70T3539MS133BCGI datasheet, PDF

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70T3539MS133BCGI: DescriptionCABGA-256, Tray; Categorystorage storage; File Size629KB，27 Pages; ManufacturerIDT (Integrated Device Technology); Environmental Compliance

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70T3539MS133BCGI Overview

CABGA-256, Tray

70T3539MS133BCGI Parametric

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	IDT (Integrated Device Technology)
Parts packaging code	CABGA
package instruction	BGA, BGA256,16X16,40
Contacts	256
Manufacturer packaging code	BCG256
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Samacsys Description	CHIP ARRAY BGA 17.0 X 1.7.0 MM X 1.0 MM
Maximum access time	15 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	133 MHz
I/O type	COMMON
JESD-30 code	S-PBGA-B256
JESD-609 code	e1
memory density	18874368 bit
Memory IC Type	APPLICATION SPECIFIC SRAM
memory width	36
Humidity sensitivity level	3
Number of functions	1
Number of ports	2
Number of terminals	256
word count	524288 words
character code	512000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA256,16X16,40
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	2.5,2.5/3.3 V
Certification status	Not Qualified
Maximum standby current	0.025 A
Minimum standby current	2.4 V
Maximum slew rate	0.9 mA
Maximum supply voltage (Vsup)	2.6 V
Minimum supply voltage (Vsup)	2.4 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
Base Number Matches	1

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HIGH-SPEED 2.5V

512K x 36

SYNCHRONOUS

DUAL-PORT STATIC RAM

WITH 3.3V OR 2.5V INTERFACE

Features:

◆

70T3539M

◆

True Dual-Port memory cells which allow simultaneous

access of the same memory location

High-speed data access

– Commercial: 3.6ns (166MHz)/4.2ns (133MHz)(max.)

– Industrial: 4.2ns (133MHz) (max.)

Selectable Pipelined or Flow-Through output mode

Counter enable and repeat features

Dual chip enables allow for depth expansion without

additional logic

Interrupt and Collision Detection Flags

Full synchronous operation on both ports

– 6ns cycle time, 166MHz operation (12Gbps bandwidth)

– Fast 3.6ns clock to data out

– 1.5ns setup to clock and 0.5ns hold on all control, data, and

address inputs @ 166MHz

◆

– Data input, address, byte enable and control registers

– Self-timed write allows fast cycle time

Separate byte controls for multiplexed bus and bus

matching compatibility

Dual Cycle Deselect (DCD) for Pipelined Output Mode

2.5V (±100mV) power supply for core

LVTTL compatible, selectable 3.3V (±150mV) or 2.5V

(±100mV) power supply for I/Os and control signals on

each port

Includes JTAG functionality

Industrial temperature range (-40°C to +85°C) is

available at 133MHz

Available in a 256-pin Ball Grid Array (BGA)

Green parts available, see ordering information

Functional Block Diagram

FT/PIPE

1/0

0a 1a

0b 1b

0c 1c

0d 1d

1d 0d

1c 0c

1b 0b

1a 0a

1/0

FT/PIPE

R/W

1/0

B B

0 1

L L

B B B

WWW

2 3 3

L L R

B B

1 0

R R

1/0

Dout0-8_L

Dout9-17_L

Dout18-26_L

Dout27-35_L

Dout0-8_R

Dout9-17_R

Dout18-26_R

Dout27-35_R

1d 0d 1c 0c 1b 0b 1a 0a

0a 1a 0b 1b 0c 1c 0d 1d

0/1

FT/PIPE

0/1

a bc d

dcba

512K x 36

MEMORY

ARRAY

I/O

- I/O

35L

Din_L

Din_R

I/O

- I/O

35R

CLK

18L

REPEAT

ADS

CNTEN

18R

CLK

Counter/

Address

Reg.

ADDR_L

ADDR_R

Counter/

Address

Reg.

REPEAT

ADS

CNTEN

TDI

TCK

TMS

TRST

0 L

CE1 L

INTERRUPT

COLLISION

DETECTION

LOGIC

0 R

CE1R

JTAG

TDO

COL

INT

COL

INT

(1)

CONTROL

LOGIC

(1)

5678 drw 01

NOTE:

1. The sleep mode pin shuts off all dynamic inputs, except JTAG inputs, when asserted. All static inputs, i.e., PL/FTx and OPTx and

the sleep mode pins themselves (ZZx) are not affected during sleep mode.

JUNE 2019

DSC 5678/10

70T3539MS133BCGI Related Products

	70T3539MS133BCGI	70T3539MS133BC	70T3539MS133BCG	70T3539MS166BC8	70T3539MS166BCG
Description	CABGA-256, Tray	CABGA-256, Tray	CABGA-256, Tray	CABGA-256, Reel	CABGA-256, Tray
Brand Name	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology
Is it lead-free?	Lead free	Contains lead	Lead free	Contains lead	Lead free
Is it Rohs certified?	conform to	incompatible	conform to	incompatible	conform to
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	CABGA	CABGA	CABGA	CABGA	CABGA
package instruction	BGA, BGA256,16X16,40	LBGA, BGA256,16X16,40	BGA, BGA256,16X16,40	LBGA, BGA256,16X16,40	LBGA, BGA256,16X16,40
Contacts	256	256	256	256	256
Manufacturer packaging code	BCG256	BC256	BCG256	BC256	BCG256
Reach Compliance Code	compliant	not_compliant	compliant	not_compliant	compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Samacsys Description	CHIP ARRAY BGA 17.0 X 1.7.0 MM X 1.0 MM	CHIP ARRAY BGA 17.0 X 1.7.0 MM X 1.0 MM	CHIP ARRAY BGA 17.0 X 1.7.0 MM X 1.0 MM	CHIP ARRAY BGA 17.0 X 1.7.0 MM X 1.0 MM	CHIP ARRAY BGA 17.0 X 1.7.0 MM X 1.0 MM
Maximum access time	15 ns	15 ns	15 ns	12 ns	12 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	133 MHz	133 MHz	133 MHz	166 MHz	166 MHz
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256
JESD-609 code	e1	e0	e1	e0	e1
memory density	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit
Memory IC Type	APPLICATION SPECIFIC SRAM	DUAL-PORT SRAM	APPLICATION SPECIFIC SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
memory width	36	36	36	36	36
Humidity sensitivity level	3	3	3	3	3
Number of functions	1	1	1	1	1
Number of ports	2	2	2	2	2
Number of terminals	256	256	256	256	256
word count	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	70 °C	70 °C
organize	512KX36	512KX36	512KX36	512KX36	512KX36
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	LBGA	BGA	LBGA	LBGA
Encapsulate equivalent code	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY, LOW PROFILE	GRID ARRAY	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	225	260	225	260
power supply	2.5,2.5/3.3 V	2.5,2.5/3.3 V	2.5,2.5/3.3 V	2.5,2.5/3.3 V	2.5,2.5/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.025 A	0.02 A	0.02 A	0.02 A	0.02 A
Minimum standby current	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V
Maximum slew rate	0.9 mA	0.74 mA	0.74 mA	0.9 mA	0.9 mA
Maximum supply voltage (Vsup)	2.6 V	2.6 V	2.6 V	2.6 V	2.6 V
Minimum supply voltage (Vsup)	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Lead (Sn63Pb37)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Lead (Sn63Pb37)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	30	20	30	20	30
Base Number Matches	1	1	1	1	1
length	-	17 mm	-	17 mm	17 mm
Maximum seat height	-	1.7 mm	-	1.5 mm	1.5 mm
width	-	17 mm	-	17 mm	17 mm

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