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73M2901CE-IGV

Description
Modem, PQFP32
CategoryWireless rf/communication    Telecom circuit   
File Size130KB,19 Pages
ManufacturerTDK Corporation
Websitehttp://www.tdk.com
Download Datasheet Parametric Compare View All

73M2901CE-IGV Overview

Modem, PQFP32

73M2901CE-IGV Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTDK Corporation
package instructionQFP, TQFP32,.35SQ,32
Reach Compliance Codeunknown
JESD-30 codeS-PQFP-G32
JESD-609 codee0
Number of terminals32
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeTQFP32,.35SQ,32
Package shapeSQUARE
Package formFLATPACK
power supply3/3.3 V
Certification statusNot Qualified
Maximum slew rate0.0155 mA
surface mountYES
Telecom integrated circuit typesMODEM
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
Base Number Matches1
73M2901CE
V.22bis Single Chip Modem
APRIL 2004
DESCRIPTION
The 73M2901CE low speed modem integrates a
data pump, controller, and analog front end in a 3.3V
device with a powerful "AT" command host
interface. The modem reduces external component
count/cost by incorporating many features like
parallel phone detect, Line-In-Use and Ring
detection in software without additional components
required.
The device is a "one chip fits all” solution for
applications including set-top boxes, point-of-sale
terminals, automatic teller machines, utility meters,
vending machines and smart card readers.
Another distinctive feature of this device is pin
compatibility with TDK’s flagship embedded hard
modems, the 73M2901CL, and the 73M1903 soft
modem AFE. This offers customers a cost effective
method to design for both hard or soft modem
solutions in the same system as a risk-free cost
reduction path.
Complete Support and Modem Reference Designs
Error correction software and support are part of the
solution offered by TDK Semiconductor. Our in-
house application engineering team is here to help
you meet your international certification needs.
FEATURES
True one chip solution for embedded systems
As low as 9.5mA operating with standby and
power down mode available
Power supply operation from 3.6V to 2.7V
Data speed:
V.22bis – 2400bps
V.22/Bell212 – 1200bps
V.21/Bell103 – 300bps
V.23 – 1200/75bps (with PAVI turnaround)
Bell202 – 1200bps
Bell202/V23 4-wire operation
International Call Progress support
FCC68, CTR21, JATE, etc.
Worldwide Caller ID capability
Type I and II support
EIA 777 compliant
DTMF generation and detection
SMS messaging support
On chip hybrid driver
Blacklisting capability
Line-In-Use and Parallel Pick-Up (911) detection
with voltage or low cost energy detection method
Incoming ring energy detection through CID path;
no optocoupler required
Manufacturing Self Test capability
Backward compatible with 73M2901CL
Packaging:
32 lead QFN
32 pin TQFP packages
BLOCK DIAGRAM
©
2004 TDK Semiconductor Corporation
04/15/04- V2.2.1
1

73M2901CE-IGV Related Products

73M2901CE-IGV 73M2901CE-IM/F 73M2901CE-IGV/F 73M2901CE-IM
Description Modem, PQFP32 Modem, PQCC32, Modem, PQFP32, Modem, PQCC32
Is it Rohs certified? incompatible conform to conform to incompatible
Maker TDK Corporation TDK Corporation TDK Corporation TDK Corporation
package instruction QFP, TQFP32,.35SQ,32 QCCN, LCC32,.2SQ,20 QFP, TQFP32,.35SQ,32 QCCN, LCC32,.2SQ,20
Reach Compliance Code unknown unknown unknown unknown
JESD-30 code S-PQFP-G32 S-PQCC-N32 S-PQFP-G32 S-PQCC-N32
Number of terminals 32 32 32 32
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP QCCN QFP QCCN
Encapsulate equivalent code TQFP32,.35SQ,32 LCC32,.2SQ,20 TQFP32,.35SQ,32 LCC32,.2SQ,20
Package shape SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK CHIP CARRIER FLATPACK CHIP CARRIER
power supply 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 0.0155 mA 15.5 mA 15.5 mA 0.0155 mA
surface mount YES YES YES YES
Telecom integrated circuit types MODEM MODEM MODEM MODEM
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING NO LEAD GULL WING NO LEAD
Terminal pitch 0.8 mm 0.5 mm 0.8 mm 0.5 mm
Terminal location QUAD QUAD QUAD QUAD
Base Number Matches 1 1 1 1
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