54ACT708FM datasheet, PDF - EEWORLD Datasheet

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54ACT708FM: DescriptionIC,FIFO,64X9,ASYNCHRONOUS,ACT-CMOS,FP,28PIN,CERAMIC; Categorystorage storage; File Size943KB，18 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54ACT708FM Overview

IC,FIFO,64X9,ASYNCHRONOUS,ACT-CMOS,FP,28PIN,CERAMIC

54ACT708FM Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
package instruction	DFP, FL28(UNSPEC)
Reach Compliance Code	unknown
JESD-30 code	R-XDFP-F28
Memory IC Type	OTHER FIFO
memory width	9
Number of terminals	28
word count	64 words
character code	64
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64X9
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL28(UNSPEC)
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.01 A
Maximum slew rate	0.15 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal location	DUAL
Base Number Matches	1

54ACT708FM Related Products

	54ACT708FM	54ACT708DM	54ACT708LM	74ACT708PC	74AC708PC
Description	IC,FIFO,64X9,ASYNCHRONOUS,ACT-CMOS,FP,28PIN,CERAMIC	IC,FIFO,64X9,ASYNCHRONOUS,ACT-CMOS,DIP,28PIN,CERAMIC	IC,FIFO,64X9,ASYNCHRONOUS,ACT-CMOS,LLCC,28PIN,CERAMIC	IC,FIFO,64X9,ASYNCHRONOUS,ACT-CMOS,DIP,28PIN,PLASTIC	IC,FIFO,64X9,ASYNCHRONOUS,AC-CMOS,LDCC,28PIN,PLASTIC
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DFP, FL28(UNSPEC)	DIP, DIP28,.6	QCCN, LCC28,.45SQ	DIP, DIP28,.6	QCCJ, LDCC28,.5SQ
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDFP-F28	R-XDIP-T28	S-XQCC-N28	R-PDIP-T28	S-PQCC-J28
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	9	9	9	9	9
Number of terminals	28	28	28	28	28
word count	64 words	64 words	64 words	64 words	64 words
character code	64	64	64	64	64
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-40 °C	-40 °C
organize	64X9	64X9	64X9	64X9	64X9
Package body material	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DFP	DIP	QCCN	DIP	QCCJ
Encapsulate equivalent code	FL28(UNSPEC)	DIP28,.6	LCC28,.45SQ	DIP28,.6	LDCC28,.5SQ
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE
Package form	FLATPACK	IN-LINE	CHIP CARRIER	IN-LINE	CHIP CARRIER
power supply	5 V	5 V	5 V	5 V	3.3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.01 A	0.01 A	0.01 A	0.01 A	0.01 A
Maximum slew rate	0.15 mA	0.15 mA	0.15 mA	0.15 mA	0.15 mA
surface mount	YES	NO	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL
Terminal form	FLAT	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	J BEND
Terminal location	DUAL	DUAL	QUAD	DUAL	QUAD
Base Number Matches	1	1	1	1	1
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	-
Terminal pitch	-	2.54 mm	1.27 mm	2.54 mm	1.27 mm

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