TP3321J/A+ datasheet, PDF - EEWORLD Datasheet

TP3321J/A+: DescriptionIC,MODEM CIRCUIT,MODEM,CMOS,DIP,20PIN,CERAMIC; CategoryWireless rf/communication Telecom circuit; File Size743KB，11 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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TP3321J/A+ Overview

IC,MODEM CIRCUIT,MODEM,CMOS,DIP,20PIN,CERAMIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP20,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T20
JESD-609 code	e0
Number of terminals	20
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
surface mount	NO
technology	CMOS
Telecom integrated circuit types	MODEM
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

	TP3321J/A+	TP3320J	TP3320J/A+	TP3321J
Description	IC,MODEM CIRCUIT,MODEM,CMOS,DIP,20PIN,CERAMIC	1.2kbps DATA, MODEM, CDIP20, CERDIP-20	IC,MODEM CIRCUIT,MODEM,CMOS,DIP,20PIN,CERAMIC	1.2kbps DATA, MODEM, CDIP20, CERDIP-20
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T20	R-GDIP-T20	R-XDIP-T20	R-GDIP-T20
JESD-609 code	e0	e0	e0	e0
Number of terminals	20	20	20	20
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC	CERAMIC, GLASS-SEALED	CERAMIC	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Telecom integrated circuit types	MODEM	MODEM	MODEM	MODEM
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	-

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