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MR16R162GEG0-CM8

Description
Key Timing Parameters
Categorystorage    storage   
File Size443KB,16 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Environmental Compliance
Download Datasheet Parametric View All

MR16R162GEG0-CM8 Overview

Key Timing Parameters

MR16R162GEG0-CM8 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSAMSUNG
Parts packaging codeDMA
package instructionDIMM, DIMM184,40
Contacts184
Reach Compliance Codeunknow
ECCN codeEAR99
access modeBLOCK ORIENTED PROTOCOL
Maximum access time40 ns
Other featuresSELF CONTAINED REFRESH
Maximum clock frequency (fCLK)800 MHz
I/O typeCOMMON
JESD-30 codeR-XDMA-N184
memory density4294967296 bi
Memory IC TypeRAMBUS DRAM MODULE
memory width16
Humidity sensitivity level3
Number of functions1
Number of ports1
Number of terminals184
word count268435456 words
character code256000000
Operating modeSYNCHRONOUS
organize256MX16
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM184,40
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)260
power supply1.8/2.5,2.5 V
Certification statusNot Qualified
self refreshYES
Maximum supply voltage (Vsup)2.63 V
Minimum supply voltage (Vsup)2.37 V
Nominal supply voltage (Vsup)2.5 V
surface mountNO
technologyCMOS
Terminal formNO LEAD
Terminal pitch1 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
MR16R1624(8/G)EG0
MR18R1624(8/G)EG0
Change History
Version 0.1 (December 2003) -
Preliminary
* First copy.
* Based on the 1.0 ver. (July 2002) 256/288Mbit D-die RIMM
Module Datasheet
Version 1.0 (May 2004)
* Eliminate "Preliminary"
Page 0
Version 1.0 May 2004
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