54ACQ657FMX datasheet, PDF - EEWORLD Datasheet

54ACQ657FMX: DescriptionIC,BUS TRANSCEIVER,SINGLE,8-BIT,AC-CMOS,FP,24PIN,CERAMIC; Categorylogic logic; File Size471KB，8 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54ACQ657FMX Overview

IC,BUS TRANSCEIVER,SINGLE,8-BIT,AC-CMOS,FP,24PIN,CERAMIC

Parameter Name	Attribute value
package instruction	DFP, FL24,.4
Reach Compliance Code	unknown
Control type	COMMON CONTROL
Counting direction	BIDIRECTIONAL
JESD-30 code	R-XDFP-F24
MaximumI(ol)	0.024 A
Number of digits	8
Number of functions	1
Number of terminals	24
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL24,.4
Package shape	RECTANGULAR
Package form	FLATPACK
method of packing	TAPE AND REEL
power supply	2/6 V
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

	54ACQ657FMX	54ACQ657LMX	54ACQ657DMX
Description	IC,BUS TRANSCEIVER,SINGLE,8-BIT,AC-CMOS,FP,24PIN,CERAMIC	IC,BUS TRANSCEIVER,SINGLE,8-BIT,AC-CMOS,LLCC,28PIN,CERAMIC	IC,BUS TRANSCEIVER,SINGLE,8-BIT,AC-CMOS,DIP,24PIN,CERAMIC
package instruction	DFP, FL24,.4	QCCN, LCC28,.45SQ	DIP, DIP24,.3
Reach Compliance Code	unknown	unknown	unknown
Control type	COMMON CONTROL	COMMON CONTROL	COMMON CONTROL
Counting direction	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL
JESD-30 code	R-XDFP-F24	S-XQCC-N28	R-XDIP-T24
MaximumI(ol)	0.024 A	0.024 A	0.024 A
Number of digits	8	8	8
Number of functions	1	1	1
Number of terminals	24	28	24
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C
Output characteristics	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE
Package body material	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DFP	QCCN	DIP
Encapsulate equivalent code	FL24,.4	LCC28,.45SQ	DIP24,.3
Package shape	RECTANGULAR	SQUARE	RECTANGULAR
Package form	FLATPACK	CHIP CARRIER	IN-LINE
method of packing	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL
power supply	2/6 V	2/6 V	2/6 V
Certification status	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	YES	NO
technology	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY
Terminal form	FLAT	NO LEAD	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL
Base Number Matches	1	1	1

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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