M74HC07TTR datasheet, PDF - EEWORLD Datasheet

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M74HC07TTR: DescriptionHEX BUFFER OPEN DRAIN; Categorylogic logic; File Size144KB，10 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M74HC07TTR Overview

HEX BUFFER OPEN DRAIN

M74HC07TTR Parametric

Parameter Name	Attribute value
Maker	STMicroelectronics
Parts packaging code	TSSOP
package instruction	TSSOP, TSSOP14,.25
Contacts	14
Reach Compliance Code	unknow
series	HC/UH
JESD-30 code	R-PDSO-G14
length	5 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUFFER
MaximumI(ol)	0.004 A
Number of functions	6
Number of entries	1
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	OPEN-DRAIN
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP14,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
power supply	2/6 V
Prop。Delay @ Nom-Su	27 ns
propagation delay (tpd)	135 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	4.5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
width	4.4 mm

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M74HC07

HEX BUFFER (OPEN DRAIN)

HIGH SPEED:

= 6ns (TYP.) at V

= 6V

LOW POWER DISSIPATION:

= 1µA(MAX.) at T

=25°C

HIGH NOISE IMMUNITY:

NIH

= V

NIL

= 28 % V

(MIN.)

WIDE OPERATING VOLTAGE RANGE:

(OPR) = 2V to 6V

PIN AND FUNCTION COMPATIBLE WITH

74 SERIES 07

DIP

SOP

TSSOP

ORDER CODES

PACKAGE

DIP

SOP

TSSOP

TUBE

M74HC07B1R

M74HC07M1R

T&R

M74HC07RM13TR

M74HC07TTR

DESCRIPTION

The M74HC07 is an high speed CMOS HEX

OPEN DRAIN BUFFER fabricated with silicon

gate C

MOS technology.

The internal circuit is composed of 2 stages

including buffer output, which enables high noise

immunity and stable output.

All inputs are equipped with protection circuits

against static discharge and transient excess

voltage.

PIN CONNECTION AND IEC LOGIC SYMBOLS

May 2003

1/10

M74HC07TTR Related Products

	M74HC07TTR	74HC07	M74HC07RM13TR
Description	HEX BUFFER OPEN DRAIN	HEX BUFFER OPEN DRAIN	HEX BUFFER OPEN DRAIN
Maker	STMicroelectronics	-	STMicroelectronics
Parts packaging code	TSSOP	-	SOIC
package instruction	TSSOP, TSSOP14,.25	-	SO-14
Contacts	14	-	14
Reach Compliance Code	unknow	-	compli
series	HC/UH	-	HC/UH
JESD-30 code	R-PDSO-G14	-	R-PDSO-G14
length	5 mm	-	8.65 mm
Load capacitance (CL)	50 pF	-	50 pF
Logic integrated circuit type	BUFFER	-	BUFFER
MaximumI(ol)	0.004 A	-	0.004 A
Number of functions	6	-	6
Number of entries	1	-	1
Number of terminals	14	-	14
Maximum operating temperature	125 °C	-	125 °C
Minimum operating temperature	-55 °C	-	-55 °C
Output characteristics	OPEN-DRAIN	-	OPEN-DRAIN
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	TSSOP	-	SOP
Encapsulate equivalent code	TSSOP14,.25	-	SOP14,.25
Package shape	RECTANGULAR	-	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE
power supply	2/6 V	-	2/6 V
Prop。Delay @ Nom-Su	27 ns	-	27 ns
propagation delay (tpd)	135 ns	-	135 ns
Certification status	Not Qualified	-	Not Qualified
Schmitt trigger	NO	-	NO
Maximum seat height	1.2 mm	-	1.75 mm
Maximum supply voltage (Vsup)	6 V	-	6 V
Minimum supply voltage (Vsup)	2 V	-	2 V
Nominal supply voltage (Vsup)	4.5 V	-	4.5 V
surface mount	YES	-	YES
technology	CMOS	-	CMOS
Temperature level	MILITARY	-	MILITARY
Terminal form	GULL WING	-	GULL WING
Terminal pitch	0.65 mm	-	1.27 mm
Terminal location	DUAL	-	DUAL
width	4.4 mm	-	3.9 mm

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