Decoder/Driver, HC/UH Series, Inverted Output, CMOS, CDIP16
| Parameter Name | Attribute value |
| package instruction | , |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| series | HC/UH |
| JESD-30 code | R-CDIP-T16 |
| JESD-609 code | e4 |
| Load capacitance (CL) | 50 pF |
| Number of functions | 2 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output polarity | INVERTED |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| propagation delay (tpd) | 27 ns |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | GOLD |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| total dose | 100k Rad(Si) V |
| Base Number Matches | 1 |
| 5962R9580401VEC | HCS139DMSR | HCS139K/SAMPLE | HCS139D/SAMPLE | 5962R9580401VXC | HCS139HMSR | |
|---|---|---|---|---|---|---|
| Description | Decoder/Driver, HC/UH Series, Inverted Output, CMOS, CDIP16 | Decoder/Driver, HC/UH Series, Inverted Output, CMOS, CDIP16 | Decoder/Driver, HC/UH Series, Inverted Output, CMOS, CDFP16 | Decoder/Driver, HC/UH Series, Inverted Output, CMOS, CDIP16 | Decoder/Driver, HC/UH Series, Inverted Output, CMOS, CDFP16 | Decoder/Driver, HC/UH Series, Inverted Output, CMOS |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| series | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 code | R-CDIP-T16 | R-CDIP-T16 | R-CDFP-F16 | R-CDIP-T16 | R-CDFP-F16 | X-XUUC-N16 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Number of functions | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 |
| Output polarity | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED |
| Package form | IN-LINE | IN-LINE | FLATPACK | IN-LINE | FLATPACK | UNCASED CHIP |
| propagation delay (tpd) | 27 ns | 27 ns | 27 ns | 27 ns | 27 ns | 27 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | NO LEAD |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | UPPER |
| Maximum operating temperature | 125 °C | 125 °C | - | - | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | - | - | -55 °C | -55 °C |
| Temperature level | MILITARY | MILITARY | - | - | MILITARY | MILITARY |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
| Maker | - | Harris | Harris | Harris | - | Harris |