KM75C104AP-25 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> KM75C104AP-25

KM75C104AP-25: DescriptionFIFO, 4KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28; Categorystorage storage; File Size34KB，1 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

Download Datasheet Parametric Compare View All

KM75C104AP-25 Overview

FIFO, 4KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28

KM75C104AP-25 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	DIP, DIP28,.6
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	25 ns
Other features	RETRANSMIT
Maximum clock frequency (fCLK)	28.6 MHz
period time	35 ns
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	37.1 mm
memory density	36864 bit
Memory IC Type	OTHER FIFO
memory width	9
Number of functions	1
Number of terminals	28
word count	4096 words
character code	4000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4KX9
Output characteristics	3-STATE
Exportable	NO
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum standby current	0.005 A
Maximum slew rate	0.12 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
Base Number Matches	1

Preview

Download Datasheet

View All

KM75C104AP-25 Related Products

	KM75C104AP-25	KM75C104AN-25	KM75C104AJ-25	KM75C104AP-35	KM75C104AP-20	KM75C104AJ-20	KM75C104AJ-35	KM75C104AN-20	KM75C104AN-35
Description	FIFO, 4KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	FIFO, 4KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	FIFO, 4KX9, 25ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32	FIFO, 4KX9, 35ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	FIFO, 4KX9, 20ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	FIFO, 4KX9, 20ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32	FIFO, 4KX9, 35ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32	FIFO, 4KX9, 20ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	FIFO, 4KX9, 35ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	QFJ	DIP	DIP	QFJ	QFJ	DIP	DIP
package instruction	DIP, DIP28,.6	DIP, DIP28,.3	QCCJ, LDCC32,.5X.6	DIP, DIP28,.6	DIP, DIP28,.6	QCCJ, LDCC32,.5X.6	QCCJ, LDCC32,.5X.6	DIP, DIP28,.3	DIP, DIP28,.3
Contacts	28	28	32	28	28	32	32	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	25 ns	25 ns	25 ns	35 ns	20 ns	20 ns	35 ns	20 ns	35 ns
Other features	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT
Maximum clock frequency (fCLK)	28.6 MHz	28.6 MHz	28.6 MHz	22.2 MHz	33.3 MHz	33.3 MHz	22.2 MHz	33.3 MHz	22.2 MHz
period time	35 ns	35 ns	35 ns	45 ns	30 ns	30 ns	45 ns	30 ns	45 ns
JESD-30 code	R-PDIP-T28	R-PDIP-T28	R-PQCC-J32	R-PDIP-T28	R-PDIP-T28	R-PQCC-J32	R-PQCC-J32	R-PDIP-T28	R-PDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	37.1 mm	34.29 mm	13.97 mm	37.1 mm	37.1 mm	13.97 mm	13.97 mm	34.29 mm	34.29 mm
memory density	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	9	9	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	28	28	32	28	28	32	32	28	28
word count	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words
character code	4000	4000	4000	4000	4000	4000	4000	4000	4000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	NO	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	QCCJ	DIP	DIP	QCCJ	QCCJ	DIP	DIP
Encapsulate equivalent code	DIP28,.6	DIP28,.3	LDCC32,.5X.6	DIP28,.6	DIP28,.6	LDCC32,.5X.6	LDCC32,.5X.6	DIP28,.3	DIP28,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	4.318 mm	3.55 mm	5.08 mm	5.08 mm	3.55 mm	3.55 mm	4.318 mm	4.318 mm
Maximum standby current	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A
Maximum slew rate	0.12 mA	0.12 mA	0.12 mA	0.1 mA	0.12 mA	0.12 mA	0.1 mA	0.12 mA	0.1 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	NO	NO	YES	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	QUAD	DUAL	DUAL	QUAD	QUAD	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	7.62 mm	11.43 mm	15.24 mm	15.24 mm	11.43 mm	11.43 mm	7.62 mm	7.62 mm
Base Number Matches	1	1	1	1	1	1	1	1	-

Recommended Resources

MCU controlled switch circuit design

CX20106/CX20106A (TV) infrared remote control receiving preamplifier circuit - DC characteristic test circuit

Crystal control signal source

Blood pressure detection circuit

Discrete component touch switch circuit diagram

LED flasher circuit

ID card reader PCB antenna design: [font=楷体, 楷体_GB2312][size=5]Hello masters, help!!! [/size][/font] [font=楷体, 楷体_GB2312][size=5]I am designing an ID card reader. The card reader and antenna are on the same module. The antenna is direc...; 梁旭辉 PCB Design

MT7603EN Supply: Original products, large quantities in stock, competitive prices. Contact: Mr. Zhu 13530694341 WeChat ID...; ZHUDIPING123 Mobile and portable

Driver packaging issues: I have three files, SYS, DLL and INF, of a USB device. I want to make them into an exe installation package. Is there any way or good tool to do this? . . ....; wanswer Embedded System

【Keysight Call for Papers】Agilent Network Analyzer Test Description Return loss S11 S21: 很多年前写的一份网络分析仪测试说明，那会刚刚开始做研发，接触很多测试仪器，对各种仪器操作不熟悉导致测试数据不准确，很容易重复进行各种测试，后来发现很多新来员工都有这个问题，于是乎就写了一份测试说明给新员工学习参考。網絡分析儀測試操作說明前置工作A. 熱機30分鐘B. Power Level 設-20dBmC.測試前先自定義CHAN1 用來顯示Reflection 波形CHAN2 用來顯示Tran...; sfwang666 Test/Measurement

What basics do novices need to learn PCB design, and how long does it take to get started?: I have a college degree, majoring in computer network, and have worked in SMT for a year. I am very interested in PCB design. I have a good understanding of electronics, circuits, and materials. I thi...; smthcy PCB Design

Call: In FPGA, how can I call the device I made in one project in another project?...; acetuo FPGA/CPLD

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components