Y5V Dielectric
General Specifications
Y5V formulations are for general-purpose use in a limited
temperature range. They have a wide temperature character-
istic of +22% –82% capacitance change over the operating
temperature range of –30°C to +85°C.
Y5V’s high dielectric constant allows the manufacture of the
highest capacitance value in a given case size.
These characteristics make Y5V ideal for decoupling applica-
tions within limited temperature range.
PART NUMBER (see page 3 for complete part number explanation)
0805
Size
(L" x W")
3
Voltage
10V = Z
16V = Y
25V = 3
50V = 5
G
Dielectric
Y5V = G
104
Capacitance
Code
Z
Capacitance
Tolerance
Z = +80 –20%
A
Failure
Rate
A = Not
Applicable
T
Terminations
T = Plated Ni
and Solder
2
Packaging
2 = 7" Reel
4 = 13" Reel
A
Special
Code
A = Std.
Product
PERFORMANCE CHARACTERISTICS
Capacitance Range
Capacitance Tolerances
Operating Temperature Range
Temperature Characteristic
Voltage Ratings
Dissipation Factor
2200 pF to 22 µF
+80 –20%
–30°C to +85°C
+22% to –82% max. within operating temperature
10, 16, 25 and 50 VDC (+85°C)
For 50 volts: 5.0% max.
For 16 and 25 volts: 7% max.
For 10 volts: 10% max.
10,000 megohms min. or 1000 MΩ - µF min., whichever is less
250% of rated voltage for 5 seconds at 50 mamp max. current
1.0 Vrms ± 0.2 Vrms
1 KHz
Insulation Resistance
(+25°C, RVDC)
Dielectric Strength
Test Voltage
Test Frequency
16
Y5V Dielectric
Typical Characteristic Curves**
Temperature Coefficient
+20
+10
0
-10
-20
-30
-40
-50
-60
-70
-80
-55
-35 -15
+5 +25 +45 +65 +85 +105 +125
10,000
1,000
0.1 F - 0603
Impedance vs. Frequency
Capacitance
|Z| (Ohms)
100
10
1
0.1
0.01
10,000
%
100,000
1,000,000
10,000,000
Temperature
°C
Frequency (Hz)
Capacitance Change
vs. DC Bias Voltage
+40
+20
0
-20
-40
-60
-80
-100
0
20
40
60
80
100
0.22 F - 0805
Impedance vs. Frequency
1,000
100
|Z| (Ohms)
c/c (%)
10
1
0.1
0.01
10,000
100,000
1,000,000
10,000,000
DC Bias Voltage
Frequency (Hz)
Insulation Resistance (Ohm-Farads)
Insulation Resistance vs. Temperature
10,000
1,000
100
1 F - 1206
Impedance vs. Frequency
1,000
|Z| (Ohms)
+20
+30
+40
+50
+60
+70
+80 +85
10
1
0.1
100
0
Temperature
°C
0.01
10,000
100,000
1,000,000
10,000,000
Frequency (Hz)
SUMMARY OF CAPACITANCE RANGES VS. CHIP SIZE
Style
0402*
0603*
0805*
1206*
1210*
1812*
1825*
2220
2225
10V
2.2nF - 0.1µF
2.2nF - 1µF
10nF - 4.7µF
10nF - 10µF
10nF - 22µF
¡
¡
—
¡
16V
2.2nF - 0.1µF
2.2nF - 0.33µF
10nF - 2.2µF
10nF - 4.7µF
0.1µF - 10µF
¡
¡
—
¡
25V
2.2nF - 22nF
2.2nF - 0.22µF
10nF - 1µF
10nF - 2.2µF
0.1µF - 4.7µF
0.15µF - 1.5µF
0.47µF - 1.5µF
—
0.68µF - 2.2µF
50V
2.2nF - 10nF
2.2nF - 56nF
10nF - 0.33µF
10nF - 1µF
0.1µF - 1µF
1.5nF - 1.5µF
0.47µF - 1.5µF
1µF - 1.5µF
0.68µF - 1.5µF
* Standard Sizes
** For additional information on performance changes with operating conditions consult AVX’s software SpiCap.
17
Y5V Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Standard Reel
Packaging
(L) Length
(W) Width
(T) Max. Thickness
(t) Terminal
WVDC
Cap
(pF)
3900
4700
5600
6800
8200
Cap
(µF)
.01
.012
.015
.018
.022
.027
.033
.039
.047
.056
.068
.082
.10
.12
.15
.18
.22
.27
.33
.39
.47
.56
.68
.82
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10.0
12.0
15.0
18.0
22.0
2200
2700
3300
MM
(in.)
MM
(in.)
MM
(in.)
MM
(in.)
10
0402*
All Paper
1.00 ± .10
(.040 ± .004)
.50 ± .10
(.020 ± .004)
.60
(.024)
.25 ± .15
(.010 ± .006)
16
25
50
10
0603*
All Paper
1.60 ± .15
(.063 ± .006)
.81 ± .15
(.032 ± .006)
.90
(.035)
.35 ± .15
(.014 ± .006)
16
25
50
10
0805
1206
1210
1812*
All Embossed
4.50 ± .30
(.177 ± .012)
3.20 ± .20
(.126 ± .008)
1.70
(.067)
.61 ± .36
(.024 ± .014)
50
25
50
1825*
All Embossed
4.50 ± .30
(.252 ± .016)
6.40 ± .40
(.252 ± .016)
1.70
(.067)
.61 ± .36
(.024 ± .014)
25
50
2220*
All Embossed
5.7 ± 0.4
(.225 ± .016)
5.0 ± 0.4
(.197 ± .016)
2.30
(.090)
.64 ± .39
(.025 ± .015)
50
2225*
All Embossed
5.72 ± .25
(.225 ± .010)
6.35 ± .25
(.250 ± .010)
1.70
(.067)
.64 ± .39
(.025 ± .015)
25
50
Paper/Embossed Paper/Embossed Paper/Embossed
2.01 ± .20
(.079 ± .008)
1.25 ± .20
(.049 ± .008)
1.30
(.051)
.50 ± .25
(.020 ± .010)
16
25
50
10
3.20 ± .20
(.126 ± .008)
1.60 ± .20
(.063 ± .008)
1.50
(.059)
.50 ± .25
(.020 ± .010)
16
25
50
3.20 ± .20
(.126 ± .008)
2.50 ± .20
(.098 ± .008)
1.70
(.067)
.50 ± .25
(.020 ± .010)
10
16
25
L
W
T
t
*Reflow soldering only.
= Paper Tape
NOTES:
For low profile product, see page 19.
= Embossed Tape
18
How to Order
Part Number Explanation
EXAMPLE: 08055A101JAT2A
0805
Size
(L" x W")
0402
0504
0603
0805
1005
0907
1206
1210
1505
1805
1808
1812
1825
2225
3640
5
A
Dielectric
C0G (NP0) = A
X7R = C
X5R = D
Z5U = E
Y5V = G
101
J
Capacitance
Tolerance
= ±.25 pF*
= ±.50 pF*
= ±1% (≥ 25 pF)
= ±2% (≥ 13 pF)
= ±5%
= ±10%
= ±20%
= +80%, -20%
= +100%, -0%
A
T
Terminations
2
A
Special**
Code
A = Standard
Product
Non-Standard
P = Embossed
unmarked
M = Embossed
marked
E = Standard
packaging
marked
Low Profile
Chips Only
Max. Thickness
T = .66mm (.026")
S = .56mm (.022")
R = .46mm (.018")
C
D
F
G
J
K
M
Z
P
Standard:
T = Ni and Tin
Plated
Others:
7 = Plated Ni
Gold Plated
1 = Pd/Ag
Voltage
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
250V = V
500V = 7
600V = C
1000V = A
1500V = S
2000V = G
2500V = W
3000V = H
4000V = J
5000V = K
Capacitance
Code
(2 significant
digits + no. of
zeros)
Examples:
10 pF = 100
100 pF = 101
1,000 pF = 102
22,000 pF = 223
220,000 pF = 224
1 µF = 105
For values below 10 pF,
use “R” in place of
decimal point, e.g., 9.1
pfd = 9R1.
Failure
Rate
A = Not
Applicable
Packaging**
Recommended:
2 =7" Reel
4 =13" Reel
Others:
7 = Bulk Cassette
9 = Bulk
* C&D tolerances for 10 pF values.
** Standard Tape and Reel material depends upon chip size and thickness.
See individual part tables for tape material type for each capacitance value.
Note: Unmarked product is standard. Marked product is available on special request, please contact AVX.
Standard packaging is shown in the individual tables.
Non-standard packaging is available on special request, please contact AVX.
3
Surface Mounting Guide
MLC Chip Capacitors
Component Pad Design
Component pads should be designed to achieve good sol-
der filets and minimize component movement during reflow
soldering. Pad designs are given below for the most com-
mon sizes of multilayer ceramic capacitors for both wave
and reflow soldering. The basis of these designs is:
• Pad width equal to component width. It is permissible to
decrease this to as low as 85% of component width but it
is not advisable to go below this.
• Pad overlap 0.5mm beneath component.
• Pad extension 0.5mm beyond components for reflow and
1.0mm for wave soldering.
REFLOW SOLDERING
Case Size
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
D1
1.70 (0.07)
2.30 (0.09)
3.00 (0.12)
4.00 (0.16)
4.00 (0.16)
5.60 (0.22)
5.60 (0.22)
5.60 (0.22)
6.60 (0.26)
6.60 (0.26)
D2
0.60 (0.02)
0.80 (0.03)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04))
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
D3
0.50 (0.02)
0.70 (0.03)
1.00 (0.04)
2.00 (0.09)
2.00 (0.09)
3.60 (0.14)
3.60 (0.14)
3.60 (0.14)
4.60 (0.18)
4.60 (0.18)
D4
0.60 (0.02)
0.80 (0.03)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
D5
0.50 (0.02)
0.75 (0.03)
1.25 (0.05)
1.60 (0.06)
2.50 (0.10)
2.00 (0.08)
3.00 (0.12)
6.35 (0.25)
5.00 (0.20)
6.35 (0.25)
D2
D1
D3
D4
D5
Dimensions in millimeters (inches)
41
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