IC,FIFO,64X9,ASYNCHRONOUS,ACT-CMOS,LLCC,28PIN,CERAMIC
| Parameter Name | Attribute value |
| Maker | Texas Instruments |
| package instruction | QCCN, LCC28,.45SQ |
| Reach Compliance Code | unknown |
| JESD-30 code | S-XQCC-N28 |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Number of terminals | 28 |
| word count | 64 words |
| character code | 64 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 64X9 |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC28,.45SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.01 A |
| Maximum slew rate | 0.15 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| 54ACT708LM | 54ACT708FM | 54ACT708DM | 74ACT708PC | 74AC708PC | |
|---|---|---|---|---|---|
| Description | IC,FIFO,64X9,ASYNCHRONOUS,ACT-CMOS,LLCC,28PIN,CERAMIC | IC,FIFO,64X9,ASYNCHRONOUS,ACT-CMOS,FP,28PIN,CERAMIC | IC,FIFO,64X9,ASYNCHRONOUS,ACT-CMOS,DIP,28PIN,CERAMIC | IC,FIFO,64X9,ASYNCHRONOUS,ACT-CMOS,DIP,28PIN,PLASTIC | IC,FIFO,64X9,ASYNCHRONOUS,AC-CMOS,LDCC,28PIN,PLASTIC |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | QCCN, LCC28,.45SQ | DFP, FL28(UNSPEC) | DIP, DIP28,.6 | DIP, DIP28,.6 | QCCJ, LDCC28,.5SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | S-XQCC-N28 | R-XDFP-F28 | R-XDIP-T28 | R-PDIP-T28 | S-PQCC-J28 |
| Memory IC Type | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| memory width | 9 | 9 | 9 | 9 | 9 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 |
| word count | 64 words | 64 words | 64 words | 64 words | 64 words |
| character code | 64 | 64 | 64 | 64 | 64 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C |
| organize | 64X9 | 64X9 | 64X9 | 64X9 | 64X9 |
| Package body material | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCN | DFP | DIP | DIP | QCCJ |
| Encapsulate equivalent code | LCC28,.45SQ | FL28(UNSPEC) | DIP28,.6 | DIP28,.6 | LDCC28,.5SQ |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | CHIP CARRIER | FLATPACK | IN-LINE | IN-LINE | CHIP CARRIER |
| power supply | 5 V | 5 V | 5 V | 5 V | 3.3/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A |
| Maximum slew rate | 0.15 mA | 0.15 mA | 0.15 mA | 0.15 mA | 0.15 mA |
| surface mount | YES | YES | NO | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL |
| Terminal form | NO LEAD | FLAT | THROUGH-HOLE | THROUGH-HOLE | J BEND |
| Terminal location | QUAD | DUAL | DUAL | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | - |
| Terminal pitch | 1.27 mm | - | 2.54 mm | 2.54 mm | 1.27 mm |
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