KM75C104AN-20 datasheet, PDF - EEWORLD Datasheet

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KM75C104AN-20: DescriptionFIFO, 4KX9, 20ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28; Categorystorage storage; File Size34KB，1 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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KM75C104AN-20 Overview

FIFO, 4KX9, 20ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28

KM75C104AN-20 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	DIP, DIP28,.3
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	20 ns
Other features	RETRANSMIT
Maximum clock frequency (fCLK)	33.3 MHz
period time	30 ns
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	34.29 mm
memory density	36864 bit
Memory IC Type	OTHER FIFO
memory width	9
Number of functions	1
Number of terminals	28
word count	4096 words
character code	4000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4KX9
Output characteristics	3-STATE
Exportable	NO
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.318 mm
Maximum standby current	0.005 A
Maximum slew rate	0.12 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

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	KM75C104AN-20	KM75C104AN-25	KM75C104AJ-25	KM75C104AP-35	KM75C104AP-20	KM75C104AJ-20	KM75C104AP-25	KM75C104AJ-35	KM75C104AN-35
Description	FIFO, 4KX9, 20ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	FIFO, 4KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	FIFO, 4KX9, 25ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32	FIFO, 4KX9, 35ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	FIFO, 4KX9, 20ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	FIFO, 4KX9, 20ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32	FIFO, 4KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	FIFO, 4KX9, 35ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32	FIFO, 4KX9, 35ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	QFJ	DIP	DIP	QFJ	DIP	QFJ	DIP
package instruction	DIP, DIP28,.3	DIP, DIP28,.3	QCCJ, LDCC32,.5X.6	DIP, DIP28,.6	DIP, DIP28,.6	QCCJ, LDCC32,.5X.6	DIP, DIP28,.6	QCCJ, LDCC32,.5X.6	DIP, DIP28,.3
Contacts	28	28	32	28	28	32	28	32	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	20 ns	25 ns	25 ns	35 ns	20 ns	20 ns	25 ns	35 ns	35 ns
Other features	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT
Maximum clock frequency (fCLK)	33.3 MHz	28.6 MHz	28.6 MHz	22.2 MHz	33.3 MHz	33.3 MHz	28.6 MHz	22.2 MHz	22.2 MHz
period time	30 ns	35 ns	35 ns	45 ns	30 ns	30 ns	35 ns	45 ns	45 ns
JESD-30 code	R-PDIP-T28	R-PDIP-T28	R-PQCC-J32	R-PDIP-T28	R-PDIP-T28	R-PQCC-J32	R-PDIP-T28	R-PQCC-J32	R-PDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	34.29 mm	34.29 mm	13.97 mm	37.1 mm	37.1 mm	13.97 mm	37.1 mm	13.97 mm	34.29 mm
memory density	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	9	9	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	28	28	32	28	28	32	28	32	28
word count	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words
character code	4000	4000	4000	4000	4000	4000	4000	4000	4000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	NO	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	QCCJ	DIP	DIP	QCCJ	DIP	QCCJ	DIP
Encapsulate equivalent code	DIP28,.3	DIP28,.3	LDCC32,.5X.6	DIP28,.6	DIP28,.6	LDCC32,.5X.6	DIP28,.6	LDCC32,.5X.6	DIP28,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.318 mm	4.318 mm	3.55 mm	5.08 mm	5.08 mm	3.55 mm	5.08 mm	3.55 mm	4.318 mm
Maximum standby current	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A
Maximum slew rate	0.12 mA	0.12 mA	0.12 mA	0.1 mA	0.12 mA	0.12 mA	0.12 mA	0.1 mA	0.1 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	NO	NO	YES	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE	J BEND	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	QUAD	DUAL	DUAL	QUAD	DUAL	QUAD	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	11.43 mm	15.24 mm	15.24 mm	11.43 mm	15.24 mm	11.43 mm	7.62 mm
Base Number Matches	1	1	1	1	1	1	1	1	-

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