M93S66-RBN3 datasheet, PDF - EEWORLD Datasheet

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M93S66-RBN3: Description256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8; Categorystorage storage; File Size303KB，32 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M93S66-RBN3 Overview

256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8

M93S66-RBN3 Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP,
Contacts	8
Reach Compliance Code	unknow
ECCN code	3A991.B.1.B.1
Maximum clock frequency (fCLK)	1 MHz
JESD-30 code	R-PDIP-T8
length	9.27 mm
memory density	4194304 bi
Memory IC Type	EEPROM
memory width	16
Number of functions	1
Number of terminals	8
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
organize	256KX16
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
Certification status	Not Qualified
Maximum seat height	5.33 mm
Serial bus type	MICROWIRE
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Maximum write cycle time (tWC)	10 ms
Base Number Matches	1

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M93S46-W M93S56-W

M93S66-W

4 Kbit, 2 Kbit and 1 Kbit serial MICROWIRE bus EEPROM with

write protection

Datasheet - production data

Features

•

Compatible with MICROWIRE bus serial

interface

Memory array

−

1 Kbit, 2 Kbit or 4 Kbit of EEPROM

−

Organized by word (16b)

−

Page = 4 words

Write

−

Byte write within 5 ms

−

Page write within 5 ms

−

Ready/busy signal during programming

User defined write protected area

High-speed clock: 2 MHz

Single supply voltage:

2.5 V to 5.5 V

−

Operating temperature range:

-40 °C up to +85 °C.

Enhanced ESD protection

More than 4 million write cycles

More than 200-year data retention

•

PDIP8 (BN)

•

TSSOP8 (DW)

169 mil width

•

Packages

SO8 (MN)

150 mil width

MSv35377V1

•

PDIP8 ECOPACK

TSSOP8 ECOPACK

SO8 ECOPACK

January 2015

DocID5124 Rev 7

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www.st.com

This is information on a product in full production

Contents

M93S46-W M93S56-W M93S66-W

Contents

Description ........................................................................................ 5

Signal description ............................................................................ 6

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

Serial data output (Q) ........................................................................ 6

Serial data input (D) .......................................................................... 6

Serial clock (C) .................................................................................. 6

Chip select (S)................................................................................... 6

Protection register (PRE) .................................................................. 6

Write protect (W) ............................................................................... 6

ground ........................................................................................ 6

Supply voltage (V

) ......................................................................... 6

2.8.1

2.8.2

2.8.3

2.8.4

Operating supply voltage V

............................................................. 6

Device reset........................................................................................ 7

Power-up conditions ........................................................................... 7

Power-down........................................................................................ 7

Operating features ............................................................................ 8

Clock pulse counter ......................................................................... 9

Instructions ..................................................................................... 10

5.1

5.2

5.3

5.4

5.5

5.6

Read ............................................................................................... 12

Write enable and write disable ........................................................ 12

Write to memory array (WRITE) ...................................................... 13

Page write ....................................................................................... 14

Write all ........................................................................................... 15

Write protection and protect register ............................................... 16

Power-up state ................................................................................ 21

Initial delivery state.......................................................................... 21

Power-up and delivery states ........................................................ 21

6.1

6.2

Maximum ratings ............................................................................ 22

DC and AC parameters .................................................................. 23

Package mechanical data .............................................................. 27

Part numbering ............................................................................... 30

Revision history .............................................................................. 31

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M93S46-W M93S56-W M93S66-W

List of tables

Table 1: Signal names ................................................................................................................................ 5

Table 2: Instruction set for the M93S46 .................................................................................................... 10

Table 3: Instruction set for the M93S66, M93S56 .................................................................................... 11

Table 4: Absolute maximum ratings ......................................................................................................... 22

Table 5: Operating conditions (M93Sx6-W) ............................................................................................. 23

Table 6: AC test measurement conditions ................................................................................................ 23

Table 7: Capacitance ................................................................................................................................ 23

Table 8: Memory cell data retention ......................................................................................................... 23

Table 9: Cycling performance ................................................................................................................... 24

Table 10: DC Characteristics (M93Sx6-W, device grade 6) ..................................................................... 24

Table 11: AC Characteristics (M93Sx6-W, device grade 6) ..................................................................... 24

Table 12: SO8N – 8-lead plastic small outline, 150 mils body width, package mechanical data ............. 27

Table 13: PDIP8 – 8 lead plastic dual in-line package, 300 mils body width, package mechanical data 28

Table 14: TSSOP8 - 8-lead thin shrink small outline, package mechanical data ..................................... 29

Table 15: Document revision history ........................................................................................................ 31

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List of figures

M93S46-W M93S56-W M93S66-W

List of figures

Figure 1: Logic diagram .............................................................................................................................. 5

Figure 2: 8-pin package connections .......................................................................................................... 5

Figure 3: Write sequence with one clock glitch .......................................................................................... 9

Figure 4: READ sequence ........................................................................................................................ 12

Figure 5: WRITE sequence ...................................................................................................................... 13

Figure 6: WEN and WDS sequences ....................................................................................................... 13

Figure 7: PAWRITE sequence .................................................................................................................. 15

Figure 8: WRAL sequence ........................................................................................................................ 15

Figure 9: PREAD sequence ...................................................................................................................... 18

Figure 10: PRWRITE sequence ............................................................................................................... 18

Figure 11: PREN sequence ...................................................................................................................... 19

Figure 12: PRCLEAR sequence ............................................................................................................... 19

Figure 13: PRDS sequence ...................................................................................................................... 20

Figure 14: AC test measurement I/O waveform ....................................................................................... 23

Figure 15: Synchronous timing (start and op-code input)......................................................................... 25

Figure 16: Synchronous timing (read or write) ......................................................................................... 26

Figure 17: Synchronous timing (read or write) ......................................................................................... 26

Figure 18: SO8N – 8-lead plastic small outline 150 mils body width, package outline ............................ 27

Figure 19: PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package outline .......................................... 28

Figure 20: TSSOP8 - 8-lead thin shrink small outline, package outline ................................................... 29

Figure 21: Ordering information scheme .................................................................................................. 30

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