5962-8873305XA datasheet, PDF - EEWORLD Datasheet

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5962-8873305XA: DescriptionMultiplier Accumulator/Summer, 16-Bit, CMOS, CDIP64, 0.900 INCH, DIP-64; CategoryThe embedded processor and controller Microcontrollers and processors; File Size306KB，10 Pages; ManufacturerIDT (Integrated Device Technology)

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5962-8873305XA Overview

Multiplier Accumulator/Summer, 16-Bit, CMOS, CDIP64, 0.900 INCH, DIP-64

5962-8873305XA Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP,
Contacts	64
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Other features	2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 25MHZ
boundary scan	NO
External data bus width	16
JESD-30 code	R-CDIP-T64
JESD-609 code	e0
length	81.28 mm
low power mode	NO
Number of terminals	64
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output data bus width	35
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum seat height	4.826 mm
Maximum slew rate	230 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	22.86 mm
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches	1

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Description	Multiplier Accumulator/Summer, 16-Bit, CMOS, CDIP64, 0.900 INCH, DIP-64	Multiplier Accumulator/Summer, 16-Bit, CMOS, CDIP64, 0.900 INCH, DIP-64	Multiplier Accumulator/Summer, 16-Bit, CMOS, CDIP64, 0.900 INCH, DIP-64	Multiplier Accumulator/Summer, 16-Bit, CMOS, CPGA68, CAVITY-DOWN, PGA-68	Multiplier Accumulator/Summer, 16-Bit, CMOS, CDIP64, 0.900 INCH, DIP-64	Multiplier Accumulator/Summer, 16-Bit, CMOS, CPGA68, CAVITY-DOWN, PGA-68	Multiplier Accumulator/Summer, 16-Bit, CMOS, CPGA68, CAVITY-DOWN, PGA-68
Parts packaging code	DIP	DIP	DIP	PGA	DIP	PGA	PGA
package instruction	DIP,	DIP,	DIP,	PGA,	DIP,	PGA,	PGA,
Contacts	64	64	64	68	64	68	68
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Other features	2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 25MHZ	2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 18.18MHZ	2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 33.33MHZ	2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 25MHZ	2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 15.38MHZ	2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 15.38MHZ	2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 13.33MHZ
boundary scan	NO	NO	NO	NO	NO	NO	NO
External data bus width	16	16	16	16	16	16	16
JESD-30 code	R-CDIP-T64	R-CDIP-T64	R-CDIP-T64	S-CPGA-P68	R-CDIP-T64	S-CPGA-P68	S-CPGA-P68
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
length	81.28 mm	81.28 mm	81.28 mm	28.194 mm	81.28 mm	28.194 mm	28.194 mm
low power mode	NO	NO	NO	NO	NO	NO	NO
Number of terminals	64	64	64	68	64	68	68
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Output data bus width	35	35	35	35	35	35	35
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	PGA	DIP	PGA	PGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	SQUARE
Package form	IN-LINE	IN-LINE	IN-LINE	GRID ARRAY	IN-LINE	GRID ARRAY	GRID ARRAY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.826 mm	4.826 mm	4.826 mm	3.937 mm	4.826 mm	3.937 mm	3.937 mm
Maximum slew rate	230 mA	175.45 mA	296.67 mA	230 mA	153.08 mA	153.08 mA	136.67 mA
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	PIN/PEG	THROUGH-HOLE	PIN/PEG	PIN/PEG
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	PERPENDICULAR	DUAL	PERPENDICULAR	PERPENDICULAR
width	22.86 mm	22.86 mm	22.86 mm	28.194 mm	22.86 mm	28.194 mm	28.194 mm
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches	1	1	1	1	1	1	1

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