54F08FMQB datasheet, PDF - EEWORLD Datasheet

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54F08FMQB: DescriptionAND Gate, TTL, CDFP14; Categorylogic logic; File Size109KB，8 Pages; Manufacturere2v technologies

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54F08FMQB Overview

AND Gate, TTL, CDFP14

54F08FMQB Parametric

Parameter Name	Attribute value
Maker	e2v technologies
package instruction	DFP-14
Reach Compliance Code	compliant
Other features	LG_MAX
series	F/FAST
JESD-30 code	R-GDFP-F14
length	9.779 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	AND GATE
MaximumI(ol)	0.02 A
Number of functions	4
Number of entries	2
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DFP
Encapsulate equivalent code	FL14,.25
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5 V
Prop。Delay @ Nom-Sup	7.5 ns
propagation delay (tpd)	7.5 ns
Certification status	Not Qualified
Schmitt trigger	NO
Filter level	MIL-STD-883
Maximum seat height	2.032 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	TTL
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
width	6.2865 mm
Base Number Matches	1

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54F/74F08 Quad 2-Input AND Gate

54F/74F08

December 1994

54F/74F08

Quad 2-Input AND Gate

General Description

This device contains four independent gates, each of which

performs the logic AND function.

Features

Guaranteed 4000V minimum ESD protection

Ordering Code:

Commercial

74F08PC

See Section 0

Military

Package

Number

N14A

54F08DM (Note 2)

J14A

M14A

M14D

54F08FM (Note 2)

54F08LM (Note 2)

W14B

E20A

14-Lead (0.300" Wide) Molded Dual-In-Line

14-Lead Ceramic Dual-In-Line

14-Lead (0.150" Wide) Molded Small Outline, JEDEC

14-Lead (0.300" Wide) Molded Small Outline, EIAJ

14-Lead Cerpack

20-Lead Ceramic Leadless Chip Carrier, Type C

Package Description

DSXXX

74F08SC (Note 1)

74F08SJ (Note 1)

Note 1:

Devices also available in 13" reel. Use suffix = SCX and SJX.

Note 2:

Military grade device with environmental and burn-in processing. Use suffix = DMQB, FMQB and LMQB.

Logic Symbol

IEEE/IEC

DS009457-3

Connection Diagrams

Pin Assignment

for DIP, SOIC and Flatpak

Pin Assignment

for LCC

DS009457-2

DS009457-1

TRI-STATE

is a registered trademark of National Semiconductor Corporation.

DS009457

www.national.com

PrintDate=1997/08/26 PrintTime=15:23:43 9460 ds009457 Rev. No. 1

cmserv

Proof

54F08FMQB Related Products

	54F08FMQB	JD54F08BCA	54F08DMQB
Description	AND Gate, TTL, CDFP14	AND Gate, F/FAST Series, 4-Func, 2-Input, TTL, PACKAGE	AND Gate, TTL, CDIP14,
package instruction	DFP-14	,	DIP, DIP14,.3
Reach Compliance Code	compliant	compliant	compliant
series	F/FAST	F/FAST	F/FAST
Logic integrated circuit type	AND GATE	AND GATE	AND GATE
Number of functions	4	4	4
Number of entries	2	2	2
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C
propagation delay (tpd)	7.5 ns	7.5 ns	7.5 ns
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
technology	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	MILITARY
Base Number Matches	1	1	1
Other features	LG_MAX	-	LG_MAX
JESD-30 code	R-GDFP-F14	-	R-GDIP-T14
length	9.779 mm	-	19.939 mm
Load capacitance (CL)	50 pF	-	50 pF
MaximumI(ol)	0.02 A	-	0.02 A
Number of terminals	14	-	14
Package body material	CERAMIC, GLASS-SEALED	-	CERAMIC, GLASS-SEALED
encapsulated code	DFP	-	DIP
Encapsulate equivalent code	FL14,.25	-	DIP14,.3
Package shape	RECTANGULAR	-	RECTANGULAR
Package form	FLATPACK	-	IN-LINE
power supply	5 V	-	5 V
Prop。Delay @ Nom-Sup	7.5 ns	-	7.5 ns
Certification status	Not Qualified	-	Not Qualified
Schmitt trigger	NO	-	NO
Filter level	MIL-STD-883	-	MIL-STD-883
Maximum seat height	2.032 mm	-	5.08 mm
surface mount	YES	-	NO
Terminal form	FLAT	-	THROUGH-HOLE
Terminal pitch	1.27 mm	-	2.54 mm
Terminal location	DUAL	-	DUAL
width	6.2865 mm	-	7.62 mm

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