LW80603003240AA/SLBMW datasheet, PDF

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LW80603003240AA/SLBMW: DescriptionRISC Microprocessor, 64-Bit, 1600MHz; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，172 Pages; ManufacturerIntel; Websitehttp://www.intel.com/; Environmental Compliance

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LW80603003240AA/SLBMW Overview

RISC Microprocessor, 64-Bit, 1600MHz

LW80603003240AA/SLBMW Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Intel
package instruction	, LGA1248,38X38,50
Reach Compliance Code	compliant
bit size	64
Number of terminals	1248
Package body material	PLASTIC/EPOXY
Encapsulate equivalent code	LGA1248,38X38,50
power supply	1,1.2,1.8,3.3 V
Certification status	Not Qualified
speed	1600 MHz
Maximum slew rate	180000 mA
surface mount	YES
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC
Base Number Matches	1

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Intel

Itanium

Processor 9300

Series and 9500 Series

Intel

Itanium

Processor

Quad-Core 1.86-1.73 GHz

Quad-Core 1.73-1.60 GHz

Quad-Core 1.60-1.46 GHz

Quad-Core 1.46-1.33 GHz

Dual-Core 1.60 GHz Fixed

with 24 MB L3 Cache 9350

with 20 MB L3 Cache 9340

with 20 MB L3 Cache 9330

with 16 MB L3 Cache 9320

Frequency with 10 MB L3 Cache 9310

Eight-Core 2.53 GHz with 32 MB LLC Cache 9560

Four-Core 2.40 GHz with 32 MB LLC Cache 9550

Eight-Core 2.13 GHz with 24 MB LLC Cache 9540

Four-Core 1.73 GHz with 20 MB LLC Cache 9520

Datasheet

November 2012

Reference Number: 322821-002

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,

BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER

AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING

LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY

PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

A “Mission Critical Application” is any application in which failure of the Intel Product could result, directly or indirectly, in personal

injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU

SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS,

OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE

ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH

ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS

NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the

absence or characteristics of any features or instructions marked “reserved” or “undefined”. Intel reserves these for future

definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The

information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to

deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained

by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm%20

C is a two-wire communication bus /protocol developed by Phillips. SMBus is a subset of the I

C bus/protocol developed by Intel.

Implementation of the I

C bus/protocol or the SMBus bus/protocol may require licenses from various entities, including Phillips

Electronics, N.V. and North American Phillips Corporation.

Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor

(VMM) and, for some uses, certain computer system software enabled for it. Functionality, performance or other benefits will vary

depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible

with all operating systems. Please check with your application vendor.

Intel, Itanium, and the Intel logo are trademarks of Intel Corporation in the U. S. and\or other countries.

*Other names and brands may be claimed as the property of others.

Intel

Itanium

Processor 9300 Series and 9500 Series Datasheet

Contents

Introduction

.............................................................................................................. 9

1.1

Overview ........................................................................................................... 9

1.2

Architectural Overview ....................................................................................... 15

1.2.1 Intel

Itanium

Processor 9300 Series Overview ....................................... 15

1.2.2 Intel

Itanium

Processor 9500 Series Overview ....................................... 16

1.3

Processor Feature Comparison ............................................................................ 19

1.4

Processor Abstraction Layer ................................................................................ 20

1.5

Mixing Processors of Different Frequencies and Cache Sizes .................................... 20

1.6

Terminology ..................................................................................................... 20

1.7

State of Data .................................................................................................... 21

1.8

Reference Documents ........................................................................................ 21

Electrical Specifications

........................................................................................... 23

2.1

Intel

QuickPath Interconnect and Intel

Scalable Memory Interconnect

Differential Signaling ......................................................................................... 23

2.2

Signal Groups ................................................................................................... 24

2.3

Reference Clocking Specifications ........................................................................ 26

2.4

Intel

QuickPath Interconnect and Intel

SMI Signaling Specifications ..................... 28

2.4.1 Intel® Itanium® Processor 9300 Series

Intel

QuickPath Interconnect and

Intel

SMI Specifications for 4.8 GT/s ....................................................... 28

2.4.2 Intel® Itanium® Processor 9500 Series Requirements for

Intel

QuickPath Interconnect for 4.8 and 6.4 GT/s .................................... 32

2.4.3 Intel

Itanium

Processor 9500 Series Processor Requirements for

Intel

SMI Specifications for 6.4 GT/s ....................................................... 37

2.5

Processor Absolute Maximum Ratings................................................................... 38

2.5.1 Intel

Itanium

Processor 9300 Series Absolute Maximum Ratings............... 39

2.5.2 Intel

Itanium

Processor 9500 Series Absolute Maximum Ratings............... 39

2.6

Processor DC Specifications ................................................................................ 39

2.6.1 Flexible Motherboard Guidelines for the Intel

Itanium

Processor 9300 Series............................................................................. 40

2.6.2 Flexible Motherboard Guidelines for the Intel

Itanium

Processor 9500 Series............................................................................. 43

2.6.3 Intel

Itanium

Processor 9300 Series Uncore, Core, and Cache Tolerances .. 44

2.6.4 Intel

Itanium

Processor 9500 Series Uncore and Core Tolerances ............. 49

2.6.5 Overshoot and Undershoot Guidelines ....................................................... 52

2.6.6 Signal DC Specifications .......................................................................... 53

2.6.7 Motherboard-Socket Specification for VR Sense Point .................................. 57

2.7

Core and Uncore Voltage Identification ................................................................. 57

2.7.1 Core and Uncore Voltage Identification for the

Intel® Itanium® Processor 9300 Series .................................................... 58

2.7.2 Core and Uncore Voltage Identification for the

Intel

Itanium

Processor 9500 Series ..................................................... 59

2.8

Cache Voltage Identification (Intel

Itanium

Processor 9300 Series only) ............... 62

2.9

RSVD, Unused, and DEBUG Pins .......................................................................... 63

2.10 Mixing Processors.............................................................................................. 64

2.11 Supported Power-up Voltage Sequence ................................................................ 64

2.11.1 Supported Power-up Voltage Sequence for the

Intel® Itanium® Processor 9300 Series .................................................... 66

2.11.2 Supported Power-up Voltage Sequence for the

Intel

Itanium

Processor 9500 Series ..................................................... 67

2.11.3 Power-up Voltage Sequence Timing Requirements ...................................... 68

2.12 Supported Power-down Voltage Sequence ............................................................ 68

2.13 Timing Relationship Between RESET_N and SKTID ................................................. 69

Intel

Itanium

Processor 9300 Series and 9500 Series Datasheet

2.14

Test Access Port (TAP) Connection .......................................................................71

Pin Listing................................................................................................................73

3.1

Processor Package Bottom Pin Assignments...........................................................73

3.1.1 Package Bottom Pin Listing by Pin Name ....................................................73

3.1.2 Pin Listing by Pin Number ........................................................................89

3.2

Processor Package Top Pin Assignments.............................................................. 105

3.2.1 Top-Side J1 Connector Two-Dimensional Table ......................................... 105

3.2.2 Top-Side J2 Connector Two-Dimensional Table ......................................... 108

3.2.3 Top-Side J3 Connector Two-Dimensional Table ......................................... 111

3.2.4 Top-Side J4 Connector Two-Dimensional Table ......................................... 114

Mechanical Specifications

...................................................................................... 119

4.1

Package Mechanical Drawing ............................................................................. 120

4.2

Intel

Itanium

Processor 9300 Series............................................................... 121

4.3

Processor Component Keepout Zones ................................................................. 129

4.4

Package Loading Specifications .......................................................................... 129

4.5

Package Handling Guidelines ............................................................................. 129

4.6

Processor Mass Specifications ............................................................................ 130

4.7

Processor Materials .......................................................................................... 130

4.8

Package Markings ............................................................................................ 130

Thermal Specifications

........................................................................................... 133

5.1

Thermal Features............................................................................................. 133

5.1.1 Digital Thermometer ............................................................................. 134

5.1.2 Thermal Management............................................................................ 135

5.1.3 Thermal Alert ....................................................................................... 136

5.1.4 TCONTROL........................................................................................... 137

5.1.5 Thermal Warning .................................................................................. 137

5.1.6 Thermal Trip ........................................................................................ 137

5.1.7 PROCHOT ............................................................................................ 138

5.1.8 FORCEPR_N Signal Pin........................................................................... 138

5.1.9 Ararat Voltage Regulator Thermal Signals ................................................ 138

5.2

Package Thermal Specifications and Considerations .............................................. 139

5.3

Storage Conditions Specifications....................................................................... 140

System Management Bus Interface

........................................................................ 143

6.1

Introduction .................................................................................................... 143

6.2

SMBus Memory Component............................................................................... 144

6.2.1 Processor Information ROM (PIROM) ....................................................... 144

6.2.2 Scratch EEPROM ................................................................................... 149

6.2.3 PIROM and Scratch EEPROM Supported SMBus Transactions....................... 150

6.3

Memory Component Addressing......................................................................... 150

6.4

PIROM Field Definitions..................................................................................... 152

6.4.1 General ............................................................................................... 152

6.4.2 Processor Data ..................................................................................... 152

6.4.3 Processor Core Data.............................................................................. 152

6.4.4 Processor Uncore Data .......................................................................... 153

6.4.5 Cache Data .......................................................................................... 154

6.4.6 Package Data ....................................................................................... 155

6.4.7 Part Number Data................................................................................. 155

6.4.8 Thermal Reference Data ........................................................................ 155

6.4.9 Feature Data ........................................................................................ 156

6.4.10 Other Data .......................................................................................... 157

6.4.11 Checksums .......................................................................................... 157

Signal Definitions...................................................................................................

159

Intel

Itanium

Processor 9300 Series and 9500 Series Datasheet

LW80603003240AA/SLBMW Related Products

	LW80603003240AA/SLBMW	7205L40TPGI8	7206L12GGB8	CM8063101049806S/SR0SZ	CM8063101049807S/SR0SY
Description	RISC Microprocessor, 64-Bit, 1600MHz	CMOS ASYNCHRONOUS FIFO	CMOS ASYNCHRONOUS FIFO	RISC Microprocessor, 64-Bit, 1730MHz,	RISC Microprocessor, 64-Bit, 2400MHz,
Is it Rohs certified?	conform to	-	-	conform to	conform to
Maker	Intel	-	-	Intel	Intel
package instruction	, LGA1248,38X38,50	-	-	, LGA1248,38X38,50	, LGA1248,38X38,50
Reach Compliance Code	compliant	-	-	compliant	compliant
bit size	64	-	-	64	64
Number of terminals	1248	-	-	1248	1248
Package body material	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY
Encapsulate equivalent code	LGA1248,38X38,50	-	-	LGA1248,38X38,50	LGA1248,38X38,50
power supply	1,1.2,1.8,3.3 V	-	-	1,1.2,1.8,3.3 V	1,1.2,1.8,3.3 V
Certification status	Not Qualified	-	-	Not Qualified	Not Qualified
speed	1600 MHz	-	-	1730 MHz	2400 MHz
Maximum slew rate	180000 mA	-	-	35000 mA	35000 mA
surface mount	YES	-	-	YES	YES
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	-	-	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC

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