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5962-8995902YX

Description
Bit-Slice Processor, 16-Bit, CMOS, CQCC68, CERAMIC, LCC-68
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size524KB,12 Pages
ManufacturerLOGIC Devices
Websitehttp://www.logicdevices.com/
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5962-8995902YX Overview

Bit-Slice Processor, 16-Bit, CMOS, CQCC68, CERAMIC, LCC-68

5962-8995902YX Parametric

Parameter NameAttribute value
Parts packaging codeLCC
package instructionQCCN,
Contacts68
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
External data bus width16
JESD-30 codeS-CQCC-N68
Number of terminals68
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Package shapeSQUARE
Package formCHIP CARRIER
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formNO LEAD
Terminal locationQUAD
uPs/uCs/peripheral integrated circuit typeBIT-SLICE MICROPROCESSOR
Base Number Matches1

5962-8995902YX Related Products

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Description Bit-Slice Processor, 16-Bit, CMOS, CQCC68, CERAMIC, LCC-68 Bit-Slice Processor, 16-Bit, CMOS, CQCC68, CERAMIC, LCC-68 Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CERAMIC, PGA-68 Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CERAMIC, PGA-68 Bit-Slice Processor, 16-Bit, CMOS, CQCC68, CERAMIC, LCC-68 Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CERAMIC, PGA-68 Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CERAMIC, PGA-68
Parts packaging code LCC LCC PGA PGA LCC PGA PGA
package instruction QCCN, QCCN, PGA, PGA, QCCN, PGA, PGA,
Contacts 68 68 68 68 68 68 68
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
External data bus width 16 16 16 16 16 16 16
JESD-30 code S-CQCC-N68 S-CQCC-N68 S-CPGA-P68 S-CPGA-P68 S-CQCC-N68 R-CPGA-P68 S-CPGA-P68
Number of terminals 68 68 68 68 68 68 68
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code QCCN QCCN PGA PGA QCCN PGA PGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE RECTANGULAR SQUARE
Package form CHIP CARRIER CHIP CARRIER GRID ARRAY GRID ARRAY CHIP CARRIER GRID ARRAY GRID ARRAY
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Filter level MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO NO YES NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form NO LEAD NO LEAD PIN/PEG PIN/PEG NO LEAD PIN/PEG PIN/PEG
Terminal location QUAD QUAD PERPENDICULAR PERPENDICULAR QUAD PERPENDICULAR PERPENDICULAR
uPs/uCs/peripheral integrated circuit type BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR
Base Number Matches 1 1 1 1 1 1 1
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