REVISIONS
LTR
A
DESCRIPTION
Add device type 02. Add appendix A for device type 02 only. Make editorial
changes throughout.
Make change to 1.4, 30.2.1, I
S(OFF)
overvoltage and I
D(OFF)
overvoltage
tests. - ro
Make change to boilerplate and add device class T for device type 02. - ro
DATE (YR-MO-DA)
97-04-09
APPROVED
R. MONNIN
B
97-09-12
R. MONNIN
C
98-12-02
R. MONNIN
D
Add level P to table I. Make change to 1.5 and glassivation as specified under
APPENDIX A. - ro
99-04-22
R. MONNIN
E
Make change to enable delay waveform as specified on figure 6 - ro
00-04-14
R. MONNIN
F
Make changes to supply voltage and V
REF
to GND limits as specified
under 1.3. Make clarification to paragraphs 4.4.4.2 and 4.4.4.3. - ro
04-06-25
R. MONNIN
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
F
15
F
16
F
17
F
18
REV
SHEET
PREPARED BY
RICK OFFICER
F
19
F
20
F
21
F
1
F
22
F
2
F
23
F
3
F
24
F
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F
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26
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14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
RAJESH PITHADIA
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
RAYMOND MONNIN
DRAWING APPROVAL DATE
95-08-23
MICROCIRCUIT, LINEAR, RADIATION
HARDENED, SINGLE 16-CHANNEL ANALOG
MUX / DEMUX WITH OVERVOLTAGE
PROTECTION, MONOLITHIC SILICON
SIZE
A
SHEET
CAGE CODE
AMSC N/A
REVISION LEVEL
F
67268
1 OF
26
5962-95630
DSCC FORM 2233
APR 97
5962-E310-04
1. SCOPE
1.1 Scope. This drawing documents three product assurance class levels consisting of high reliability (device classes Q and
M), space application (device class V) and for appropriate satellite and similar applications (device class T). A choice of case
outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of
Radiation Hardness Assurance (RHA) levels are reflected in the PIN. For device class T, the user is encouraged to review the
manufacturer’s Quality Management (QM) plan as part of their evaluation of these parts and their acceptability in the intended
application.
1.2 PIN. The PIN is as shown in the following example:
5962
⏐
⏐
⏐
Federal
stock class
designator
\
R
⏐
⏐
⏐
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 RHA designator. Device classes Q, T and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
HS-1840RH
Circuit function
Radiation hardened DI single 16-channel
analog MUX / DEMUX with high impedance
analog input overvoltage protection
Radiation hardened DI single 16-channel
analog MUX / DEMUX with high impedance
analog input overvoltage protection
95630
01
⏐
⏐
⏐
Device
type
(see 1.2.2)
V
⏐
⏐
⏐
Device
class
designator
(see 1.2.3)
X
⏐
⏐
⏐
Case
outline
(see 1.2.4)
C
⏐
⏐
⏐
Lead
finish
(see 1.2.5)
/
02
HS-1840ARH
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Certification and qualification to MIL-PRF-38535
Certification and qualification to MIL-PRF-38535 with performance as specified
in the device manufacturers approved quality management plan.
Q, V
T
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Descriptive designator
CDIP2-T28
CDFP3-F28
Terminals
28
28
Package style
Dual-in-line
Flat pack
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-95630
SHEET
F
2
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q, T and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
Supply voltage between V+ and V- :
Device type 01 .......................................................................... +40 V
Device type 02 .......................................................................... +33 V
Supply voltage between V+ and GND :
Device type 01 .......................................................................... +20 V
Device type 02 .......................................................................... +16.5 V
Supply voltage between V- and GND :
Device type 01 .......................................................................... -20 V
Device type 02 .......................................................................... -16.5 V
V
REF
to GND :
Device type 01 .......................................................................... +20 V
Device type 02 .......................................................................... +16.5 V
Digital input overvoltage range ...................................................... ((GND) - 4 V)
≤
V
A
≤
((V
REF
) + 4 V)
Analog input overvoltage range (power on/off):
Device type 01........................................................................... -25 V
≤
V
S
≤
+25 V
Device type 02........................................................................... -35 V
≤
V
S
≤
+35 V
Storage temperature range ........................................................... -65°C to +150°C
Maximum package power dissipation (P
D
): 2/
Case X .................................................................................... 1600 mW
Case Y .................................................................................... 1400 mW
Lead temperature (soldering, 10 seconds).................................... +275°C
Thermal resistance, junction-to-case (θ
JC
) ................................... See MIL-STD-1835
Thermal resistance, junction-to-ambient (θ
JA
):
Case X .................................................................................... 83.1°C/W
Case Y .................................................................................... 49.1°C/W
1.4 Recommended operating conditions.
Positive supply voltage (V+) .......................................................... +15 V
Negative supply voltage (V-).......................................................... -15 V
V
REF
.............................................................................................. 5 V dc
V
AH
................................................................................................ 4.0 V dc
V
AL
................................................................................................ 0.8 V dc
V
EN
................................................................................................ 0.8 V dc
Ambient operating temperature range (T
A
).................................... -55°C to +125°C
____
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ The derating factor for case X shall be 20.4 mW/°C, above T
A
= +95°C, and for case Y shall be 18.5 mW/°C above
T
A
= +95°C.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-95630
SHEET
F
3
1.5 Radiation features. 3/
SEP effective let no upsets:
2
Device type 01............................................................................ 110 MeV/cm /mg
Device type 02............................................................................ 120 MeV/cm /mg
Maximum total dose available: (dose rate = 50 – 300 rad(Si)/s)
Device classes M, Q, and V:
Device type 01.......................................................................... 200 Krads (Si)
Device type 02.......................................................................... 300 Krads (Si)
Device class T:
Device type 02.......................................................................... 100 Krads (Si)
Dose rate upset:
8
Device type 01............................................................................ >1 x 10 rad(Si)/s
Device type 02............................................................................ Not tested
Latch up......................................................................................... None
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in
the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
www.dodssp.daps.mil
or from the
Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
_____
3/ Guaranteed by process design, but not tested, unless specified in table I herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-95630
SHEET
F
4
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q, T and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level devices and as specified
herein.
3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A to this document.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q, T and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Logic diagrams. The logic diagrams shall be as specified on figure 3.
3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 4.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q, T and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall
be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q, T and V shall be a "QML" or "Q" as
required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix
A.
3.6 Certificate of compliance. For device classes Q, T and V, a certificate of compliance shall be required from a
QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a
certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-
HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q, T and V, the requirements of
MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q, T and V in MIL-PRF-38535 or
for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 82 (see MIL-PRF-38535, appendix A).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-95630
SHEET
F
5