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54F08DMQB

Description
AND Gate, TTL, CDIP14,
Categorylogic    logic   
File Size109KB,8 Pages
Manufacturere2v technologies
Download Datasheet Parametric Compare View All

54F08DMQB Overview

AND Gate, TTL, CDIP14,

54F08DMQB Parametric

Parameter NameAttribute value
package instructionDIP, DIP14,.3
Reach Compliance Codecompliant
Other featuresLG_MAX
seriesF/FAST
JESD-30 codeR-GDIP-T14
length19.939 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeAND GATE
MaximumI(ol)0.02 A
Number of functions4
Number of entries2
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Prop。Delay @ Nom-Sup7.5 ns
propagation delay (tpd)7.5 ns
Certification statusNot Qualified
Schmitt triggerNO
Filter levelMIL-STD-883
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm
Base Number Matches1
54F/74F08 Quad 2-Input AND Gate
54F/74F08
December 1994
54F/74F08
Quad 2-Input AND Gate
General Description
This device contains four independent gates, each of which
performs the logic AND function.
Features
n
Guaranteed 4000V minimum ESD protection
Ordering Code:
Commercial
74F08PC
See Section 0
Military
Package
Number
N14A
54F08DM (Note 2)
J14A
M14A
M14D
54F08FM (Note 2)
54F08LM (Note 2)
W14B
E20A
14-Lead (0.300" Wide) Molded Dual-In-Line
14-Lead Ceramic Dual-In-Line
14-Lead (0.150" Wide) Molded Small Outline, JEDEC
14-Lead (0.300" Wide) Molded Small Outline, EIAJ
14-Lead Cerpack
20-Lead Ceramic Leadless Chip Carrier, Type C
Package Description
DSXXX
74F08SC (Note 1)
74F08SJ (Note 1)
Note 1:
Devices also available in 13" reel. Use suffix = SCX and SJX.
Note 2:
Military grade device with environmental and burn-in processing. Use suffix = DMQB, FMQB and LMQB.
Logic Symbol
IEEE/IEC
DS009457-3
Connection Diagrams
Pin Assignment
for DIP, SOIC and Flatpak
Pin Assignment
for LCC
DS009457-2
DS009457-1
TRI-STATE
®
is a registered trademark of National Semiconductor Corporation.
© 1997 National Semiconductor Corporation
DS009457
www.national.com
1
PrintDate=1997/08/26 PrintTime=15:23:43 9460 ds009457 Rev. No. 1
cmserv
Proof
1

54F08DMQB Related Products

54F08DMQB 54F08FMQB JD54F08BCA
Description AND Gate, TTL, CDIP14, AND Gate, TTL, CDFP14 AND Gate, F/FAST Series, 4-Func, 2-Input, TTL, PACKAGE
package instruction DIP, DIP14,.3 DFP-14 ,
Reach Compliance Code compliant compliant compliant
series F/FAST F/FAST F/FAST
Logic integrated circuit type AND GATE AND GATE AND GATE
Number of functions 4 4 4
Number of entries 2 2 2
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
propagation delay (tpd) 7.5 ns 7.5 ns 7.5 ns
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
technology TTL TTL TTL
Temperature level MILITARY MILITARY MILITARY
Base Number Matches 1 1 1
Other features LG_MAX LG_MAX -
JESD-30 code R-GDIP-T14 R-GDFP-F14 -
length 19.939 mm 9.779 mm -
Load capacitance (CL) 50 pF 50 pF -
MaximumI(ol) 0.02 A 0.02 A -
Number of terminals 14 14 -
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED -
encapsulated code DIP DFP -
Encapsulate equivalent code DIP14,.3 FL14,.25 -
Package shape RECTANGULAR RECTANGULAR -
Package form IN-LINE FLATPACK -
power supply 5 V 5 V -
Prop。Delay @ Nom-Sup 7.5 ns 7.5 ns -
Certification status Not Qualified Not Qualified -
Schmitt trigger NO NO -
Filter level MIL-STD-883 MIL-STD-883 -
Maximum seat height 5.08 mm 2.032 mm -
surface mount NO YES -
Terminal form THROUGH-HOLE FLAT -
Terminal pitch 2.54 mm 1.27 mm -
Terminal location DUAL DUAL -
width 7.62 mm 6.2865 mm -
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