AND-OR-Invert Gate, TTL, CDIP14,
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| Reach Compliance Code | compliant |
| JESD-30 code | R-XDIP-T14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | AND-OR-INVERT GATE |
| MaximumI(ol) | 0.016 A |
| Humidity sensitivity level | 2A |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 250 |
| Prop。Delay @ Nom-Sup | 22 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| Base Number Matches | 1 |
| 5453DM | 7453PC | 7453FC | 74H53FC | 54H53DMQB | 7453DC | |
|---|---|---|---|---|---|---|
| Description | AND-OR-Invert Gate, TTL, CDIP14, | AND-OR-Invert Gate, TTL, PDIP14, | AND-OR-Invert Gate, TTL, CDFP14, | AND-OR-Invert Gate, TTL, CDFP14, | AND-OR-Invert Gate, TTL/H/L Series, 1-Func, 9-Input, TTL, CDIP14, CERAMIC, DIP-14 | AND-OR-Invert Gate, TTL, CDIP14, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| JESD-30 code | R-XDIP-T14 | R-PDIP-T14 | R-XDFP-F14 | R-XDFP-F14 | R-CDIP-T14 | R-XDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE |
| MaximumI(ol) | 0.016 A | 0.016 A | 0.016 A | 0.02 A | 0.02 A | 0.016 A |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C |
| Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC |
| encapsulated code | DIP | DIP | DFP | DFP | DIP | DIP |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | FL14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | FLATPACK | FLATPACK | IN-LINE | IN-LINE |
| Prop。Delay @ Nom-Sup | 22 ns | 22 ns | 22 ns | 11 ns | 11 ns | 22 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO | NO | NO |
| surface mount | NO | NO | YES | YES | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | - | Contains lead |
| Humidity sensitivity level | 2A | 2A | 2A | 2A | - | 2A |
| Peak Reflow Temperature (Celsius) | 250 | 250 | 250 | 250 | - | 250 |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | - | 30 |
| package instruction | - | DIP, DIP14,.3 | DFP, FL14,.3 | DFP, FL14,.3 | CERAMIC, DIP-14 | DIP, DIP14,.3 |
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