSOP ............................................ 51

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 52

December 13, 2005

Am29DL640D

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