H5TC2G63DFR-RDI datasheet, PDF

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H5TC2G63DFR-RDI: DescriptionDDR DRAM, 128MX16, CMOS, PBGA96, FBGA-96; Categorystorage storage; File Size654KB，33 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/; Environmental Compliance

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H5TC2G63DFR-RDI Overview

DDR DRAM, 128MX16, CMOS, PBGA96, FBGA-96

H5TC2G63DFR-RDI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SK Hynix
package instruction	TFBGA,
Reach Compliance Code	unknown
access mode	MULTI BANK PAGE BURST
Other features	AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY
JESD-30 code	R-PBGA-B96
length	13 mm
memory density	2147483648 bit
Memory IC Type	DDR DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	96
word count	134217728 words
character code	128000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature
organize	128MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Maximum seat height	1.2 mm
self refresh	YES
Maximum supply voltage (Vsup)	1.45 V
Minimum supply voltage (Vsup)	1.283 V
Nominal supply voltage (Vsup)	1.35 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	20
width	7.5 mm
Base Number Matches	1

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2Gb DDR3L SDRAM

Lead-Free&Halogen-Free

(RoHS Compliant)

H5TC2G83DFR-xxA

H5TC2G83DFR-xxI

H5TC2G63DFR-xxA

H5TC2G63DFR-xxI

* SK Hynix reserves the right to change products or specifications without notice.

Rev. 1.2 / Nov. 2013

H5TC2G63DFR-RDI Related Products

	H5TC2G63DFR-RDI	H5TC2G63DFR-PBA	H5TC2G63DFR-G7I	H5TC2G63DFR-H9I	H5TC2G63DFR-G7A	H5TC2G63DFR-PBI	H5TC2G63DFR-H9A	H5TC2G63DFR-RDA
Description	DDR DRAM, 128MX16, CMOS, PBGA96, FBGA-96	DDR DRAM, 128MX16, 0.225ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96	DDR DRAM, 128MX16, 0.3ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96	DDR DRAM, 128MX16, 0.255ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96	DDR DRAM, 128MX16, 0.3ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96	DDR DRAM, 128MX16, 0.225ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96	DDR DRAM, 128MX16, 0.255ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96	DDR DRAM, 128MX16, CMOS, PBGA96, FBGA-96
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix
package instruction	TFBGA,	TFBGA, BGA96,9X16,32	TFBGA, BGA96,9X16,32	TFBGA, BGA96,9X16,32	TFBGA, BGA96,9X16,32	TFBGA, BGA96,9X16,32	TFBGA, BGA96,9X16,32	TFBGA,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
access mode	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST
Other features	AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY
JESD-30 code	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96
length	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm
memory density	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit
Memory IC Type	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
memory width	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1
Number of terminals	96	96	96	96	96	96	96	96
word count	134217728 words	134217728 words	134217728 words	134217728 words	134217728 words	134217728 words	134217728 words	134217728 words
character code	128000000	128000000	128000000	128000000	128000000	128000000	128000000	128000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
organize	128MX16	128MX16	128MX16	128MX16	128MX16	128MX16	128MX16	128MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	260
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
self refresh	YES	YES	YES	YES	YES	YES	YES	YES
Maximum supply voltage (Vsup)	1.45 V	1.45 V	1.45 V	1.45 V	1.45 V	1.45 V	1.45 V	1.45 V
Minimum supply voltage (Vsup)	1.283 V	1.283 V	1.283 V	1.283 V	1.283 V	1.283 V	1.283 V	1.283 V
Nominal supply voltage (Vsup)	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	INDUSTRIAL	INDUSTRIAL	OTHER	INDUSTRIAL	OTHER	OTHER
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	20	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	20
width	7.5 mm	7.5 mm	7.5 mm	7.5 mm	7.5 mm	7.5 mm	7.5 mm	7.5 mm
Base Number Matches	1	1	1	1	1	1	1	-
Parts packaging code	-	BGA	BGA	BGA	BGA	BGA	BGA	-
Contacts	-	96	96	96	96	96	96	-
ECCN code	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	-	0.225 ns	0.3 ns	0.255 ns	0.3 ns	0.225 ns	0.255 ns	-
Maximum clock frequency (fCLK)	-	800 MHz	533 MHz	667 MHz	533 MHz	800 MHz	667 MHz	-
I/O type	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	-
interleaved burst length	-	4,8	4,8	4,8	4,8	4,8	4,8	-
Output characteristics	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-
Encapsulate equivalent code	-	BGA96,9X16,32	BGA96,9X16,32	BGA96,9X16,32	BGA96,9X16,32	BGA96,9X16,32	BGA96,9X16,32	-
power supply	-	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	-
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
refresh cycle	-	8192	8192	8192	8192	8192	8192	-
Continuous burst length	-	4,8	4,8	4,8	4,8	4,8	4,8	-
Maximum standby current	-	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A	-
Maximum slew rate	-	0.22 mA	0.205 mA	0.21 mA	0.205 mA	0.22 mA	0.21 mA	-

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