ISD1112X datasheet, PDF - EEWORLD Datasheet

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ISD1112X: DescriptionSpeech Synthesizer With RCDG, 12s, CMOS, DIE-28; CategoryAnalog mixed-signal IC Consumption circuit; File Size283KB，32 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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ISD1112X Overview

Speech Synthesizer With RCDG, 12s, CMOS, DIE-28

ISD1112X Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Winbond Electronics Corporation
Parts packaging code	DIE
package instruction	DIE,
Contacts	28
Reach Compliance Code	unknown
application	CAR STEREO; HANDSET; TRANSFORMER
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-XUUC-N28
Number of functions	1
Number of terminals	28
On-chip memory type	EEPROM
Maximum operating temperature	50 °C
Minimum operating temperature
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum read time	12 s
Maximum supply voltage (Vsup)	6.5 V
Minimum supply voltage (Vsup)	4.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	UPPER
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

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ISD1100 SERIES

SINGLE-CHIP,

VOICE RECORD / PLAYBACK DEVICES

10- AND 12-SECOND DURATION

-1-

Publication Release Date: April 25, 2006

Revision 1.2

ISD1100 SERIES

4. TABLE OF CONTENTS

1. GENERAL DESCRIPTION.................................................................................................................. 2

2. FEATURES ......................................................................................................................................... 2

3. BLOCK DIAGRAM............................................................................................................................... 3

4. TABLE OF CONTENTS ...................................................................................................................... 4

5. PIN CONFIGURATION ....................................................................................................................... 5

6. PIN DESCRIPTION ............................................................................................................................. 6

7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10

7.1. Detailed Description.................................................................................................................... 10

8. TIMING DIAGRAMS.......................................................................................................................... 12

9. ABSOLUTE MAXIMUM RATINGS

[1]

................................................................................................ 13

9.1 Operating Conditions ................................................................................................................... 14

10. ELECTRICAL CHARACTERISTICS ............................................................................................... 15

10.1. Parameters For Packaged Parts .............................................................................................. 15

10.1.1. Typical Parameter Variation with Voltage and Temperature ............................................. 18

10.2. Parameters For DIE.................................................................................................................. 19

10.2.1. Typical Parameter Variation with Voltage and Temperature ............................................. 22

11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 23

12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 26

12.1. 28-Lead 300mil Plastic Small Outline IC (SOIC) ...................................................................... 26

12.2. 28-Lead 600mil Plastic Dual Inline Package (PDIP) ................................................................ 27

12.3. Die Physical Layout

[1]

............................................................................................................... 28

13. ORDERING INFORMATION........................................................................................................... 30

14. VERSION HISTORY ....................................................................................................................... 31

-4-

ISD1112X Related Products

	ISD1112X	ISD1112P	ISD1112PY	ISD1112S	ISD1110PY	ISD1110SY
Description	Speech Synthesizer With RCDG, 12s, CMOS, DIE-28	Speech Synthesizer With RCDG, 12s, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	Speech Synthesizer With RCDG, 12s, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28	Speech Synthesizer With RCDG, 12s, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28	Speech Synthesizer With RCDG, 10s, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28	Speech Synthesizer With RCDG, 10s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28
Is it Rohs certified?	incompatible	incompatible	conform to	incompatible	conform to	conform to
Parts packaging code	DIE	DIP	DIP	SOIC	DIP	SOIC
package instruction	DIE,	DIP, DIP28,.6	DIP, DIP28,.6	SOP, SOP28,.4	DIP, DIP28,.6	SOP, SOP28,.4
Contacts	28	28	28	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
application	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-XUUC-N28	R-PDIP-T28	R-PDIP-T28	R-PDSO-G28	R-PDIP-T28	R-PDSO-G28
Number of functions	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28
On-chip memory type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
Maximum operating temperature	50 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIE	DIP	DIP	SOP	DIP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	240	NOT SPECIFIED	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum read time	12 s	12 s	12 s	12 s	10 s	10 s
Maximum supply voltage (Vsup)	6.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
surface mount	YES	NO	NO	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING
Terminal location	UPPER	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	30	NOT SPECIFIED	40
Base Number Matches	1	1	1	1	1	1
Maker	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	-	-
length	-	36.83 mm	36.83 mm	17.93 mm	36.83 mm	17.93 mm
Encapsulate equivalent code	-	DIP28,.6	DIP28,.6	SOP28,.4	DIP28,.6	SOP28,.4
power supply	-	5 V	5 V	5 V	5 V	5 V
Maximum seat height	-	4.83 mm	4.83 mm	2.64 mm	4.83 mm	2.64 mm
Maximum slew rate	-	30 mA	30 mA	30 mA	30 mA	30 mA
Terminal pitch	-	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm
width	-	15.24 mm	15.24 mm	7.52 mm	15.24 mm	7.52 mm

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Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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